专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060243958A1 Microelectronic package interconnect and method of fabrication thereof 有权
公开(公告)号：US20060243958A1
公开(公告)日：2006-11-02
申请号：US11116537
申请日：2005-04-28
申请人： Daewoong Suh , Amram Eitan , Yongki Min
发明人： Daewoong Suh , Amram Eitan , Yongki Min
IPC分类号： H01L29/06 , H01L29/12 , H01L21/00
CPC分类号： H01L23/49827 , B82Y10/00 , C09J7/22 , C09J9/02 , C09J2201/128 , C09J2201/602 , C09J2203/326 , H01L23/49877 , H01L23/5384 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05676 , H01L2224/0568 , H01L2224/11452 , H01L2224/1182 , H01L2224/1191 , H01L2224/13022 , H01L2224/13193 , H01L2224/13562 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13666 , H01L2224/16145 , H01L2224/27003 , H01L2224/271 , H01L2224/29 , H01L2224/29076 , H01L2224/29078 , H01L2224/29101 , H01L2224/2919 , H01L2224/29193 , H01L2224/2929 , H01L2224/29339 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83203 , H01L2225/06527 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/323 , H05K2201/026 , Y10S977/848 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/01015 , H01L2924/01031 , H01L2924/01033 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.

2. 发明授权

US07402909B2 Microelectronic package interconnect and method of fabrication thereof 有权
标题翻译：微电子封装互连及其制造方法
公开(公告)号：US07402909B2
公开(公告)日：2008-07-22
申请号：US11116537
申请日：2005-04-28
申请人： Daewoong Suh , Amram Eitan , Yongki Min
发明人： Daewoong Suh , Amram Eitan , Yongki Min
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/49827 , B82Y10/00 , C09J7/22 , C09J9/02 , C09J2201/128 , C09J2201/602 , C09J2203/326 , H01L23/49877 , H01L23/5384 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05676 , H01L2224/0568 , H01L2224/11452 , H01L2224/1182 , H01L2224/1191 , H01L2224/13022 , H01L2224/13193 , H01L2224/13562 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13666 , H01L2224/16145 , H01L2224/27003 , H01L2224/271 , H01L2224/29 , H01L2224/29076 , H01L2224/29078 , H01L2224/29101 , H01L2224/2919 , H01L2224/29193 , H01L2224/2929 , H01L2224/29339 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83203 , H01L2225/06527 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/323 , H05K2201/026 , Y10S977/848 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/01015 , H01L2924/01031 , H01L2924/01033 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.
摘要翻译：提供互连和互连的方法来连接集成电路的第一部件和第二部件。互连包括多个碳纳米管（CNT），其在第一部件和第二部件之间提供导电路径。互连还包括钝化层以填充相邻CNT之间的间隙。提供制造各向异性导电膜（ACF）和ACF的方法。 ACF包括多个CNT，其在ACF的第一侧和ACF的第二侧之间提供导电路径。 ACF的侧面还可以包括导电的可固化粘合剂层。在一个实施方案中，导电可固化粘合剂层可以并入B级可交联聚合物和银颗粒。

3. 发明授权

US07727814B2 Microelectronic package interconnect and method of fabrication thereof 失效
标题翻译：微电子封装互连及其制造方法
公开(公告)号：US07727814B2
公开(公告)日：2010-06-01
申请号：US12218161
申请日：2008-07-10
申请人： Daewoong Suh , Amram Eitan , Yongki Min
发明人： Daewoong Suh , Amram Eitan , Yongki Min
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H01L23/49827 , B82Y10/00 , C09J7/22 , C09J9/02 , C09J2201/128 , C09J2201/602 , C09J2203/326 , H01L23/49877 , H01L23/5384 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05676 , H01L2224/0568 , H01L2224/11452 , H01L2224/1182 , H01L2224/1191 , H01L2224/13022 , H01L2224/13193 , H01L2224/13562 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13666 , H01L2224/16145 , H01L2224/27003 , H01L2224/271 , H01L2224/29 , H01L2224/29076 , H01L2224/29078 , H01L2224/29101 , H01L2224/2919 , H01L2224/29193 , H01L2224/2929 , H01L2224/29339 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83203 , H01L2225/06527 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/323 , H05K2201/026 , Y10S977/848 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/01015 , H01L2924/01031 , H01L2924/01033 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.
摘要翻译：提供互连和互连的方法来连接集成电路的第一部件和第二部件。互连包括多个碳纳米管（CNT），其在第一部件和第二部件之间提供导电路径。互连还包括钝化层以填充相邻CNT之间的间隙。提供制造各向异性导电膜（ACF）和ACF的方法。 ACF包括多个CNT，其在ACF的第一侧和ACF的第二侧之间提供导电路径。 ACF的侧面还可以包括导电的可固化粘合剂层。在一个实施方案中，导电可固化粘合剂层可以并入B级可交联聚合物和银颗粒。

