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1. 发明授权

US07791585B2 Method of fabricating flexible display 有权
标题翻译：柔性显示器的制作方法
公开(公告)号：US07791585B2
公开(公告)日：2010-09-07
申请号：US11561068
申请日：2006-11-17
申请人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
发明人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
IPC分类号： G09G3/34
CPC分类号： G02F1/091 , G09F9/375 , Y10T428/24008 , Y10T428/25
摘要： A method of fabricating a flexible display, the method comprising selecting a first flexible sheet and a second flexible sheet; and forming a number of magnetic display elements having magnetically controllable reflectivity between the first flexible sheet and the second flexible sheet. In some embodiments, a display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.
摘要翻译：一种制造柔性显示器的方法，所述方法包括选择第一柔性片和第二柔性片; 以及在所述第一柔性片和所述第二柔性片之间形成具有磁性可控反射率的多个磁性显示元件。在一些实施例中，显示器包括具有磁可控反射率的像素。像素形成在一对柔性非导电片之间。每个磁性可控像素包括位于柔性非导电片之间的柔性环。每个磁性可控像素还包括位于柔性环内的磁性颗粒。磁性颗粒相对于柔性非导电片的位置确定像素的反射率。显示器特别适用于便携式电子设备的使用。

2. 发明授权

US06996899B2 Electronic assembly and a method of constructing an electronic assembly 失效
公开(公告)号：US06996899B2
公开(公告)日：2006-02-14
申请号：US10397890
申请日：2003-03-25
申请人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
发明人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
IPC分类号： H01R9/00
CPC分类号： H01L23/49838 , H01L2224/16 , H05K1/0263 , H05K1/113 , H05K1/162 , H05K3/3436 , H05K2201/09236 , H05K2201/094 , H05K2201/09618 , H05K2201/10734 , H05K2203/0465 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49179
摘要： Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.

3. 发明授权

US06580608B1 Method and apparatus for thermally controlling multiple electronic components 有权
标题翻译：用于热控制多个电子部件的方法和装置
公开(公告)号：US06580608B1
公开(公告)日：2003-06-17
申请号：US10023820
申请日：2001-12-21
申请人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson , Thomas O. Morgan , Roth O. Weston
发明人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson , Thomas O. Morgan , Roth O. Weston
IPC分类号： H05K720
CPC分类号： H01L23/3675 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus to thermally control multiple electronic components, such as field-effect transistors for voltage regulation in processors and chipsets in computers, allow more effective convective cooling by grouping the electronic components in an at least essentially closed loop configuration about a passageway which is open at both ends to permit air flow therethrough. The electronic components form respective side walls of the passageway or are in heat conducting relation with the side walls of a heat sink which forms the passageway. Mounting the electronic components to stand upright off the motherboard allows air to enter below the components and rise up through the passageway producing an increase in air speed and better convective cooling.
摘要翻译：用于热控制多个电子部件的方法和装置，例如用于计算机中的处理器和芯片组中的电压调节的场效应晶体管，通过将电子部件以关于通道的至少基本上闭合的环形结构分组来实现更有效的对流冷却在两端打开以允许空气流过其中。电子部件形成通道的相应侧壁或与形成通道的散热器的侧壁处于热传导关系。将电子元件安装在主板上，使空气进入组件下方并通过通道升起，从而提高空气速度和更好的对流冷却。

4. 发明授权

US07158111B1 Flexible display 有权
标题翻译：灵活显示
公开(公告)号：US07158111B1
公开(公告)日：2007-01-02
申请号：US09539012
申请日：2000-03-30
申请人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
发明人： James D. Jackson , Terrance J. Dishongh , Damion T. Searls
IPC分类号： G09G3/34
CPC分类号： G02F1/091 , G09F9/375 , Y10T428/24008 , Y10T428/25
摘要： A display includes pixels having a magnetically controllable reflectivity. The pixels are formed between a pair of flexible non-conductive sheets. Each of the magnetically controllable pixels includes a flexible ring located between the flexible non-conductive sheets. Each of the magnetically controllable pixels also includes magnetic particles located within the flexible ring. The location of the magnetic particles with respect to the flexible non-conductive sheets determines the reflectivity of the pixel. The display is especially suitable for use in connection with portable electronic devices.
摘要翻译：显示器包括具有磁可控反射率的像素。像素形成在一对柔性非导电片之间。每个磁性可控像素包括位于柔性非导电片之间的柔性环。每个磁性可控像素还包括位于柔性环内的磁性颗粒。磁性颗粒相对于柔性非导电片的位置确定像素的反射率。显示器特别适用于便携式电子设备的使用。

