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    • 4. 发明授权
    • Transparent electrode
    • 透明电极
    • US07948003B2
    • 2011-05-24
    • US12177090
    • 2008-07-21
    • Ken Nakahara
    • Ken Nakahara
    • H01L33/42
    • H01L33/42
    • In order to emit a light from an electrode side, in semiconductor light emitting devices such as LED and the like, and liquid crystal, the electrode is formed of a transparent material so as to transmit a light through the transparent electrode and exit the light. A ZnO, which constitutes a material for the transparent electrode, is subject to erosion by acid and alkali, thus, as the case may cause loss of a reliability of the electrode under the influence of ion-containing moisture. In order to solve such a problem, this invention has as its aim a transparent electrode film provided with stability capable of preventing any degradation under the influence of any ion-containing moisture, while being kept acid-proof and alkali-proof. In order to accomplish the above-mentioned aim, this invention provides a transparent electrode made up of a ZnO as its main material, wherein its surface is covered with a Mg-doped ZnO film.
    • 为了从电极侧发出光,在诸如LED等的半导体发光器件和液晶中,电极由透明材料形成,以便透过透明电极发出光并离开光。 构成透明电极的材料的ZnO被酸碱侵蚀,因此在离子含水分的影响的情况下可能导致电极的可靠性降低。 为了解决这个问题,本发明的目的是提供具有稳定性的透明电极膜,其能够在保持耐酸碱性的同时防止在任何含离子的水分的影响下的任何劣化。 为了实现上述目的,本发明提供一种由ZnO作为其主要材料的透明电极,其表面被掺杂了Mg的ZnO膜覆盖。
    • 8. 发明申请
    • ZnO-BASED SEMICONDUCTOR ELEMENT
    • 基于ZnO的半导体元件
    • US20100270533A1
    • 2010-10-28
    • US12733440
    • 2008-09-05
    • Ken NakaharaHiroyuki YujiMasashi KawasakiAkira OhtomoAtsushi Tsukazaki
    • Ken NakaharaHiroyuki YujiMasashi KawasakiAkira OhtomoAtsushi Tsukazaki
    • H01L29/15H01L29/22
    • H01L33/16H01L21/02403H01L21/02414H01L21/02433H01L21/02554H01L21/02565H01L21/02579H01L21/02609H01L33/0083H01L33/28
    • Provided is a ZnO-based semiconductor device capable of achieving easier conversion into p-type by alleviating the self-compensation effect and by preventing donor impurities from mixing in. The ZnO-based semiconductor device includes a MgxZn1-xO substrate (0≦x≦1) having such a principal surface that: a projection axis obtained by projecting a normal line to the principal surface onto a plane formed by an a-axis and a c-axis of substrate crystal axes is inclined towards the a-axis by an angle of φa degrees; a projection axis obtained by projecting the normal line to the principal surface onto a plane formed by an m-axis and the c-axis of the substrate crystal axes is inclined towards the m-axis by an angle of Φm degrees; the angle Φa satisfies 70≦{90−(180/π)arctan(tan(πΦa/180)/tan(πΦm/180))≦110; and the angle Φm≧1. Accordingly, a ZnO-based semiconductor layer formed on the principal surface can be easily converted into p-type because the donor impurities are prevented from mixing in and the self-compensation effect is alleviated. Thus, the desired ZnO-based semiconductor device can be fabricated.
