专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06211075B1 Method of improving metal stack reliability 有权
标题翻译：提高金属堆栈可靠性的方法
公开(公告)号：US06211075B1
公开(公告)日：2001-04-03
申请号：US09244881
申请日：1999-02-05
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu , Hung-Ju Chien
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu , Hung-Ju Chien
IPC分类号： H01L2144
CPC分类号： H01L21/76856 , H01L21/76841 , H01L21/76886 , Y10S438/937
摘要： A method for increasing electromigration resistance within the metal stack layer of Wolfram plugs by applying air exposure or plasma treatment to the top surface of the first layer of metal within the metal stack layer that is formed on top of metal plugs. The remainder of the process of the formation of the metal stack layer is not affected by the present invention.
摘要翻译：通过在形成于金属插塞顶部的金属堆叠层内的第一金属层的顶表面上施加空气曝光或等离子体处理来提高Wolfram插件的金属堆叠层内的电迁移阻力的方法。形成金属堆叠层的其余过程不受本发明的影响。

2. 发明授权

US06242338B1 Method of passivating a metal line prior to deposition of a fluorinated silica glass layer 有权
标题翻译：在沉积氟化石英玻璃层之前钝化金属线的方法
公开(公告)号：US06242338B1
公开(公告)日：2001-06-05
申请号：US09422175
申请日：1999-10-22
申请人： Chung-Shi Liu , Shau-Lin Shue , Yao-yi Cheng , Chen-Hua Yu , Mei-Yun Wang
发明人： Chung-Shi Liu , Shau-Lin Shue , Yao-yi Cheng , Chen-Hua Yu , Mei-Yun Wang
IPC分类号： H01L214763
CPC分类号： H01L21/02131 , H01L21/02274 , H01L21/02304 , H01L21/31629 , H01L21/321 , H01L21/76832 , H01L21/76834 , H01L21/76888
摘要： A process of forming a thin, protective insulator layer, on the sides of metal interconnect structures, prior to the deposition of a halogen containing, low k dielectric layer, has been developed. The process features the growth of a thin metal nitride, or thin metal oxide layer, on the exposed sides of the metal interconnect structures, via a plasma treatment, performed in either a nitrogen containing, or in a water containing, ambient. The thin layer protects the metal interconnect structure from the corrosive, as well as delamination effects, created by the halogen, or halogen products, contained in overlying low k dielectric layers, such as fluorinated silica glass.
摘要翻译：已经开发了在沉积含卤素的低k电介质层之前在金属互连结构的侧面上形成薄的保护性绝缘体层的工艺。该方法的特征在于金属互连结构的暴露侧上通过等离子体处理在含氮或含水环境中进行的金属氮化物或薄金属氧化物层的生长。薄层保护金属互连结构免受由覆盖在低k电介质层（例如氟化石英玻璃）中的卤素或卤素产物产生的腐蚀性以及分层影响。