5. 发明授权

US06730860B2 Electronic assembly and a method of constructing an electronic assembly 有权
标题翻译：电子组件和构造电子组件的方法
公开(公告)号：US06730860B2
公开(公告)日：2004-05-04
申请号：US09952653
申请日：2001-09-13
申请人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
发明人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
IPC分类号： H05K111
CPC分类号： H01L23/49838 , H01L2224/16 , H05K1/0263 , H05K1/113 , H05K1/162 , H05K3/3436 , H05K2201/09236 , H05K2201/094 , H05K2201/09618 , H05K2201/10734 , H05K2203/0465 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49179
摘要： Solder bumps are created on a substrate of an electronic assembly having lengths that are longer than the widths. The solder bumps are created by locating solder balls of power or ground connections close to one another so that, upon reflow, the solder balls combine. Signal solder balls however remain separated. Capacitors are created by locating power solder bumps adjacent ground solder bumps and extending parallel to one another.
摘要翻译：在具有比宽度长的长度的电子组件的基板上产生焊接凸块。通过将功率或接地连接的焊球定位成彼此接近来产生焊料凸点，使得在回流时焊料球结合在一起。然而，信号焊球保持分离。电容器是通过定位邻近接地焊料凸块的电源焊料凸点并相互平行延伸而创建的。

6. 发明授权

US06614657B2 Heat sink for cooling an electronic component of a computer 失效
标题翻译：用于冷却计算机电子部件的散热器
公开(公告)号：US06614657B2
公开(公告)日：2003-09-02
申请号：US09931783
申请日：2001-08-16
申请人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
发明人： Damion T. Searls , Terrance J. Dishongh , James D. Jackson
IPC分类号： H05K720
CPC分类号： H05K7/20727 , G06F1/20 , H01L23/3672 , H01L23/3677 , H01L2924/0002 , H01L2924/00
摘要： The heat sink is described which is used to cool an electronic component of a computer. The heat sink is constructed from a metal sheet which is bent so as to have a horizontal thermally conductive plate and four walls extending upwardly from the plate and jointly define an enclosure. Openings are formed in the walls through which air can flow by natural convection.
摘要翻译：描述了用于冷却计算机的电子部件的散热器。散热器由金属片构成，该金属片弯曲成具有水平导热板和从板向上延伸的四个壁并共同限定外壳。开口形成在空气可以通过自然对流流动的壁中。

7. 发明授权

US07638884B2 Thin semiconductor device package 有权
标题翻译：薄型半导体器件封装
公开(公告)号：US07638884B2
公开(公告)日：2009-12-29
申请号：US12348803
申请日：2009-01-05
申请人： James D. Jackson , Damion T. Searls , Yoshihiro Tomita
发明人： James D. Jackson , Damion T. Searls , Yoshihiro Tomita
IPC分类号： H01L29/40 , H01L21/301
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/73 , H01L24/81 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/24101 , H01L2224/24227 , H01L2224/73267 , H01L2224/76155 , H01L2224/81193 , H01L2224/81801 , H01L2224/82102 , H01L2224/92244 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/10253 , H01L2924/15173 , H01L2924/15311 , H01L2924/00
摘要： A thin semiconductor device package, comprising a thin substrate at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate a mold material provided at a surface of the substrate adjacent to the perimeter of the die so that a surface of the mold material is coplanar with a surface of the die, and at least one electrically conductive pathway having at least one first terminal end configured to provide electrical continuity with the conductive element and at least one second terminal end formed at a surface of the mold material, the pathway extending from the first terminal end to the second terminal end.
摘要翻译：一种薄的半导体器件封装，其包括薄衬底，至少一个薄基片，与所述衬底耦合，并且具有比所述衬底的周边尺寸小的周边尺寸，所述模具材料设置在所述衬底的与所述裸片的周边相邻的表面处，模具材料的表面与模具的表面共面，并且至少一个导电路径具有至少一个第一末端，其被配置为提供与导电元件的电连续性，以及形成在该表面上的至少一个第二末端模具材料，该路径从第一终端延伸到第二终端。

