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    • 4. 发明申请
    • Methods of Fabricating Substrates
    • 制造基板的方法
    • US20100144150A1
    • 2010-06-10
    • US12328435
    • 2008-12-04
    • Scott SillsGurtej S. SandhuAnton de Villiers
    • Scott SillsGurtej S. SandhuAnton de Villiers
    • H01L21/311
    • H01L21/31138H01L21/0273H01L21/0337H01L21/0338
    • A method of fabricating a substrate includes forming first and second spaced features over a substrate. The first spaced features have elevationally outermost regions which are different in composition from elevationally outermost regions of the second spaced features. The first and second spaced features alternate with one another. Every other first feature is removed from the substrate and pairs of immediately adjacent second features are formed which alternate with individual of remaining of the first features. After such act of removing, the substrate is processed through a mask pattern comprising the pairs of immediately adjacent second features which alternate with individual of the remaining of the first features. Other embodiments are disclosed.
    • 一种制造衬底的方法包括在衬底上形成第一和第二间隔的特征。 第一间隔的特征具有与第二间隔特征的垂直最外区域不同的高度最外的区域。 第一和第二间隔的特征彼此交替。 每个其他第一特征从衬底移除,并且形成直接相邻的第二特征对,其与第一特征的剩余部分的个体交替。 在这样的去除动作之后,通过掩模图案来处理衬底,该掩模图案包括与第一特征剩余部分的个体交替的紧邻的第二特征对。 公开了其他实施例。