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    • 8. 发明授权
    • Mounting device for mounting heat sink onto electronic component
    • 用于将散热器安装到电子元件上的安装装置
    • US07639504B2
    • 2009-12-29
    • US12119514
    • 2008-05-13
    • Jer-Haur KuoXin-Xiang ZhaYe-Fei YuJun Ding
    • Jer-Haur KuoXin-Xiang ZhaYe-Fei YuJun Ding
    • H05K7/20F28F7/00H01L23/34
    • H01L23/4093H01L2924/0002H01L2924/00
    • A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.
    • 一种用于将散热器(20)安装到其上设置有发热电子部件(30)的印刷电路板(40)的安装装置(10),包括安装框架(100),两个紧固支腿(104)和 四个弹性臂(105)。 安装框架包括设置在第一安装臂上方的两个第一安装臂(101)和两个第二安装臂(102)。 第一安装臂邻接在电路板上。 夹紧腿与第二安装臂连接并插入印刷电路板以附接到印刷电路板。 弹性臂与第二安装臂连接,并向发热电子部件向散热片施加向下的弹性力。