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    • 6. 发明申请
    • IMAGING SYSTEM AND METHODS OF MANUFACTURING AND USING THE SAME
    • 成像系统及其制造方法和使用方法
    • US20150139397A1
    • 2015-05-21
    • US14569381
    • 2014-12-12
    • Joseph T. SmithJohn Stowell
    • Joseph T. SmithJohn Stowell
    • G01T1/29H01L27/146G01N23/04
    • G01T1/2928G01N23/04H01L27/14658H01L27/14685H01L27/1469H04N5/32
    • Some embodiments include an imaging system. The image sensor array includes multiple image sensor sheets configured in an array grid. Each image sensor sheet of the multiple image sensor sheets can include a flexible substrate layer, and the flexible substrate layer can include a first flexible substrate side and a second flexible substrate side opposite the first flexible substrate side. Meanwhile, each image sensor sheet of the multiple sensor sheets can include multiple image sensors over the first flexible substrate side, the multiple image sensors can include multiple flat panel image detectors configured in a sheet grid, and the image sensor array can include an approximately constant pixel pitch. Other embodiments of related systems and methods are also disclosed.
    • 一些实施例包括成像系统。 图像传感器阵列包括以阵列网格配置的多个图像传感器片。 多个图像传感器片的每个图像传感器片可以包括柔性基底层,并且柔性基底层可以包括第一柔性基底侧和与第一柔性基底侧相对的第二柔性基底侧。 同时,多个传感器片的每个图像传感器片材可以包括在第一柔性基板侧上的多个图像传感器,多个图像传感器可以包括以片状网格构成的多个平板图像检测器,并且图像传感器阵列可以包括近似恒定的 像素间距。 还公开了相关系统和方法的其它实施例。
    • 8. 发明申请
    • METHOD OF PROVIDING AN IMAGING SYSTEM AND IMAGING SYSTEM THEREOF
    • US20200043952A1
    • 2020-02-06
    • US16601411
    • 2019-10-14
    • Joseph SmithRita BotteschJohn Stowell
    • Joseph SmithRita BotteschJohn Stowell
    • H01L27/12H01L29/786H01L23/498H01L21/683H01L23/31H01L21/768H01L27/146H01L27/15H01L21/306G01T1/20
    • Some embodiments include an imaging system. The imaging system can comprise: a scintillator structure; and an electronic device engaged with the scintillator structure, wherein: the scintillator structure can comprise: a scintillator support layer; and a scintillator layer; the scintillator support layer can comprise: a first substantially non-planar surface; a second substantially non-planar surface, the first substantially non-planar surface can be approximately parallel to the second substantially non-planar surface; and a scintillator support layer thickness greater than approximately 200 micrometers and less than or equal to approximately 300 micrometers; the scintillator layer can comprise: a first surface; a second surface opposite the first surface, the second surface being configured to scintillate; and one or more granular phosphor materials can comprise a diameter of greater than or equal to approximately 2 micrometers and less than or equal to approximately 30 micrometers; the first surface of the scintillator layer can be coupled to the second substantially non-planar surface of the scintillator support layer such that the second surface of the scintillator layer comprises a contour of the second substantially non-planar surface of the scintillator support layer; the electronic device can comprise a device substrate and one or more active sections; the device substrate can comprise a first surface and a second surface opposite the first surface of the device substrate; the one or more active sections are at the second surface of the device substrate; and the second surface of the device substrate and the one or more active sections can conform to the second surface of the scintillator layer. Other embodiments are described herein.