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1. 发明授权

US07682515B2 Nano-imprint lithography method involving substrate pressing 有权
标题翻译：涉及基片压制的纳米压印光刻方法
公开(公告)号：US07682515B2
公开(公告)日：2010-03-23
申请号：US10539875
申请日：2003-12-22
申请人： Corinne Perret , Cecile Gourgon , Stephan Landis
发明人： Corinne Perret , Cecile Gourgon , Stephan Landis
IPC分类号： C03C15/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F7/11
摘要： The inventive method includes a preparation step during which the substrate is covered with a layer, a pressing step in which a mould including a pattern of recesses and protrusions is pressed into part of the thickness of the aforementioned layer, at least one etching step in which the layer is etched until parts of the surface of the substrate have been stripped, and a substrate etching step whereby the substrate is etched using an etching pattern which is defined from the mould pattern. The preparation step includes a sub-step consisting of the formation of a lower sub-layer of curable material, a step involving the curing of said layer and a sub-step including the formation of an outer sub-layer which is adjacent to the cured sub-layer. Moreover, during the pressing step, the above-mentioned protrusions in the mould penetrate the outer sub-layer until contact is reached with the cured sub-layer.
摘要翻译：本发明的方法包括一个制备步骤，在该步骤中衬底被一层覆盖，一个压制步骤，其中将包括凹凸图案的模具压入上述层的厚度的一部分中，至少一个蚀刻步骤，其中蚀刻该层，直到基板的表面的一部分被剥离，以及基板蚀刻步骤，由此使用从模具图案限定的蚀刻图案来蚀刻该基板。制备步骤包括由可固化材料的下层形成的子步骤，涉及所述层的固化的步骤和包括形成邻近固化的外部亚层的子步骤子层。此外，在挤压步骤中，模具中的上述突起穿透外部子层，直到与固化的子层接触。

2. 发明申请

US20060183060A1 Nano-imprint lithography method involving substrate pressing 有权
标题翻译：涉及基片压制的纳米压印光刻方法
公开(公告)号：US20060183060A1
公开(公告)日：2006-08-17
申请号：US10539875
申请日：2003-12-22
申请人： Corinne Perret , Cecile Gourgon , Stephan Landis
发明人： Corinne Perret , Cecile Gourgon , Stephan Landis
IPC分类号： B29C59/02 , B29C71/02 , C23F1/00 , B29C71/00 , B28B11/08 , G03C5/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F7/11
摘要： The inventive method includes a preparation step during which the substrate is covered with a layer, a pressing step in which a mould including a pattern of recesses and protrusions is pressed into part of the thickness of the aforementioned layer, at least one etching step in which the layer is etched until parts of the surface of the substrate have been stripped, and a substrate etching step whereby the substrate is etched using an etching pattern which is defined from the mould pattern. The preparation step includes a sub-step consisting of the formation of a lower sub-layer of curable material, a step involving the curing of said layer and a sub-step including the formation of an outer sub-layer which is adjacent to the cured sub-layer. Moreover, during the pressing step, the above-mentioned protrusions in the mould penetrate the outer sub-layer until contact is reached with the cured sub-layer.
摘要翻译：本发明的方法包括一个制备步骤，在该步骤中衬底被一层覆盖，一个压制步骤，其中将包括凹凸图案的模具压入上述层的厚度的一部分中，至少一个蚀刻步骤，其中蚀刻该层，直到基板的表面的一部分被剥离，以及基板蚀刻步骤，由此使用从模具图案限定的蚀刻图案来蚀刻该基板。制备步骤包括由可固化材料的下层形成的子步骤，涉及所述层的固化的步骤和包括形成邻近固化的外部亚层的子步骤子层。此外，在挤压步骤中，模具中的上述突起穿透外部子层，直到与固化的子层接触。

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