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1. 发明申请

US20090057800A1 SMALL-SIZE MODULE 审中-公开
标题翻译：小尺寸模块
公开(公告)号：US20090057800A1
公开(公告)日：2009-03-05
申请号：US12200733
申请日：2008-08-28
申请人： Daigo Suzuki , Makoto Aoki
发明人： Daigo Suzuki , Makoto Aoki
IPC分类号： H01L31/02
CPC分类号： H01L23/49833 , H01L2924/0002 , H05K1/141 , H05K1/144 , H05K1/182 , H05K2201/049 , H05K2201/096 , H05K2201/10515 , H05K2201/10689 , H01L2924/00
摘要： According to one embodiment, a small-size module an IC chip having leads provided on at least two sides of the IC chip, a circuit substrate having a component mounting face, plural pairs of auxiliary substrates which are disposed between the component mounting face of the circuit substrate and the IC chip so as to nip the leads extending from each of the two sides and mount the IC chip on the component mounting face of the circuit substrate, and a through conductor which is provided in at least one of the pair of the auxiliary substrates and bonded conductively to the nipped leads to connect the leads to the circuit substrate.
摘要翻译：根据一个实施例，一种小尺寸模块，具有设置在IC芯片的至少两侧上的引线的IC芯片，具有元件安装面的电路基板，多对辅助基板，设置在该芯片的元件安装面之间电路基板和IC芯片，以夹持从两侧各自延伸的引线，并将IC芯片安装在电路基板的部件安装面上，以及贯通导体，其设置在所述一对辅助基板并导电地粘合到被夹持的引线以将引线连接到电路基板。

2. 发明授权

US08616727B2 Bulb-type LED lamp having a widened luminous distribution via a fastened waveguide 失效
标题翻译：通过紧固波导具有加宽的发光分布的灯泡式LED灯
公开(公告)号：US08616727B2
公开(公告)日：2013-12-31
申请号：US13416951
申请日：2012-03-09
申请人： Takeshi Hisayasu , Daigo Suzuki
发明人： Takeshi Hisayasu , Daigo Suzuki
IPC分类号： F21V8/00
CPC分类号： F21V17/164 , F21K9/232 , F21K9/238 , F21K9/61 , F21V23/006 , F21V29/773 , F21Y2103/33 , F21Y2115/10
摘要： According to one embodiment, an LED lamp includes an LED module and a light guide. The LED module includes a plurality of LEDs annularly arranged and mounted on a front surface of a board, and an opening provided in the board at an inside surrounded by the LEDs. The light guide is engaged and fastened to the opening from the front surface side of the board. The light guide guides part of light emitted by the LEDs, and emits the light guided from the front surface side to a rear surface side over an outer edge part of the board.
摘要翻译：根据一个实施例，LED灯包括LED模块和光导。 LED模块包括环形布置并安装在板的前表面上的多个LED，以及设置在由LED包围的内部的板中的开口。导光板从板的表面侧接合并固定到开口。光引导件引导由LED发射的光的一部分，并且将从表面侧引导的光发射到板的外边缘部分的后表面侧。

3. 发明申请

US20120212959A1 LIGHTING DEVICE 审中-公开
标题翻译：照明设备
公开(公告)号：US20120212959A1
公开(公告)日：2012-08-23
申请号：US13397036
申请日：2012-02-15
申请人： Michinobu INOUE , Izuru Komatsu , Yasuhide Okada , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama
发明人： Michinobu INOUE , Izuru Komatsu , Yasuhide Okada , Daigo Suzuki , Kumiko Ioka , Kazuki Tateyama
IPC分类号： F21V3/00 , F21V7/00 , F21V29/00
CPC分类号： F21V3/00 , F21K9/232 , F21K9/64 , F21V3/061 , F21V3/062 , F21V29/87 , F21V29/89 , F21Y2105/10 , F21Y2115/10
摘要： According to one embodiment, a lighting device includes a body section, a light source, a globe, and a heat transfer section. The light source is provided on one end portion of the body section. The light source includes a light emitting element. The globe is provided so as to cover the light source. The heat transfer section in thermal contacts with at least one of an inner surface of the globe and a heat dissipation surface on the end portion side of the body section.
摘要翻译：根据一个实施例，照明装置包括主体部分，光源，球体和传热部分。光源设置在主体部分的一个端部上。光源包括发光元件。提供球体以覆盖光源。与球体的内表面中的至少一个热敏接触的传热部和主体部的端部侧的散热面。