    • 提供了一种通过减轻自补偿效应并防止供体杂质混入,可以实现更容易地转换成p型的ZnO基半导体器件。ZnO基半导体器件包括Mg x Zn 1-x O衬底(0& nlE; x& 1)具有这样的主表面:使通过将主线垂直于基体晶轴的a轴和c轴所形成的平面投影到由a轴和c轴构成的平面而获得的投影轴向a轴倾斜一定角度 一度; 通过将由主体的法线投影到由m轴形成的平面和基板晶体轴的c轴而获得的投影轴朝向m轴倾斜Φm度的角度; 角度Φa满足70≦̸ {90-(180 /&pgr;)arctan(tan(&pgr;Φa/ 180)/ tan(&pgr;Φm/ 180))& 角度Φm≥1。 因此,由于防止供体杂质混入,因此能够容易地将形成在主面上的ZnO系半导体层变为p型,从而可以缓和自补偿效果。 因此,可以制造所需的ZnO基半导体器件。
    • 9. 发明申请
    • Nitride Semiconductor Light Emitting Element
    • 氮化物半导体发光元件
    • US20100224892A1
    • 2010-09-09
    • US12223172
    • 2007-01-23
    • Ken Nakahara
    • Ken Nakahara
    • H01L33/46
    • H01L33/10H01L33/32H01L33/405H01L33/44
    • Provided is a nitride semiconductor light emitting element that has improved light extraction efficiency and a wide irradiation angle of outgoing light irrespective of the reflectance of a metal used for an electrode. An n side anti-reflection layer 2 and a p side Bragg reflection layer 4 are formed so as to sandwich an MQW active layer 3 that serves as a light emitting region, and the nitride semiconductor light emitting element has a double hetero structure. On top of the n side anti-reflection layer 2, an n electrode 1 is formed. Meanwhile, at the lower side of the p side Bragg reflection layer 4, a p electrode 5, a reflection film 7, and a pad electrode 8 are formed, and the pad electrode is bonded to a support substrate 10 with a conductive bonding layer 9 interposed in between. Both the n side anti-reflection layer 2 and the p side Bragg reflection layer 4 also serve as contact layers. The n side anti-reflection layer 2 is disposed on the light-extracting-direction side while the p side Bragg reflection layer 4 is disposed on the opposite side to the light-extracting-direction side. Consequently, the light extraction efficiency is improved.
    • 提供了与用于电极的金属的反射率无关的具有提高的光提取效率和出射光的宽的照射角的氮化物半导体发光元件。 形成n侧防反射层2和p侧布拉格反射层4,以夹持用作发光区域的MQW有源层3,并且氮化物半导体发光元件具有双异质结构。 在n侧防反射层2的顶部,形成n电极1。 同时,在p侧布拉格反射层4的下侧形成有p电极5,反射膜7和焊盘电极8,并且将焊盘电极与导电接合层9插入的支撑基板10接合 之间。 n侧防反射层2和p侧布拉格反射层4也用作接触层。 n侧防反射层2设置在取光方向侧,而p侧布拉格反射层4设置在与光提取方向相反的一侧。 因此,光提取效率提高。
    • 10. 发明授权
    • Method for manufacturing nitride semiconductor device
    • 氮化物半导体器件的制造方法
    • US07718450B2
    • 2010-05-18
    • US11920043
    • 2006-05-08
    • Ken Nakahara
    • Ken Nakahara
    • H01L21/00
    • H01L33/0095H01L21/0237H01L21/0242H01L21/02458H01L21/02507H01L21/0254H01L21/02576H01L21/02579H01L21/0262H01L21/268H01L29/66462H01L33/305
    • There is provided a method for manufacturing a nitride semiconductor device which has a p-type nitride semiconductor layer having a high carrier concentration (low resistance) by activating an acceptor without raising a problem of forming nitrogen vacancies which are generated when a high temperature annealing is carried out over an extended time. A semiconductor lamination portion (6) made of nitride semiconductor is formed on a substrate (1) so as to form a light emitting layer, and irradiated by a laser beam having a wavelength λ of λ=h·c/E or less (E is energy capable of separating off the bonding between Mg and H) from the front surface side of the semiconductor lamination portion. Then, a heat treatment is carried out at a temperature of 300 to 400° C. And, similarly to a process for normal nitride semiconductor LED, a light transmitting conductive layer (7) is provided, an n-side electrode (9) is formed on an n-type layer (3) exposed by removing a part of the semiconductor lamination portion by etching, and a p-side electrode (8) is formed on a surface of the light transmitting conductive layer, thereby a LED is obtained.
    • 提供了一种通过激活受主而具有具有高载流子浓度(低电阻)的p型氮化物半导体层的氮化物半导体器件的制造方法,而不会产生当高温退火时产生的形成氮空位的问题 进行了漫长的时间。 在基板(1)上形成由氮化物半导体构成的半导体层叠部(6),形成发光层,用波长λ为λ= h·c / E以下的激光(E 是能够分离Mg和H)之间的结合的能量与半导体层叠部分的前表面侧。 然后,在300〜400℃的温度下进行热处理。与普通氮化物半导体LED的工序相同,设置透光导电层(7),n侧电极(9)为 形成在通过蚀刻去除一部分半导体层叠部分而露出的n型层(3)上,并且在透光导电层的表面上形成p侧电极(8),由此获得LED。