4. 发明申请

US20070235500A1 ROOM TEMPERATURE JOINING PROCESS WITH PIEZOELECTRIC CERAMIC-ACTIVATED REACTIVE MULTILAYER FOIL 审中-公开
标题翻译：压电陶瓷活化多层膜的室温加工工艺
公开(公告)号：US20070235500A1
公开(公告)日：2007-10-11
申请号：US11278365
申请日：2006-03-31
申请人： Daewoong Suh , Yongki Min
发明人： Daewoong Suh , Yongki Min
IPC分类号： A47J36/02
CPC分类号： B23K1/0006 , B23K20/165
摘要： Apparatus comprising a multilayered reactive foil preform including alternating layers of first and second materials deposited on foils. The layers also include piezoelectric ceramic particles to provide an electrical stimulus when pressure is applied to activate an exothermic reaction between the first and second materials.
摘要翻译：包括多层反应箔预制件的装置，其包括沉积在箔上的第一和第二材料的交替层。这些层还包括压电陶瓷颗粒，以在施加压力以激活第一和第二材料之间的放热反应时提供电刺激。

5. 发明申请

US20100177475A1 Carbon nanotube coated capacitor electrodes 有权
标题翻译：碳纳米管涂层电容器电极
公开(公告)号：US20100177475A1
公开(公告)日：2010-07-15
申请号：US12661568
申请日：2010-03-19
申请人： Yongki Min , Daewoong Suh
发明人： Yongki Min , Daewoong Suh
IPC分类号： H01G4/008 , G06F1/16
CPC分类号： H01G4/005 , H01G4/008 , H01G4/33 , H01L28/40
摘要： Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacitor dielectric between the first and second electrodes. At least one of the first and second electrodes includes a metal layer having carbon nanotubes coupled thereto. In one aspect of certain embodiments, the carbon nanotubes are at least partially coated with an electrically conductive material. In another aspect of certain embodiments, the substrate comprises an organic substrate and the capacitor dielectric comprises a polymer material. Other embodiments are described and claimed.
摘要翻译：描述了其形成装置和方法，包括含有电容器的电子器件。在一个实施例中，器件包括衬底，并且在衬底上形成电容器。电容器包括第一和第二电极以及在第一和第二电极之间的电容器电介质。第一和第二电极中的至少一个包括具有与其结合的碳纳米管的金属层。在某些实施方案的一个方面，碳纳米管至少部分地涂覆有导电材料。在某些实施方案的另一方面，基底包括有机基底，电容器电介质包括聚合物材料。描述和要求保护其他实施例。

6. 发明申请

US20080239620A1 CARBON NANOTUBE COATED CAPACITOR ELECTRODES 有权
标题翻译：碳纳米管涂层电容器电极
公开(公告)号：US20080239620A1
公开(公告)日：2008-10-02
申请号：US11694909
申请日：2007-03-30
申请人： Yongki Min , Daewoong Suh
发明人： Yongki Min , Daewoong Suh
IPC分类号： H01G4/005 , H01G4/00
CPC分类号： H01G4/005 , H01G4/008 , H01G4/33 , H01L28/40
摘要： Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacitor dielectric between the first and second electrodes. At least one of the first and second electrodes includes a metal layer having carbon nanotubes coupled thereto. In one aspect of certain embodiments, the carbon nanotubes are at least partially coated with an electrically conductive material. In another aspect of certain embodiments, the substrate comprises an organic substrate and the capacitor dielectric comprises a polymer material. Other embodiments are described and claimed.
摘要翻译：描述了其形成装置和方法，包括含有电容器的电子器件。在一个实施例中，器件包括衬底，并且在衬底上形成电容器。电容器包括第一和第二电极以及在第一和第二电极之间的电容器电介质。第一和第二电极中的至少一个包括具有与其结合的碳纳米管的金属层。在某些实施方案的一个方面，碳纳米管至少部分地涂覆有导电材料。在某些实施方案的另一方面，基底包括有机基底，电容器电介质包括聚合物材料。描述和要求保护其他实施例。

7. 发明授权

US07710709B2 Carbon nanotube coated capacitor electrodes 有权
公开(公告)号：US07710709B2
公开(公告)日：2010-05-04
申请号：US11694909
申请日：2007-03-30
申请人： Yongki Min , Daewoong Suh
发明人： Yongki Min , Daewoong Suh
IPC分类号： H01G4/228
CPC分类号： H01G4/005 , H01G4/008 , H01G4/33 , H01L28/40
摘要： Devices and methods for their formation, including electronic devices containing capacitors, are described. In one embodiment, a device includes a substrate and a capacitor is formed on the substrate. The capacitor includes first and second electrodes and a capacitor dielectric between the first and second electrodes. At least one of the first and second electrodes includes a metal layer having carbon nanotubes coupled thereto. In one aspect of certain embodiments, the carbon nanotubes are at least partially coated with an electrically conductive material. In another aspect of certain embodiments, the substrate comprises an organic substrate and the capacitor dielectric comprises a polymer material. Other embodiments are described and claimed.