4. 发明授权

US08134841B2 Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment 失效
标题翻译：印刷电路板，印刷电路板的制造方法以及电子设备
公开(公告)号：US08134841B2
公开(公告)日：2012-03-13
申请号：US11959232
申请日：2007-12-18
申请人： Daigo Suzuki , Minoru Takizawa , Nobuhiro Yamamoto , Hidenori Tanaka
发明人： Daigo Suzuki , Minoru Takizawa , Nobuhiro Yamamoto , Hidenori Tanaka
IPC分类号： H05K1/18
CPC分类号： H05K1/186 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L2224/04105 , H01L2224/12105 , H01L2224/13025 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/16235 , H01L2224/17181 , H01L2224/73259 , H01L2224/92224 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/15313 , H01L2924/19043 , H05K1/113 , H05K3/4611 , H05K3/4641 , H05K2201/0305 , H05K2201/09509 , H05K2201/10515 , H05K2201/1053 , H05K2201/10674 , H05K2201/2036 , Y10T29/49126 , H01L2224/05599
摘要： According to one embodiment, there is provided a printed-wiring board, includes a first base member including a component mounting face, a first electronic component with a through-electrode mounted on the component mounting face, a second base member stacked on the first base member via an insulating layer covering the first electronic component, a hole part provided in the second base member and communicating with the through-electrode of the first electronic component, and a second electronic component mounted on the second base member and circuit-connected directly to the through-electrode via the hole part.
摘要翻译：根据一个实施例，提供了一种印刷电路板，包括：第一基座构件，包括部件安装面;第一电子部件，其具有安装在部件安装面上的通孔;第二基座部件，堆叠在第一基座构件，其经由覆盖所述第一电子部件的绝缘层，设置在所述第二基座构件中并与所述第一电子部件的通孔连通的孔部，以及安装在所述第二基座构件上的电路部件，通孔通过孔部分。

5. 发明申请

US20110188215A1 Electronic Device and Circuit Board 有权
标题翻译：电子设备和电路板
公开(公告)号：US20110188215A1
公开(公告)日：2011-08-04
申请号：US12905843
申请日：2010-10-15
申请人： Daigo Suzuki
发明人： Daigo Suzuki
IPC分类号： H05K5/00 , H05K1/00
CPC分类号： H05K1/00 , H05K5/00
摘要： According to one embodiment, an electronic device includes a circuit board housed in a housing. The circuit board further includes a conductive layer, an insulating layer and a signal line. The conductive layer includes a base portion including a surface, a plurality of first projecting portions formed integrally with the base portion and extending in parallel with each other on the surface of the base portion, and a plurality of second projecting portions formed integrally with the base portion and extending in parallel with each other to cross the plurality of first projecting portions. The insulating layer is stacked on the conductive layer to cover the surface of the base portion, and the signal line is stacked on the insulating layer and extends in a direction crossing directions in which the first and second projecting portions extend.
摘要翻译：根据一个实施例，电子设备包括容纳在壳体中的电路板。电路板还包括导电层，绝缘层和信号线。所述导电层包括基部，所述基部包括表面，多个第一突出部分与所述基部一体地形成并且在所述基部的表面上彼此平行地延伸;以及多个第二突出部分，其与所述基部并且彼此平行地延伸以跨越多个第一突出部分。绝缘层层叠在导电层上以覆盖基部的表面，并且信号线堆叠在绝缘层上并沿与第一和第二突出部分延伸的方向交叉的方向延伸。

6. 发明授权

US07402759B2 Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board 失效
标题翻译：印刷电路板，磁盘装置以及印刷电路板的制造方法
公开(公告)号：US07402759B2
公开(公告)日：2008-07-22
申请号：US11123154
申请日：2005-05-06
申请人： Daigo Suzuki
发明人： Daigo Suzuki
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： G11B33/122 , H05K1/0366 , H05K1/117 , H05K1/118 , H05K3/4644 , H05K3/4691 , H05K2201/0278 , H05K2201/09481 , Y10T29/49126 , Y10T29/49155
摘要： An insulating substrate includes a first area where a semiconductor device is disposed, a second area where a wiring electrically connecting to the semiconductor device is disposed, and a third area where a terminal electrically connecting to the wiring is disposed. A first wiring is disposed on a main surface of the insulating substrate in the second area and connects to the second wiring disposed in the first area and the terminal disposed in the third area through first and second interlayer connecting portions. With this configuration, the second wiring need not be disposed in the second area, so that flexibility in the second area used as a connecting portion increases.
摘要翻译：绝缘基板包括设置有半导体器件的第一区域，配置有电连接到半导体器件的布线的第二区域和设置有电连接到布线的端子的第三区域。第一布线布置在第二区域中的绝缘基板的主表面上，并且通过第一和第二层间连接部分连接到设置在第一区域中的第二布线和设置在第三区域中的端子。利用这种构造，第二布线不需要设置在第二区域中，所以用作连接部分的第二区域的柔性增加。

