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1. 发明授权

US08500968B2 Deplating contacts in an electrochemical plating apparatus 有权
标题翻译：在电化学电镀设备中脱落接触
公开(公告)号：US08500968B2
公开(公告)日：2013-08-06
申请号：US12856357
申请日：2010-08-13
申请人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson , Matthew Herset
发明人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson , Matthew Herset
IPC分类号： C25D17/00
CPC分类号： C25D17/001
摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
摘要翻译：具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。

2. 发明申请

US20120037495A1 DEPLATING CONTACTS IN AN ELECTROCHEMICAL PLATING APPARATUS 有权
标题翻译：在电化学镀膜设备中去除接触
公开(公告)号：US20120037495A1
公开(公告)日：2012-02-16
申请号：US12856357
申请日：2010-08-13
申请人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson
发明人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson
IPC分类号： C25D17/10
CPC分类号： C25D17/001
摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
摘要翻译：具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。

3. 发明授权

US07150816B2 Apparatus and method for deposition of an electrophoretic emulsion 有权
公开(公告)号：US07150816B2
公开(公告)日：2006-12-19
申请号：US10234982
申请日：2002-09-03
申请人： John L. Klocke , Kyle M. Hanson
发明人： John L. Klocke , Kyle M. Hanson
IPC分类号： C25D13/00 , C25D13/04
CPC分类号： G03F7/164 , C25D7/12 , C25D13/00 , C25D13/12 , C25D13/22 , C25D17/001
摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.

4. 发明授权

US08961771B2 Electrolytic process using cation permeable barrier 有权
标题翻译：使用阳离子渗透屏障的电解过程
公开(公告)号：US08961771B2
公开(公告)日：2015-02-24
申请号：US13559494
申请日：2012-07-26
申请人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
发明人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
IPC分类号： C25D7/12 , C25D17/00 , C25D17/02 , C25D21/12
CPC分类号： C25D7/12 , C25D5/00 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/12
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
摘要翻译：描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

5. 发明申请

US20120292194A1 ELECTROLYTIC PROCESS USING CATION PERMEABLE BARRIER 有权
标题翻译：电解工艺使用渗透性阻挡层
公开(公告)号：US20120292194A1
公开(公告)日：2012-11-22
申请号：US13559494
申请日：2012-07-26
申请人： Rajesh Baskaran , Robert W. Batz, JR. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
发明人： Rajesh Baskaran , Robert W. Batz, JR. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
IPC分类号： C25D5/02
CPC分类号： C25D7/12 , C25D5/00 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/12
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
摘要翻译：描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

6. 发明授权

US08236159B2 Electrolytic process using cation permeable barrier 有权
标题翻译：使用阳离子渗透屏障的电解过程
公开(公告)号：US08236159B2
公开(公告)日：2012-08-07
申请号：US11414145
申请日：2006-04-28
申请人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
发明人： Rajesh Baskaran , Robert W. Batz, Jr. , Bioh Kim , Tom L. Ritzdorf , John L. Klocke , Kyle M. Hanson
IPC分类号： C25D7/12 , C25D3/38 , C25F3/04 , C25F3/18
CPC分类号： C25D7/12 , C25D5/00 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/02 , C25D21/12
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
摘要翻译：描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

7. 发明授权

US07585398B2 Chambers, systems, and methods for electrochemically processing microfeature workpieces 有权
公开(公告)号：US07585398B2
公开(公告)日：2009-09-08
申请号：US10861899
申请日：2004-06-03
申请人： Kyle M. Hanson , John L. Klocke
发明人： Kyle M. Hanson , John L. Klocke
IPC分类号： C25D7/12 , C25D17/02
CPC分类号： C25D17/002 , C25D3/02 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/008 , C25F7/00
摘要： Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.

8. 发明授权

US07169280B2 Apparatus and method for deposition of an electrophoretic emulsion 失效
公开(公告)号：US07169280B2
公开(公告)日：2007-01-30
申请号：US10234637
申请日：2002-09-03
申请人： John L. Klocke , Kyle M. Hanson
发明人： John L. Klocke , Kyle M. Hanson
IPC分类号： C25D13/00 , C25D13/04
CPC分类号： G03F7/164 , C25D7/12 , C25D13/00 , C25D13/12 , C25D13/22 , C25D17/001
摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.

9. 发明授权

US06939448B2 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces 有权
公开(公告)号：US06939448B2
公开(公告)日：2005-09-06
申请号：US10409690
申请日：2003-04-07
申请人： Robert W. Batz, Jr. , John M. Pedersen , John L. Klocke , LinLin Chen
发明人： Robert W. Batz, Jr. , John M. Pedersen , John L. Klocke , LinLin Chen
IPC分类号： C25D5/08 , C25D7/12 , C25D17/06 , H01L21/288 , C25D17/00
CPC分类号： C25D17/06 , C25D5/08 , C25D7/123 , C25D17/001 , H01L21/288 , H01L21/2885 , Y10T29/49002
摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.

10. 发明授权

US06911127B2 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces 有权
标题翻译：接触组件，制造接触组件的方法以及具有用于电镀微电子工件的接触组件的电镀机
公开(公告)号：US06911127B2
公开(公告)日：2005-06-28
申请号：US10353325
申请日：2003-01-28
申请人： Robert W. Batz, Jr. , John M. Pedersen , John L. Klocke , LinLin Chen
发明人： Robert W. Batz, Jr. , John M. Pedersen , John L. Klocke , LinLin Chen
IPC分类号： C23C18/16 , A61K35/12 , C23C28/00 , C25D5/08 , C25D7/12 , C25D17/06 , H01L21/288
CPC分类号： H01L21/2885 , A61K35/12 , C12N2500/25 , C12N2500/32 , C12N2500/34 , C12N2500/40 , C12N2501/11 , C12N2501/39 , C12N2501/395 , C12N2506/22 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/06
摘要： Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path. The contact members can comprise electrically conductive biasing elements, such as fingers, that have a contact site and a dielectric coating covering at least a portion of the biasing elements. The contact members can also have a raised feature configured to engage the seed-layer on the workpiece for conducting the current to the seed-layer.
摘要翻译：接触组件，具有接触组件的电镀机以及用于制造微电子工件的接触组件的方法。接触组件可以是湿接触组件或干接触组件。用于电镀系统的接触组件可以包括支撑构件和联接到支撑构件的接触系统。例如，支撑构件可以是环或另一结构，其具有限定开口的内壁，所述开口被构造成允许工件沿着进入路径移动通过支撑构件。在一个实施例中，支撑构件是导电环，其具有通过间隙彼此间隔开的从环环悬垂的多个柱。接触系统可以联接到支撑构件的柱。接触系统可以具有多个接触构件，其相对于支撑构件向内突出到开口中并且相对于进入路径横向地突出。接触构件可以包括具有覆盖至少一部分偏置元件的接触位置和电介质涂层的导电偏置元件，例如手指。接触构件还可以具有被配置为接合工件上的种子层的凸起特征，以将电流传导到种子层。

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