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    • 1. 发明申请
    • POWER MOSFET WITH A GATE STRUCTURE OF DIFFERENT MATERIAL
    • 具有不同材料门结构的功率MOSFET
    • US20100059817A1
    • 2010-03-11
    • US12205438
    • 2008-09-05
    • DANIEL PHAMBich-Yen Nguyen
    • DANIEL PHAMBich-Yen Nguyen
    • H01L29/78H01L21/336
    • H01L29/7833H01L21/28105H01L29/42372
    • A semiconductor device includes a semiconductor layer of a first conductivity type and a first doping concentration. A first semiconductor region, used as drain, of the first conductivity type has a lower doping concentration than the semiconductor layer and is over the semiconductor layer. A gate dielectric is over the first semiconductor region. A gate electrode over the gate dielectric has a metal-containing center portion and first and second silicon portions on opposite sides of the center portion. A second semiconductor region, used as a channel, of the second conductivity type has a first portion under the first silicon portion and the gate dielectric. A third semiconductor region, used as a source, of the first conductivity type is laterally adjacent to the first portion of the second semiconductor region. The metal-containing center portion, replacing silicon, increases the source to drain breakdown voltage.
    • 半导体器件包括第一导电类型和第一掺杂浓度的半导体层。 用作第一导电类型的漏极的第一半导体区域具有比半导体层更低的掺杂浓度,并且在半导体层之上。 栅极电介质在第一半导体区域之上。 栅极电介质上的栅极电极在中心部分的相对侧上具有含金属的中心部分和第一和第二硅部分。 用作第二导电类型的沟道的第二半导体区域具有在第一硅部分下面的第一部分和栅极电介质。 用作第一导电类型的源的第三半导体区域与第二半导体区域的第一部分横向相邻。 置换硅的含金属中心部分将源极增加到漏极击穿电压。