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    • 9. 发明申请
    • PRINTED CIRCUIT BOARD
    • 印刷电路板
    • US20100321910A1
    • 2010-12-23
    • US12497709
    • 2009-07-06
    • SHOU-KUO HSUCHUN-JEN CHEN
    • SHOU-KUO HSUCHUN-JEN CHEN
    • H05K7/00
    • H05K1/0231H05K1/0253H05K1/112H05K3/429H05K2201/0969H05K2201/10545H05K2201/10689
    • A printed circuit board includes a first signal layer, a first reference layer, a second reference layer, and a second signal layer. An integrated circuit mounted on the first signal layer includes a power supply terminal connected to a first power supply via. The second signal layer includes a filter and a power supply wire. The filter includes a power terminal connected to the first power supply via, and a ground terminal connected to the second reference layer. The first power supply via is connected to the first reference layer through the power supply wire and a second power supply via. A void defined in the second reference layer is at least partially vertically overlapping with the power supply wire, and enables the first reference layer to function as a reference plane for the power supply wire, to increase impedance of the power supply wire.
    • 印刷电路板包括第一信号层,第一参考层,第二参考层和第二信号层。 安装在第一信号层上的集成电路包括连接到第一电源通孔的电源端子。 第二信号层包括滤波器和电源线。 滤波器包括连接到第一电源通孔的电源端子和连接到第二参考层的接地端子。 第一电源通孔通过电源线和第二电源通孔连接到第一参考层。 限定在第二参考层中的空隙至少部分地与电源线垂直重叠,并且使得第一参考层能够用作电源线的参考平面,以增加电源线的阻抗。
    • 10. 发明申请
    • PRINTED CIRCUIT BOARD
    • 印刷电路板
    • US20090242244A1
    • 2009-10-01
    • US12126748
    • 2008-05-23
    • SHOU-KUO HSUCHUN-JEN CHEN
    • SHOU-KUO HSUCHUN-JEN CHEN
    • H05K1/00
    • H05K1/0245H05K1/0298H05K2201/09236H05K2201/09336
    • An exemplary PCB includes a first reference layer, a first signal layer, and a second signal layer in that order. A first differential pair is arranged in the first signal layer in an edge-coupled structure referencing the first reference layer. A second differential pair is arranged in the second signal layer in edge-coupled structure. A first ground part and a second ground part are symmetrically arranged at opposite sides of the second differential pair in the second signal layer. The first differential pair is arranged above the first ground part and a projection of the first differential pair onto the second signal layer having an area coincident with the first ground part. The second differential pair references the first and second ground parts.
    • 示例性的PCB包括第一参考层,第一信号层和第二信号层。 第一差分对以参考第一参考层的边缘耦合结构布置在第一信号层中。 第二差分对以边缘耦合结构布置在第二信号层中。 第一接地部分和第二接地部分对称地布置在第二信号层中的第二差分对的相对侧。 第一差分对布置在第一接地部分的上方,并且第一差分对的突起与具有与第一接地部分重合的区域的第二信号层上。 第二差分对参考第一和第二接地部分。