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    • 1. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20080042214A1
    • 2008-02-21
    • US11892053
    • 2007-08-20
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • H01L27/092H01L29/78
    • H01L21/76895H01L21/823475H01L27/0207
    • A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
    • 半导体器件包括半导体衬底; 扩散区,其形成在半导体衬底中并用作用于形成MIS晶体管的区域; 围绕扩散区域的元件隔离区域; 形成在扩散区域和元件隔离区域两侧的至少一个栅极导体膜包括位于扩散区域上的栅极电极部分和位于元件隔离区域上的栅极互连部件,并且栅极长度具有恒定的尺寸 方向; 以及覆盖所述栅电极的层间绝缘膜。 半导体器件还包括通过层间绝缘膜的栅极接触,连接到栅极互连部分,并且具有大于栅极互连部分的栅极长度方向的尺寸。
    • 2. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07279727B2
    • 2007-10-09
    • US11148208
    • 2005-06-09
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • H01L27/10
    • H01L21/76895H01L21/823475H01L27/0207
    • A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
    • 半导体器件包括半导体衬底; 扩散区,其形成在半导体衬底中并用作用于形成MIS晶体管的区域; 围绕扩散区域的元件隔离区域; 形成在扩散区域和元件隔离区域两侧的至少一个栅极导体膜包括位于扩散区域上的栅极电极部分和位于元件隔离区域上的栅极互连部件,并且栅极长度具有恒定的尺寸 方向; 以及覆盖所述栅电极的层间绝缘膜。 半导体器件还包括通过层间绝缘膜的栅极接触,连接到栅极互连部分,并且具有大于栅极互连部分的栅极长度方向的尺寸。
    • 3. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20060017070A1
    • 2006-01-26
    • US11148208
    • 2005-06-09
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • H01L29/76
    • H01L21/76895H01L21/823475H01L27/0207
    • A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
    • 半导体器件包括半导体衬底; 扩散区,其形成在半导体衬底中并用作用于形成MIS晶体管的区域; 围绕扩散区域的元件隔离区域; 形成在扩散区域和元件隔离区域两侧的至少一个栅极导体膜包括位于扩散区域上的栅极电极部分和位于元件隔离区域上的栅极互连部件,并且栅极长度具有恒定的尺寸 方向; 以及覆盖所述栅电极的层间绝缘膜。 半导体器件还包括通过层间绝缘膜的栅极接触,连接到栅极互连部分,并且具有大于栅极互连部分的栅极长度方向的尺寸。
    • 4. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07709900B2
    • 2010-05-04
    • US11892053
    • 2007-08-20
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • Daisaku IkomaAtsuhiro KajiyaKatsuhiro OotaniKyoji Yamashita
    • H01L23/62
    • H01L21/76895H01L21/823475H01L27/0207
    • A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
    • 半导体器件包括半导体衬底; 扩散区,其形成在半导体衬底中并用作用于形成MIS晶体管的区域; 围绕扩散区域的元件隔离区域; 形成在扩散区域和元件隔离区域两侧的至少一个栅极导体膜包括位于扩散区域上的栅极电极部分和位于元件隔离区域上的栅极互连部件,并且栅极长度具有恒定的尺寸 方向; 以及覆盖所述栅电极的层间绝缘膜。 半导体器件还包括通过层间绝缘膜的栅极接触,连接到栅极互连部分,并且具有大于栅极互连部分的栅极长度方向的尺寸。