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    • 1. 发明授权
    • Method of fabricating three-dimensional direct-write EEPROM arrays
    • 制造三维直写EEPROM阵列的方法
    • US5468663A
    • 1995-11-21
    • US405128
    • 1995-03-16
    • Claude L. BertinDonelli J. DiMariaMakoto MiyakawaYoshinori Sakaue
    • Claude L. BertinDonelli J. DiMariaMakoto MiyakawaYoshinori Sakaue
    • H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L27/11556H01L27/115H01L29/7882
    • A three-dimensional memory cell, suitable for electrically erasable programmable read only memories (EEPROMS), which has direct-write cell capability is disclosed. The memory cell is utilized in the fabrication of non-volatile, direct-write EEPROM arrays with high integration density. A typical EEPROM array includes a plurality of elongated shallow trenches formed in a semiconductor substrate. Multiple direct-write EEPROM cells are disposed within each elongated trench such that each EEPROM cell shares a recall gate and a program gate with another cell in the same trench. Preferably, a silicon rich dielectric (such as silicon rich oxide) disposed between each floating gate and its associated programming and recall gates. Both common source diffusion and isolated source diffusion embodiments are disclosed. Further, various fabrication methods for the direct-write EEPROM arrays presented are described.
    • 公开了一种适用于具有直写单元能力的电可擦除可编程只读存储器(EEPROMS)的三维存储单元。 存储单元用于制造具有高集成度密度的非易失性直写EEPROM阵列。 典型的EEPROM阵列包括形成在半导体衬底中的多个细长的浅沟槽。 多个直写EEPROM单元被布置在每个细长沟槽内,使得每个EEPROM单元与相同沟槽中的另一个单元共享回调门和编程门。 优选地,设置在每个浮动栅极与其相关联的编程和调用栅极之间的富硅电介质(例如富氧氧化物)。 公开了源极扩散和隔离源扩散实施例。 此外,描述了所呈现的用于直写EEPROM阵列的各种制造方法。