3. 发明授权

US06297158B1 Stress management of barrier metal for resolving CU line corrosion 有权
标题翻译：用于解决CU线腐蚀的隔离金属的应力管理
公开(公告)号：US06297158B1
公开(公告)日：2001-10-02
申请号：US09583402
申请日：2000-05-31
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
IPC分类号： H01L214763
CPC分类号： H01L21/76873 , H01L21/76843 , H01L21/76864
摘要： In the presently disclosed invention, a method is provided to avoid damage to a copper interconnect while subjecting the interconnect to chemical-mechanical polishing (CMP). First, a copper barrier layer is formed in a damascene structure. Then, prior to the deposition of copper metal into the damascene openings, a barrier layer is formed on the inside walls of the damascene structure. In a first embodiment, the copper barrier layer is deposited at high temperature. Then, it is cooled down in a prescribed manner. Subsequently, a copper seed layer is formed over the barrier, which is followed by the electro-chemical deposition (ECD) of copper, to form the copper damascene interconnect. Alternatively, in a second embodiment, the copper layer is formed at low temperature. Then it is annealed at a high temperature, followed by wafer cooling. Subsequently, copper seed layer is formed over the barrier layer. Next, ECD copper is formed in the damascene structure. Finally, the interconnect so formed by either of the embodiments is subjected to CMP. It is found that, through the disclosed method of treatment of the barrier layer, process stresses that are normally formed within the barrier layer are relieved, and hence no damage is incurred during the final steps of chemical-mechanical polishing.
摘要翻译：在本公开的发明中，提供了一种方法，以避免对互连线进行化学机械抛光（CMP）的铜互连的损坏。首先，在大马士革结构中形成铜阻挡层。然后，在将铜金属沉积到镶嵌开口之前，在镶嵌结构的内壁上形成阻挡层。在第一实施例中，铜阻挡层在高温下沉积。然后，以规定的方式冷却。随后，在屏障上形成铜籽晶层，随后是铜的电化学沉积（ECD），以形成铜镶嵌互连。或者，在第二实施例中，铜层在低温下形成。然后在高温下进行退火，然后进行晶片冷却。随后，在阻挡层上形成铜籽晶层。接下来，在镶嵌结构中形成ECD铜。最后，将由这两个实施例形成的互连件进行CMP处理。发现通过公开的阻挡层处理方法，通常在阻挡层内形成的工艺应力被释放，因此在化学机械抛光的最终步骤期间不会产生损伤。

4. 发明授权

US06221758B1 Effective diffusion barrier process and device manufactured thereby 有权
公开(公告)号：US06221758B1
公开(公告)日：2001-04-24
申请号：US09225064
申请日：1999-01-04
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
IPC分类号： H01L214763
CPC分类号： H01L21/76856 , H01L21/76805 , H01L21/76843
摘要： In forming a semiconductor device in which an electrically conductive substrate is covered with a dielectric layer by the following steps, form a trench with a trench line on top and a contact hole on the bottom in the dielectric layer with the overall trench reaching down to the substrate. Preclean the trench. Form a tantalum film over the dielectric layer including the trench walls, covering the exposed the substrate surface. Fill grain boundaries of the tantalum film with at least one of tantalum oxide and tantalum nitride forming a filled tantalum film. Form a redeposited tantalum layer above the filled tantalum film. Form a copper seed film above the redeposited tantalum film. Plate the device filling the trench with a plated bulk copper layer on the seed film. Planarize the device to expose the top surface of the dielectric layer, removing surplus portions of the filled tantalum film, the copper seed film, and the bulk copper layer. The filled tantalum film is formed by exposing the tantalum to air under STP atmospheric conditions or by exposure to a nitrous oxide (N2O) gas in a plasma at a temperature of about 400° C.

5. 发明授权

US06207568B1 Ionized metal plasma (IMP) method for forming (111) oriented aluminum containing conductor layer 有权
标题翻译：用于形成（111）取向的含铝导体层的电离金属等离子体（IMP）方法
公开(公告)号：US06207568B1
公开(公告)日：2001-03-27
申请号：US09200554
申请日：1998-11-27
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
IPC分类号： H01L2144
CPC分类号： H01L21/76841 , H01L21/2855 , H01L21/28568 , H01L23/53223 , H01L2924/0002 , H01L2924/00
摘要： A method for forming an aluminum containing conductor layer. There is first provided a substrate. There is then formed over the substrate a titanium layer employing an ionized metal plasma bias sputtering method. Finally there is then formed upon the titanium layer an aluminum containing conductor layer. By employing the ionized metal plasma bias sputtering method for forming the titanium layer, the aluminum containing conductor layer is formed with an enhanced (111) crystallographic orientation. The method is particularly useful for forming aluminum containing conductor layers with enhanced electromigration resistance, even under circumstances where there is formed interposed between a titanium layer and an aluminum containing conductor layer a titanium nitride layer.
摘要翻译：一种形成含铝导体层的方法。首先提供基板。然后在衬底上形成采用电离金属等离子体偏置溅射方法的钛层。最后，在钛层上形成含有铝的导体层。通过采用用于形成钛层的电离金属等离子体偏压溅射法，形成具有增强（111）晶体取向的含铝导体层。该方法对于形成具有增强的电迁移电阻的含铝导体层特别有用，即使在钛层和含铝导体层之间形成氮化钛层的情况下也是如此。

