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    • 1. 发明授权
    • Process for manufacture of silver-based particles and electrical contact materials
    • 银基颗粒和电接触材料的制造方法
    • US07842274B2
    • 2010-11-30
    • US11394826
    • 2006-03-31
    • Dan GoiaSebastian FritzscheBernd KempfPeter BraumannThierry Charles Simon Vandevelde
    • Dan GoiaSebastian FritzscheBernd KempfPeter BraumannThierry Charles Simon Vandevelde
    • C01G3/02
    • C01G5/00B22F1/0014B22F1/0018B22F9/24B82Y30/00C01P2004/64C01P2006/40H01H1/021H01H1/0233H01H1/0237H01H1/027H01H11/048H01R13/03
    • The invention is directed to a process for manufacture of fine precious metal containing particles, specifically silver-based particles and silver-based contact materials via an intermediate silver(+1)-oxide species.The process comprises in a first step the formation of a thermally instable silver (+1)-oxide species by adding a base to an aqueous silver salt solution comprising an organic dispersing agent. Due to the presence of the organic dispersing agent, the resulting silver (+1)-oxide species is thermally instable, thus the species is decomposing to metallic silver at temperature lower than 100° C.The process optionally may comprise the addition of a powdered compound selected from the group of inorganic oxides, metals, and carbon-based compounds. Furthermore the process may contain additional separating and drying steps.The process is versatile, cost efficient and environmentally friendly and is used for the manufacture of silver-based particles and electrical contact materials. Silver nanoparticles made according to the process are characterized by a narrow particle size distribution. Electrical contact materials manufactured according to the process reveal improved contact welding properties.
    • 本发明涉及通过中间体(1+) - 氧化物物质制造含贵金属微粒,特别是银基颗粒和银基接触材料的方法。 该方法包括在第一步骤中通过向包含有机分散剂的银盐溶液水溶液中加入碱形成热不稳定的银(+1) - 氧化物种类。 由于存在有机分散剂,所得到的(+1)氧化物物质是不稳定的,因此该物质在低于100℃的温度下分解成金属银。该方法任选地可以包括添加粉末状 选自无机氧化物,金属和碳基化合物的化合物。 此外,该方法可以包含另外的分离和干燥步骤。 该方法具有通用性,成本效益和环保性,并用于制造银基颗粒和电接触材料。 根据该方法制备的银纳米颗粒具有窄的粒度分布。 根据该方法制造的电接触材料显示改善的接触焊接性能。