8. 发明授权

US07705458B2 Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same 有权
标题翻译：散装金属玻璃焊料，泡沫块状金属玻璃焊料，芯片封装中的泡沫焊接焊盘，组装方法和含有其的体系
公开(公告)号：US07705458B2
公开(公告)日：2010-04-27
申请号：US11425353
申请日：2006-06-20
申请人： Daewoong Suh , Yongki Min
发明人： Daewoong Suh , Yongki Min
IPC分类号： H01L23/488
CPC分类号： H01L24/10 , C22C45/10 , H01L23/49816 , H01L24/13 , H01L24/81 , H01L2224/05567 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H05K1/09 , H05K1/111 , H05K3/3436 , H05K2201/0116 , H05K2201/10234 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要： A foamed bulk metallic glass electrical connection is formed on a substrate of an integrated circuit package. The foamed bulk metallic glass electrical connection exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed bulk metallic glass electrical connection is used as a solder bump for communication between an integrated circuit device and external structures. A process of forming the foamed bulk metallic glass electrical connection includes mixing bulk metallic glass with a blowing agent.
摘要翻译：在集成电路封装的基板上形成发泡体金属玻璃电连接。发泡体金属玻璃电气连接显示出低冲击强度和动态载荷下的抗开裂性能。发泡体金属玻璃电连接用作集成电路器件和外部结构之间的通信的焊料凸块。形成发泡体金属玻璃电连接的方法包括将块状金属玻璃与发泡剂混合。

9. 发明申请

US20090068830A1 Microelectronic package interconnect and method of fabrication thereof 失效
标题翻译：微电子封装互连及其制造方法
公开(公告)号：US20090068830A1
公开(公告)日：2009-03-12
申请号：US12218161
申请日：2008-07-10
申请人： Daewoong Suh , Amran Eitan , Yongki Min
发明人： Daewoong Suh , Amran Eitan , Yongki Min
IPC分类号： H01L21/44
CPC分类号： H01L23/49827 , B82Y10/00 , C09J7/22 , C09J9/02 , C09J2201/128 , C09J2201/602 , C09J2203/326 , H01L23/49877 , H01L23/5384 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/0566 , H01L2224/05676 , H01L2224/0568 , H01L2224/11452 , H01L2224/1182 , H01L2224/1191 , H01L2224/13022 , H01L2224/13193 , H01L2224/13562 , H01L2224/13582 , H01L2224/136 , H01L2224/13611 , H01L2224/13666 , H01L2224/16145 , H01L2224/27003 , H01L2224/271 , H01L2224/29 , H01L2224/29076 , H01L2224/29078 , H01L2224/29101 , H01L2224/2919 , H01L2224/29193 , H01L2224/2929 , H01L2224/29339 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/83203 , H01L2225/06527 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/323 , H05K2201/026 , Y10S977/848 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/01015 , H01L2924/01031 , H01L2924/01033 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.
摘要翻译：提供互连和互连的方法来连接集成电路的第一部件和第二部件。互连包括多个碳纳米管（CNT），其在第一部件和第二部件之间提供导电路径。互连还包括钝化层以填充相邻CNT之间的间隙。提供制造各向异性导电膜（ACF）和ACF的方法。 ACF包括多个CNT，其在ACF的第一侧和ACF的第二侧之间提供导电路径。 ACF的侧面还可以包括导电的可固化粘合剂层。在一个实施方案中，导电可固化粘合剂层可以并入B级可交联聚合物和银颗粒。

10. 发明申请

US20070290339A1 BULK METALLIC GLASS SOLDERS, FOAMED BULK METALLIC GLASS SOLDERS, FOAMED-SOLDER BOND PADS IN CHIP PACKAGES, METHODS OF ASSEMBLING SAME, AND SYSTEMS CONTAINING SAME 有权
标题翻译：大块金属玻璃焊料，泡沫金属玻璃焊料，芯片包装中的泡沫焊接垫，其组装方法和包含其的系统
公开(公告)号：US20070290339A1
公开(公告)日：2007-12-20
申请号：US11425353
申请日：2006-06-20
申请人： Daewoong Suh , Yongki Min
发明人： Daewoong Suh , Yongki Min
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , C22C45/10 , H01L23/49816 , H01L24/13 , H01L24/81 , H01L2224/05567 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H05K1/09 , H05K1/111 , H05K3/3436 , H05K2201/0116 , H05K2201/10234 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要： A foamed bulk metallic glass electrical connection is formed on a substrate of an integrated circuit package. The foamed bulk metallic glass electrical connection exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed bulk metallic glass electrical connection is used as a solder bump for communication between an integrated circuit device and external structures. A process of forming the foamed bulk metallic glass electrical connection includes mixing bulk metallic glass with a blowing agent.
摘要翻译：在集成电路封装的基板上形成发泡体金属玻璃电连接。发泡体金属玻璃电气连接显示出低冲击强度和动态载荷下的抗开裂性能。发泡体金属玻璃电连接用作集成电路器件和外部结构之间的通信的焊料凸块。形成发泡体金属玻璃电连接的方法包括将块状金属玻璃与发泡剂混合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式