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    • 1. 发明授权
    • Welding jig and welding process for planar magnetic components
    • 焊接夹具和平面磁性部件的焊接工艺
    • US09193001B2
    • 2015-11-24
    • US13417336
    • 2012-03-12
    • Chung-Kuang HsiehLan GuoKao-Kuan FanHui-Hua Teng
    • Chung-Kuang HsiehLan GuoKao-Kuan FanHui-Hua Teng
    • B21J13/08B23K1/00B23K3/08B23K37/04
    • B23K1/0016B23K3/087B23K37/0408B23K2101/38
    • A welding jig and welding process for planar magnetic components are provided. The welding jig includes a fixed piece and an elastic piece. The fixed piece includes a base and a carrier. The base has an opening, bumps at the bottom of the opening and a pair of operation ends extending from the opening. The carrier is fixed on the base and located in the opening, and has multiple through holes. When the bumps are located respectively in the through holes, an accommodation interval is formed between adjacent pairs of the bumps for the placement of the planar magnetic components. The elastic piece is secured to the fixed piece, and when the planar magnetic components are placed in the accommodation intervals of the fixed piece, the elastic piece covers the planar magnetic components and the planar magnetic components abut against two side edges of the elastic piece.
    • 提供了用于平面磁性部件的焊接夹具和焊接工艺。 焊接夹具包括固定件和弹性件。 固定件包括底座和托架。 基座具有开口,在开口的底部具有凸起,以及从开口延伸的一对操作端。 载体固定在基座上并位于开口中,并具有多个通孔。 当凸块分别位于通孔中时,在相邻的凸块对之间形成一个放置平面磁性部件的调节间隔。 弹性件被固定在固定件上,当平面磁性部件被放置在固定件的容置间隔中时,弹性件覆盖平面磁性部件,并且平面磁性部件抵靠弹性片的两个侧边缘。
    • 2. 发明授权
    • Light guide and stamper production method
    • 光导和压模生产方法
    • US06719930B2
    • 2004-04-13
    • US09912465
    • 2001-07-24
    • Shih-Chou ChenChung-Kuang HsiehChih-Han FangYuh-Sheng Lin
    • Shih-Chou ChenChung-Kuang HsiehChih-Han FangYuh-Sheng Lin
    • B29D1100
    • G02B6/0053G02B6/0055
    • A production method of a light guide and a stamper, combining anisotropic etching and isotropic etching. First a plurality of microstructures is formed on a back surface and a front surface of the substrate. By electroforming, rear and front stampers are made from the back and front surfaces of the substrate. Light guides are produced using the rear and front stampers. Anisotropic etching is performed on the front surface of the substrate, forming V-shaped, U-shaped or pyramid like microstructures. Isotropic etching is performed on the back surface of the substrate, forming quadratic, bowl like, oval or semicircular microstructures. If a transparent substrate is used, then after finishing the etching of microstructures, a light source, a reflector, a diffusion sheet and a prism sheet are added, simulating a back light module for performing a test of luminosity, uniformity of light intensity and light emission angle, so that optical properties are known before proceeding with inverse-forming of the stampers.
    • 光导和压模的制造方法,组合各向异性蚀刻和各向同性蚀刻。 首先,在基板的背面和前表面上形成多个微结构。 通过电铸,后和后压模由基板的后表面和前表面制成。 导光板采用后压模和正面压模生产。 在基板的正面进行各向异性蚀刻,形成V字状,U字状或棱锥状的微观结构。 在基板的背面进行各向同性蚀刻,形成二次,碗形,椭圆形或半圆形微结构。 如果使用透明基板,则在完成微结构的蚀刻之后,添加光源,反射板,扩散片和棱镜片,模拟用于进行亮度测试,光强度和光的均匀性的背光模块 发射角度,使得在进行压模成型之前光学特性是已知的。