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1. 发明授权

US06351391B1 Signal busses on printed board structures mounting ASIC chips with signal termination resistor devices using planar signal terminating devices 有权
标题翻译：在印刷电路板结构上的信号总线，使用平面信号端接装置安装具有信号终端电阻器件的ASIC芯片
公开(公告)号：US06351391B1
公开(公告)日：2002-02-26
申请号：US09571956
申请日：2000-05-15
申请人： Clint A. Beliveau , Wallace D. Doeling
发明人： Clint A. Beliveau , Wallace D. Doeling
IPC分类号： H05K710
CPC分类号： H05K1/167 , H01L23/647 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H05K1/023 , H05K1/0246 , H05K1/0298 , H05K1/141 , H05K2201/049 , H05K2201/10734 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A printed circuit board structure is provided where there is a circuitized dielectric substrate having a plurality of signal traces thereon. The circuitized substrate has first and second opposite faces. An ASIC chip assembly is mounted on the first face and connected to the surface by solder connections. Preferably, the ASIC chip assembly is mounted on the substrate as an IC chip mounted on a chip carrier with the chip carrier being mounted to the circuit board by solder connections, preferably in the form of a ball grid array. In one embodiment, a discrete signal termination device is provided which is disposed on the second face of the circuitized substrate directly opposite the ASIC chip assembly. In another embodiment, a discrete signal termination device is disposed between the ASIC chip assembly and the printed circuit board. The signal termination device includes a plurality of planar resistors embedded in a dielectric material with the resistors being electrically connected to the signal lines on the circuitized substrate, preferably by solder connections, again in the form of a ball grid array. In yet another embodiment, the signal termination device is formed as a part of the ASIC chip assembly by being incorporated in the chip carrier In all cases, the signal termination device need not be formed as a part of the circuit board but can be formed in discrete individual segments for attachment to either the circuit board or formed as part of the chip carrier, thus utilizing the entire structure of the termination device to form resistors.
摘要翻译：提供了一种印刷电路板结构，其中存在其上具有多个信号迹线的电路化电介质基板。电路化基板具有第一和第二相对面。 ASIC芯片组件安装在第一面上，并通过焊接连接连接到表面。优选地，ASIC芯片组件作为安装在芯片载体上的IC芯片安装在基板上，其中芯片载体通过焊接连接安装到电路板，优选地以球栅阵列的形式。在一个实施例中，离散提供信号终端装置，其设置在与ASIC芯片组件正对的电路化基板的第二面上。在另一个实施例中，离散信号终端装置设置在ASIC芯片组件和印刷电路板之间。信号终端装置包括嵌入电介质材料中的多个平面电阻器，其中电阻器电连接到电路化的衬底，优选地通过焊料连接，再次以球栅阵列的形式。在另一个实施例中，信号终端装置通过结合在芯片载体中而形成为ASIC芯片组件的一部分。在所有情况下，信号终端装置不需要形成为电路板的一部分，而是可以形成在离散的各个片段中，用于附接到电路板或形成为芯片载体的一部分，从而利用终端装置的整个结构来形成电阻器。

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