7. 发明申请

US20050263319A1 Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board 失效
标题翻译：印刷电路板，磁盘装置以及印刷电路板的制造方法
公开(公告)号：US20050263319A1
公开(公告)日：2005-12-01
申请号：US11123154
申请日：2005-05-06
申请人： Daigo Suzuki
发明人： Daigo Suzuki
IPC分类号： H05K3/46 , G11B33/12 , H05K1/03 , H05K1/11 , H05K3/00 , H05K7/06
CPC分类号： G11B33/122 , H05K1/0366 , H05K1/117 , H05K1/118 , H05K3/4644 , H05K3/4691 , H05K2201/0278 , H05K2201/09481 , Y10T29/49126 , Y10T29/49155
摘要： An insulating substrate includes a first area where a semiconductor device is disposed, a second area where a wiring electrically connecting to the semiconductor device is disposed, and a third area where a terminal electrically connecting to the wiring is disposed. A first wiring is disposed on a main surface of the insulating substrate in the second area and connects to the second wiring disposed in the first area and the terminal disposed in the third area through first and second interlayer connecting portions. With this configuration, the second wiring need not be disposed in the second area, so that flexibility in the second area used as a connecting portion increases.
摘要翻译：绝缘基板包括设置有半导体器件的第一区域，配置有电连接到半导体器件的布线的第二区域和设置有电连接到布线的端子的第三区域。第一布线布置在第二区域中的绝缘基板的主表面上，并且通过第一和第二层间连接部分连接到设置在第一区域中的第二布线和设置在第三区域中的端子。利用这种构造，第二布线不需要设置在第二区域中，所以用作连接部分的第二区域的柔性增加。

8. 发明授权

US08331104B2 Electronic device and circuit board 有权
标题翻译：电子设备和电路板
公开(公告)号：US08331104B2
公开(公告)日：2012-12-11
申请号：US12905843
申请日：2010-10-15
申请人： Daigo Suzuki
发明人： Daigo Suzuki
IPC分类号： H05K7/00
CPC分类号： H05K1/00 , H05K5/00
摘要： According to one embodiment, an electronic device includes a circuit board housed in a housing. The circuit board further includes a conductive layer, an insulating layer and a signal line. The conductive layer includes a base portion including a surface, a plurality of first projecting portions formed integrally with the base portion and extending in parallel with each other on the surface of the base portion, and a plurality of second projecting portions formed integrally with the base portion and extending in parallel with each other to cross the plurality of first projecting portions. The insulating layer is stacked on the conductive layer to cover the surface of the base portion, and the signal line is stacked on the insulating layer and extends in a direction crossing directions in which the first and second projecting portions extend.
摘要翻译：根据一个实施例，电子设备包括容纳在壳体中的电路板。电路板还包括导电层，绝缘层和信号线。所述导电层包括基部，所述基部包括表面，多个第一突出部分与所述基部一体地形成并且在所述基部的表面上彼此平行地延伸;以及多个第二突出部分，其与所述基部并且彼此平行地延伸以跨越多个第一突出部分。绝缘层层叠在导电层上以覆盖基部的表面，并且信号线堆叠在绝缘层上并沿与第一和第二突出部分延伸的方向交叉的方向延伸。

9. 发明申请

US20120049737A1 SELF-BALLASTED LAMP AND LIGHTING FIXTURE 有权
标题翻译：自封灯和照明灯具
公开(公告)号：US20120049737A1
公开(公告)日：2012-03-01
申请号：US13222837
申请日：2011-08-31
申请人： Toshitake KITAGAWA , Makoto Sakai , Daigo Suzuki , Michinobu Inoue
发明人： Toshitake KITAGAWA , Makoto Sakai , Daigo Suzuki , Michinobu Inoue
IPC分类号： H01J7/44
CPC分类号： F21V17/101 , F21K9/232 , F21K9/238 , F21K9/60 , F21V3/00 , F21V5/04 , F21V23/006 , F21Y2115/10
摘要： A self-ballasted lamp includes a base body, a light source unit attached to one side of the base body, a lens attached to the light source unit, a cap provided on the other side of the base body and a lighting circuit arranged in the space provided by the base body and the cap. The light source unit includes a light source constituted by semiconductor light emitting elements. The lens has a lens body facing the light source and an attachment leg for attaching the lens body to the light source unit. A claw portion to be secured to the light source unit can be provided on the attachment leg.
摘要翻译：一种自镇流灯包括基体，安装在基体一侧的光源单元，安装在光源单元上的透镜，设置在基体另一侧的盖和布置在基体中的点亮电路由基体和盖提供的空间。光源单元包括由半导体发光元件构成的光源。透镜具有面向光源的透镜体和用于将透镜体附接到光源单元的附接腿。可以在附接腿上设置要固定到光源单元的爪部。

10. 发明授权

US07872874B2 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device 失效
标题翻译：具有内置元件的印刷电路板，具有内置元件的印刷电路板的制造方法和电子设备
公开(公告)号：US07872874B2
公开(公告)日：2011-01-18
申请号：US11701816
申请日：2007-02-01
申请人： Jun Karasawa , Daigo Suzuki , Hidenori Tanaka
发明人： Jun Karasawa , Daigo Suzuki , Hidenori Tanaka
IPC分类号： H05K7/10 , H05K7/12
CPC分类号： H05K1/111 , H05K3/284 , H05K3/3421 , H05K3/3442 , H05K2201/09381 , H05K2201/09663 , H05K2201/10636 , H05K2201/10689 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49147
摘要： According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.
摘要翻译：根据一个实施例，提供了一种印刷电路板，其具有将电子部件安装在基材的图案形成表面上的部件。在印刷电路板中，在图案形成表面上形成用于将安装电子部件形成的空隙引导到外部的引导路径。

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