6. 发明授权

US06413863B1 Method to resolve the passivation surface roughness during formation of the AlCu pad for the copper process 有权
标题翻译：在铜工艺的AlCu焊盘形成期间，解决钝化表面粗糙度的方法
公开(公告)号：US06413863B1
公开(公告)日：2002-07-02
申请号：US09489971
申请日：2000-01-24
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
IPC分类号： H01L2144
CPC分类号： H01L23/53219 , H01L21/32135 , H01L21/32136 , H01L24/11 , H01L2224/13099 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , Y10S438/926 , H01L2924/00 , H01L2224/48
摘要： In accordance with the objectives of the invention a new method is provided to create aluminum pads that overlay an electrical contact point. A layer of passivation is deposited over the surface that contains one or more electrical contact points, the layer of passivation is patterned thereby creating openings in the layer of passivation that overlay and align with one or more of the contact points. Under the first embodiment of the invention, a layer of AlCu is deposited over the patterned layer of passivation thereby including the openings that have been created in the layer of passivation. The deposited layer of AlCu is patterned and etched thereby creating the required AlCu bond pad. In addition to creating the required AlCu bond pad, the etch of the layer of AlCu also creates a pattern of dummy AlCu pads that are not in contact with any underlying points of electrical contact but that are located on the surface of the layer of passivation. The dummy AlCu pads counteract the above indicated effect of theta phase propagation that occurs during the AlCu etching resulting in a passivation layer that has a smooth surface and that therefore provides a good underlying layer for the created AlCu pads. Under the second embodiment of the invention, a layer of pure aluminum is sputter deposited over the passivation layer including the openings that has been created in the passivation layer. The deposited layer of aluminum is patterned and etched thereby creating the required aluminum pad.
摘要翻译：根据本发明的目的，提供了一种新的方法来产生覆盖电接触点的铝焊盘。在包含一个或多个电接触点的表面上沉积一层钝化物，图案化钝化层，从而在钝化层中形成覆盖并与一个或多个接触点对齐的开口。在本发明的第一实施例中，AlCu层沉积在图案化的钝化层上，从而包括在钝化层中产生的开口。 AlCu的沉积层被图案化和蚀刻，从而形成所需的AlCu焊盘。除了创建所需的AlCu接合焊盘之外，AlCu层的蚀刻还产生不与任何潜在的电接触点接触但位于钝化层表面上的虚拟AlCu焊盘的图案。虚拟AlCu焊盘抵消了在AlCu蚀刻期间发生的θ相传播的上述影响，导致具有平滑表面的钝化层，因此为所创建的AlCu焊盘提供了良好的底层。在本发明的第二实施例中，纯钝化层溅射沉积在钝化层上，包括在钝化层中形成的开口。将沉积的铝层图案化并蚀刻，从而形成所需的铝垫。

