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1. 发明授权

US08258526B2 Light emitting diode package including a lead frame with a cavity 有权
标题翻译：发光二极管封装，包括具有空腔的引线框架
公开(公告)号：US08258526B2
公开(公告)日：2012-09-04
申请号：US12204260
申请日：2008-09-04
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Do Hun Kim , Dae Yeon Kim , Dae Hyun Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Do Hun Kim , Dae Yeon Kim , Dae Hyun Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.
摘要翻译：本发明提供了一种发光二极管封装，其包括具有空腔的引线框架; 模具暴露空腔并容纳引线框架; 以及安装在腔体上的LED芯片，其中通过LED芯片的上边缘的光通过腔体的上边缘。

2. 发明授权

US08168453B2 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08168453B2
公开(公告)日：2012-05-01
申请号：US12370802
申请日：2009-02-13
申请人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
发明人： Kyung Taeg Han , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
IPC分类号： H01L21/56
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
摘要翻译：一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

3. 发明授权

US08132935B2 Light emitting module 有权
标题翻译：发光模块
公开(公告)号：US08132935B2
公开(公告)日：2012-03-13
申请号：US12535251
申请日：2009-08-04
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V7/04
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译：提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。

4. 发明申请

US20100047941A1 HIGH POWER LED PACKAGE AND FABRICATION METHOD THEREOF 有权
标题翻译：大功率LED封装及其制造方法
公开(公告)号：US20100047941A1
公开(公告)日：2010-02-25
申请号：US12612268
申请日：2009-11-04
申请人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yoen Han , Dae Yeon Kim , Young Sam Park
发明人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yoen Han , Dae Yeon Kim , Young Sam Park
IPC分类号： H01L21/50
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

5. 发明申请

US20090197360A1 LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20090197360A1
公开(公告)日：2009-08-06
申请号：US12370802
申请日：2009-02-13
申请人： Kyung Taeg HAN , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
发明人： Kyung Taeg HAN , In Tae Yeo , Hun Joo Hahm , Chang Ho Song , Seong Yeon Han , Yoon Sung Na , Dae Yeon Kim , Ho Sik Ahn , Young Sam Park
IPC分类号： H01L21/56
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
摘要翻译：一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

6. 发明授权

US08388177B2 Light emitting module 有权
标题翻译：发光模块
公开(公告)号：US08388177B2
公开(公告)日：2013-03-05
申请号：US13363879
申请日：2012-02-01
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim , Seong Yeon Han , Dae Hyun Kim , Do Hun Kim , Dae Yeon Kim
IPC分类号： F21V7/04
CPC分类号： F21V21/005 , F21K9/00 , F21V13/02 , F21V13/08 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01L2224/48091 , H01L2924/181 , H05K1/142 , H05K3/0061 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446 , Y10S362/80 , H01L2924/00014 , H01L2924/00012
摘要： There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.
摘要翻译：提供了一种发光模块，包括：印刷电路板; 在形成在印刷电路板的顶部上的导电图案上彼此间隔一定距离设置的多个发光二极管芯片; 以及形成在印刷电路板的底部并且电连接到多个发光二极管芯片的连接器。最优地布置发光二极管芯片和连接器，以确保发光模块适合用作包括大量发光二极管芯片的高密度线性光源，并以最小的损耗向外发光。

7. 发明授权

US07875476B2 High power LED package and fabrication method thereof 有权
标题翻译：大功率LED封装及其制造方法
公开(公告)号：US07875476B2
公开(公告)日：2011-01-25
申请号：US12612268
申请日：2009-11-04
申请人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yeon Han , Dae Yeon Kim , Young Sam Park
发明人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yeon Han , Dae Yeon Kim , Young Sam Park
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

8. 发明申请

US20100270564A1 LED PACKAGE AND BACKLIGHT UNIT USING THE SAME 有权
标题翻译：使用相同的LED封装和背光单元
公开(公告)号：US20100270564A1
公开(公告)日：2010-10-28
申请号：US12832469
申请日：2010-07-08
申请人： Dae Yeon Kim , Young Sam Park
发明人： Dae Yeon Kim , Young Sam Park
IPC分类号： H01L33/48
CPC分类号： H01L33/58 , H01L33/46
摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.
摘要翻译：本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

9. 发明授权

US07771081B2 LED package and backlight unit using the same 有权
标题翻译： LED封装和背光单元使用相同
公开(公告)号：US07771081B2
公开(公告)日：2010-08-10
申请号：US12497009
申请日：2009-07-02
申请人： Dae Yeon Kim , Young Sam Park
发明人： Dae Yeon Kim , Young Sam Park
IPC分类号： F21V8/00
CPC分类号： H01L33/58 , H01L33/46
摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.
摘要翻译：本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

10. 外观设计

USD595247S1 Light-emitting diode 有权
公开(公告)号：USD595247S1
公开(公告)日：2009-06-30
申请号：US29325559
申请日：2008-10-02
申请人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
设计人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han

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