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    • 5. 发明授权
    • Method for RFI/EMI protection of electronic circuitry
    • 电子电路RFI / EMI保护方法
    • US5160807A
    • 1992-11-03
    • US743481
    • 1991-08-08
    • John J. FryGeorge R. Hall, II
    • John J. FryGeorge R. Hall, II
    • H05K9/00
    • H05K9/0033Y10S174/34Y10S174/35
    • An arrangement for providing radio frequency and electromagnetic interference protection to at least part of circuitry mounted on a circuit board comprises alternating slots and bridges which form a boundary between a protected area of the circuit board and an unprotected area of the circuit board. The circuit portions which require protection are mounted in the protected area and are covered by a top cover having fingers which extend through the slots. Connecting lines between the protected and unprotected portions of the circuit portions extend along the bridges between the slots. A bottom cover engages under the protected area and mates to the top cover for providing electromagnetic interference protection for the circuit portions within the protected area.
    • 用于向安装在电路板上的电路的至少一部分提供射频和电磁干扰保护的装置包括形成电路板的保护区域和电路板的未受保护区域之间边界的交替的槽和桥。 需要保护的电路部分安装在保护区域中,并被具有延伸穿过狭槽的指状物的顶盖覆盖。 电路部分的受保护部分和未受保护部分之间的连接线沿着槽之间的桥延伸。 底盖接合在保护区下方并配合到顶盖,为保护区内的电路部分提供电磁干扰保护。
    • 8. 发明授权
    • Glass to metal seal
    • 玻璃到金属密封
    • US4019388A
    • 1977-04-26
    • US665828
    • 1976-03-11
    • George R. Hall, IIJack M. WhiteRoger L. Krechmery
    • George R. Hall, IIJack M. WhiteRoger L. Krechmery
    • G01L9/00G01L9/04
    • G01L9/0054G01L19/0627G01L19/147
    • A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding prevents thermal cracking of the Silicon chip due to the difference in thermal expansion of the Stainless Steel housing and the Silicon chip. The holder assembly includes a Borosilicate glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by a eutectic alloy solder. In assembly, the Nickel-Iron holder is first brazed to the stainless Steel housing at a first temperature greater than the maximum non-destructive temperature of either the chip or the glass tube and the glass tube is then soldered to the Nickel-Iron holder at a lower temperature which will not destroy the chip or the tube holder.
    • 压敏硅芯片通过中间保持器组件间接地连接到电子压力变送器的不锈钢外壳。 这种间接接合防止了由于不锈钢外壳和硅芯片的热膨胀差异导致的硅片的热裂纹。 保持器组件包括一个硼硅酸盐玻璃管,其中硅芯片与其结合,其管通过共晶合金焊料焊接到镍 - 铁合金保持器。 在组装时,镍铁架首先在大于芯片或玻璃管的最大非破坏性温度的第一温度下钎焊到不锈钢外壳,然后将玻璃管焊接到镍铁支架 较低的温度,不会破坏芯片或管座。