7. 发明授权

US6080657A Method of reducing AlCu hillocks 有权
标题翻译：减少AlCu小丘的方法
公开(公告)号：US6080657A
公开(公告)日：2000-06-27
申请号：US356008
申请日：1999-07-16
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
IPC分类号： H01L21/768 , H01L21/28
CPC分类号： H01L21/76856 , H01L21/76838 , H01L21/76841
摘要： A method of aluminum metallization in the manufacture of an integrated circuit device is described. An insulating layer is provided over the surface of a semiconductor substrate wherein a metal plug fills an opening through the insulating layer to the semiconductor substrate. A titanium layer is deposited over the surface of the insulating layer and the metal plug using ionized metal plasma. A titanium nitride is deposited layer overlying the titanium layer. Vacuum is broken and the titanium nitride layer is exposed to the ambient air whereby a titanium oxynitride layer forms on the surface of titanium nitride layer. An aluminum layer is sputter deposited over the titanium oxynitride layer at a high temperature of greater than about 400 .degree. C. and low power of less than or equal to 4 kilowatts. The aluminum layer will be deposited in a (111)-orientation. The metal stack is patterned to form a metal line. Hillocks and metal voids are prevented by the process of the invention.
摘要翻译：描述了在制造集成电路器件中的铝金属化方法。绝缘层设置在半导体衬底的表面上，其中金属插塞将通过绝缘层的开口填充到半导体衬底。使用电离金属等离子体在绝缘层和金属插塞的表面上沉积钛层。氮化钛层叠在钛层上。真空断裂，氮化钛层暴露于环境空气中，由此在氮化钛层的表面上形成氮氧化钛层。在大于约400℃的高温和低于4千瓦的低功率下，在氮氧化钛层上溅射沉积铝层。铝层将以（111）取向沉积。图案化金属叠层以形成金属线。通过本发明的方法防止了小丘和金属空隙。

8. 发明授权

US06353260B2 Effective diffusion barrier 有权
标题翻译：有效的扩散屏障
公开(公告)号：US06353260B2
公开(公告)日：2002-03-05
申请号：US09785106
申请日：2001-02-20
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
IPC分类号： H01L2348
CPC分类号： H01L21/76856 , H01L21/76805 , H01L21/76843
摘要： In forming a semiconductor device in which an electrically conductive substrate is covered with a dielectric layer by the following steps, form a trench with a trench line on top and a contact hole on the bottom in the dielectric layer with the overall trench reaching down to the substrate. Preclean the trench. Form a tantalum film over the dielectric layer including the trench walls, covering the exposed the substrate surface. Fill grain boundaries of the tantalum film with at least one of tantalum oxide and tantalum nitride forming a filled tantalum film. Form a redeposited tantalum layer above the filled tantalum film. Form a copper seed film above the redeposited tantalum film. Plate the device filling the trench with a plated bulk copper layer on the seed film. Planarize the device to expose the top surface of the dielectric layer, removing surplus portions of the filled tantalum film, the copper seed film, and the bulk copper layer. The filled tantalum film is formed by exposing the tantalum to air under STP atmospheric conditions or by exposure to a nitrous oxide (N2O) gas in a plasma at a temperature of about 400° C.
摘要翻译：在通过以下步骤形成其中导电基板被电介质层覆盖的半导体器件中，在电介质层的顶部形成有沟槽线的沟槽和底部的接触孔，其中整个沟槽到达基质。清洁沟槽。在包括沟槽壁的电介质层上形成钽膜，覆盖暴露的衬底表面。用钽氧化物和氮化钽中的至少一种填充钽膜的晶界，形成填充的钽膜。在填充的钽膜上方形成再沉积的钽层。在再沉积的钽膜上方形成铜籽晶膜。将装有填充沟槽的装置用种子膜上的电镀体铜层铺平。平面化器件以暴露电介质层的顶表面，去除填充的钽膜，铜籽晶膜和块状铜层的剩余部分。填充的钽膜通过在STP大气条件下暴露于空气或通过在约400℃的温度下暴露于等离子体中的一氧化二氮（N 2 O）气体而形成。