8. 发明授权

US07517732B2 Thin semiconductor device package 有权
标题翻译：薄型半导体器件封装
公开(公告)号：US07517732B2
公开(公告)日：2009-04-14
申请号：US11403400
申请日：2006-04-12
申请人： James D. Jackson , Damion T. Searls , Yoshihiro Tomita
发明人： James D. Jackson , Damion T. Searls , Yoshihiro Tomita
IPC分类号： H01L21/50 , H01L29/40
CPC分类号： H01L23/5389 , H01L24/24 , H01L24/73 , H01L24/81 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/24101 , H01L2224/24227 , H01L2224/73267 , H01L2224/76155 , H01L2224/81193 , H01L2224/81801 , H01L2224/82102 , H01L2224/92244 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/10253 , H01L2924/15173 , H01L2924/15311 , H01L2924/00
摘要： A thin semiconductor device package, comprising a thin substrate, at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate, a mold material provided at a surface of the substrate adjacent to the perimeter of the die so that a surface of the mold material is coplanar with a surface of the die, and at least one electrically conductive pathway having at least one first terminal end configured to provide electrical continuity with the conductive element and at least one second terminal end formed at a surface of the mold material, the pathway extending from the first terminal end to the second terminal end.
摘要翻译：一种薄的半导体器件封装，包括薄的衬底，与衬底耦合并且具有小于衬底的周长尺寸的至少一个薄模，在衬底的与模具的周边相邻的表面处提供的模具材料，模具材料的表面与模具的表面共面，并且至少一个导电通路具有至少一个第一末端，其被配置为提供与导电元件的电连续性，以及形成在表面上的至少一个第二末端所述模具材料的所述通道从所述第一端部延伸到所述第二端部。

9. 发明授权

US07495318B2 Apparatus and method for improving AC coupling on circuit boards 有权
标题翻译：改善电路板上交流耦合的装置和方法
公开(公告)号：US07495318B2
公开(公告)日：2009-02-24
申请号：US11120393
申请日：2005-05-02
申请人： Weston Roth , Damion T. Searls , James D. Jackson
发明人： Weston Roth , Damion T. Searls , James D. Jackson
IPC分类号： H01L23/58
CPC分类号： H01L23/642 , H01L2924/0002 , H05K1/0216 , H05K1/162 , H05K3/02 , H05K2201/093 , H05K2201/09663 , H05K2203/0315 , H05K2203/0796 , H05K2203/095 , H05K2203/1142 , H01L2924/00
摘要： The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.
摘要翻译：本发明涉及一种用于改善相邻信号迹线之间以及平面分裂之间的交流耦合的装置和方法以及跨越电路板上的平面分裂的信号。电路板包括相邻的导电装置和插入其间的氧化物装置。氧化物是氧化铜，例如铜或氧化亚铜。在一个实施例中，相邻的导电装置是相邻的电压参考平面，其间插入在导电装置之间。氧化铜填充分流。在另一个实施例中，相邻的导电装置是差分信号迹线。氧化铜填充差分信号迹线之间的间隙。与用作填料的其它常用绝缘材料相比，氧化铜是一种具有增加的介电常数的非导电材料。增加的介电常数增加了电容，进而增加了交流耦合。

10. 发明授权

US06905979B2 Apparatus and method for improving AC coupling on circuit boards 失效
标题翻译：改善电路板上交流耦合的装置和方法
公开(公告)号：US06905979B2
公开(公告)日：2005-06-14
申请号：US10329210
申请日：2002-12-23
申请人： Weston Roth , Damion T. Searls , James D. Jackson
发明人： Weston Roth , Damion T. Searls , James D. Jackson
IPC分类号： H01L23/64 , H05K1/02 , H05K1/16 , H05K3/02 , H01L21/31
CPC分类号： H01L23/642 , H01L2924/0002 , H05K1/0216 , H05K1/162 , H05K3/02 , H05K2201/093 , H05K2201/09663 , H05K2203/0315 , H05K2203/0796 , H05K2203/095 , H05K2203/1142 , H01L2924/00
摘要： The invention relates to an apparatus and method for improving AC coupling between adjacent signal traces and between plane splits and signals spanning plane splits on circuit boards. A circuit board includes adjacent conductive means and an oxide means interposed there between. The oxide means is a copper oxide, e.g., cupric or cuprous oxide. In one embodiment, the adjacent conductive means are adjacent voltage reference planes with a split interposed between the conductive means. The copper oxide fills the split. In another embodiment, the adjacent conductive means are differential signal traces. The copper oxide fills a gap between the differential signal traces. The copper oxide is a non-conductive material with an increased dielectric constant as compared to other common dielectric materials used as fillers. The increased dielectric constant increases capacitance, in turn, increasing AC coupling.
摘要翻译：本发明涉及一种用于改善相邻信号迹线之间以及平面分裂之间的交流耦合的装置和方法以及跨越电路板上的平面分裂的信号。电路板包括相邻的导电装置和插入其间的氧化物装置。氧化物是氧化铜，例如铜或氧化亚铜。在一个实施例中，相邻的导电装置是相邻的电压参考平面，其间插入在导电装置之间。氧化铜填充分流。在另一个实施例中，相邻的导电装置是差分信号迹线。氧化铜填充差分信号迹线之间的间隙。与用作填料的其它常用绝缘材料相比，氧化铜是一种具有增加的介电常数的非导电材料。增加的介电常数增加了电容，进而增加了交流耦合。

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