9. 发明授权

US06277745B1 Passivation method of post copper dry etching 有权
标题翻译：后铜干蚀刻钝化法
公开(公告)号：US06277745B1
公开(公告)日：2001-08-21
申请号：US09221965
申请日：1998-12-28
申请人： Chung-Shi Liu , Shau-Lin Shue , Syun-Ming Jang , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Syun-Ming Jang , Chen-Hua Yu
IPC分类号： H01L2144
CPC分类号： H01L21/02071 , H01L21/321 , H01L21/32136 , H01L21/76841 , H01L21/7685 , H01L21/76852 , H01L21/76885
摘要： The present invention relates to a new structure and method for the passivation of copper electrical interconnects for the semiconductor industry. More particularly, the invention details a convenient method for completing the passivation of copper lines after they have been patterned by a dry etch process. The method includes the formation of a sandwich structure consisting of a bottom barrier layer, a copper layer and a top barrier layer. After the sandwich structure is patterned with a dry etch, for example, the resultant exposed copper sidewalls are then passivated by means of a barrier metal spacer process. The fully encapsulated copper lines are highly resistant to oxidation, which is an, otherwise, inherent problem associated with the lack of self passivation/exhibited by bare copper films.
摘要翻译：本发明涉及用于半导体工业的铜电互连钝化的新结构和方法。更具体地，本发明详细描述了在通过干蚀刻工艺对其进行图案化之后完成铜线钝化的方便方法。该方法包括形成由底部阻挡层，铜层和顶部阻挡层组成的夹层结构。在用干蚀刻图案化夹层结构之后，然后通过阻挡金属间隔物工艺钝化所得到的暴露的铜侧壁。完全封装的铜线具有很高的抗氧化性，这是另一种与裸铜膜缺乏自钝化/显示相关的固有问题。

10. 发明授权

US06177347B1 In-situ cleaning process for Cu metallization 有权
标题翻译： Cu金属化的原位清洗工艺
公开(公告)号：US06177347B1
公开(公告)日：2001-01-23
申请号：US09346527
申请日：1999-07-02
申请人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
发明人： Chung-Shi Liu , Shau-Lin Shue , Chen-Hua Yu
IPC分类号： H01L2144
CPC分类号： H01L21/76814 , H01L21/76808 , H01L21/76843
摘要： A new method of in-situ cleaning in a copper metallization process is described. A copper line is provided overlying a first insulating layer on a semiconductor substrate. A silicon nitride layer is deposited overlying the copper line. A second insulating layer is deposited overlying the silicon nitride layer. A via is opened through the second insulating layer to the silicon nitride layer wherein a polymer forms on the sidewalls of the via. The silicon nitride layer within the via is removed wherein the copper line underlying the silicon nitride layer is exposed within the via and whereby the exposed copper line is oxidized forming a copper oxide layer within the via. The via is cleaned within a deposition chamber wherein the cleaning comprises the following steps: first sputtering Argon into the via to remove the polymer, second pumping down the deposition chamber, and third flowing H2 and He gases into the via to reduce the copper oxide layer to copper. Thereafter, a barrier metal layer is deposited onto the third insulating layer and within the via using the same deposition chamber and maintaining vacuum. A copper layer is formed within the via overlying the barrier metal layer to complete the copper metallization in the fabrication of an integrated circuit device.
摘要翻译：描述了一种在铜金属化过程中原位清洗的新方法。铜线设置在半导体衬底上的第一绝缘层上。沉积在铜线上的氮化硅层。沉积在氮化硅层上的第二绝缘层。将通孔穿过第二绝缘层打开到氮化硅层，其中在通孔的侧壁上形成聚合物。去除通孔内的氮化硅层，其中氮化硅层下面的铜线在通孔内暴露，由此暴露的铜线被氧化，形成通孔内的氧化铜层。在沉积室中清洁通孔，其中清洁包括以下步骤：首先将氩气溅射到通孔中以除去聚合物，第二次将沉积室泵送，并且将第三流动的H 2和He气体进入通孔以减少氧化铜层到铜。此后，使用相同的沉积室将阻挡金属层沉积到第三绝缘层和通孔内，并保持真空。在覆盖阻挡金属层的通孔中形成铜层，以在集成电路器件的制造中完成铜金属化。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式