专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120095132A1 HALOGEN- AND PHOSPHORUS-FREE THERMOSETTING RESIN COMPOSITION 审中-公开
标题翻译：无卤素和无磷酸盐热固性树脂组合物
公开(公告)号：US20120095132A1
公开(公告)日：2012-04-19
申请号：US12907364
申请日：2010-10-19
申请人： Chung-Hao CHANG , Chia-Hsiu Yeh , Hui-Min Lin
发明人： Chung-Hao CHANG , Chia-Hsiu Yeh , Hui-Min Lin
IPC分类号： C08L63/02
CPC分类号： C08G59/621 , C08G59/1477 , C08G59/5086
摘要： A halogen- and phosphorus-free thermosetting resin composition is provided, which is mainly a varnish resin formed by mixing a mixture of two curing agents, an epoxy resin mixture, and an inorganic additive. The mixture of two curing agents is formed by mixing a phenolphthalein modified benzoxazine phenol aldehyde curing agent and an amino triazine novolak, and the epoxy resin mixture is formed by mixing an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and a Bisphenol F epoxy resin.
摘要翻译：提供了一种不含卤素和无磷的热固性树脂组合物，其主要是通过混合两种固化剂，环氧树脂混合物和无机添加剂的混合物形成的清漆树脂。通过混合酚酞改性苯并恶嗪酚醛固化剂和氨基三嗪酚醛清漆形成两种固化剂的混合物，环氧树脂混合物通过将具有恶唑烷酮环或聚酰胺 - 酰亚胺改性的环氧树脂的环氧树脂和双酚F环氧树脂。

2. 发明申请

US20120129414A1 THERMOSETTING RESIN COMPOSITION AND PREPREG OR LAMINATE USING THE SAME 审中-公开
标题翻译：使用相同的热固性树脂组合物和PREPREG或层压板
公开(公告)号：US20120129414A1
公开(公告)日：2012-05-24
申请号：US12954345
申请日：2010-11-24
申请人： Chung-Hao CHANG , Hsiu-Lien Wu , Han-Shiang Huag , Chia-Hsiu Yeh
发明人： Chung-Hao CHANG , Hsiu-Lien Wu , Han-Shiang Huag , Chia-Hsiu Yeh
IPC分类号： B32B5/02 , C08K3/22 , C08K3/36 , B32B27/38 , C08K3/28 , C08K3/38 , C08K3/34 , C08L63/00 , C08K7/18
CPC分类号： C08K3/22 , B32B15/14 , B32B2260/021 , B32B2260/046 , C08G59/1422 , C08G59/1477 , C08G59/4276 , C08J5/24 , C08J2363/00 , C08K3/28 , C08K3/34 , C08K3/36 , C08K3/38 , C08K7/18 , Y10T428/31529 , Y10T442/20 , Y10T442/2951
摘要： A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.
摘要翻译：提供热固性树脂组合物和使用其的预浸料或层压材料。热固性树脂组合物包括环氧树脂和固化剂，其中固化剂是由多官能芳族聚酯固化剂与酚酞苯并恶嗪酚醛或聚（苯乙烯共聚物）组合形成的双固化剂体系 - 马来酸酐）。将有机或无机纤维增强材料用热固性树脂组合物浸渍以形成预浸料坯，并将预浸料坯与设置在其上的金属箔粘合到基材上以形成层压体。

3. 发明申请

US20110077337A1 METHOD FOR PREPARING A HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS 审中-公开
标题翻译：制备高导热性和低消耗因子的方法粘合剂用于建立附加绝缘层
公开(公告)号：US20110077337A1
公开(公告)日：2011-03-31
申请号：US12567255
申请日：2009-09-25
申请人： Yun-Chao YEH , Chung-Hao CHANG , Cheng-Nan YEN , Li-Hung LIU
发明人： Yun-Chao YEH , Chung-Hao CHANG , Cheng-Nan YEN , Li-Hung LIU
IPC分类号： C08K3/34 , C08K3/28 , C08K3/38 , C08K3/22 , C08K3/14
CPC分类号： C08G59/686 , C08G59/18 , C08G59/38 , C08G59/4284 , C08L63/00 , C08L2666/22
摘要： A method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up (combining) additional insulation layers is disclosed, where the adhesive varnish is used for high-density interconnected printed circuit boards or package substrates. The method comprises steps of: selecting at least two epoxy resins from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-free/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin; adding selected epoxy resins into a pre-treatment vessel with a certain ratio; heating and mixing them well to form an epoxy resin precursor; cooling the epoxy resin precursor; during the cooling process, adding a solvent to the epoxy resin precursor to adjust the viscosity of the epoxy resin precursor; adding a bi-hardener solution, a catalyst, a solvent, and a flow modifier and mixing them well with the epoxy resin precursor; adding an inorganic filler with high thermal conductivity and mixing it with the mixture in step (d) in vacuum to obtain a suitable viscosity value; and leaving the mixture in step (e) undisturbed for a period of time to form the high thermal conductivity and low dissipation factor adhesive varnish for build-up (combining) additional insulation layers.
摘要翻译：公开了一种用于制备（组合）附加绝缘层的高热导率和低耗散因子粘合剂清漆的方法，其中粘合剂清漆用于高密度互连的印刷电路板或封装基板。该方法包括以下步骤：从包括三官能环氧树脂，橡胶改性或二聚酸改性环氧树脂，溴化物包含的环氧树脂，无卤素/磷 - 不含环氧树脂，无卤/无磷环氧树脂，长链/无卤素环氧树脂和双酚A（BPA）环氧树脂; 以一定的比例将选定的环氧树脂加入到预处理容器中; 加热混合，形成环氧树脂前体; 冷却环氧树脂前体; 在冷却过程中，向环氧树脂前体添加溶剂以调节环氧树脂前体的粘度; 加入双硬化剂溶液，催化剂，溶剂和流动改性剂，并与环氧树脂前体充分混合; 加入具有高导热性的无机填料，并在真空中将其与步骤（d）中的混合物混合以获得合适的粘度值; 并使步骤（e）中的混合物不受干扰一段时间以形成用于积聚（组合）附加绝缘层的高热导率和低耗散因子粘合剂清漆。

4. 发明申请

US20220192318A1 MOISTURE-PERMEABLE WATERPROOF SHOE 有权
公开(公告)号：US20220192318A1
公开(公告)日：2022-06-23
申请号：US17484391
申请日：2021-09-24
申请人： Chung-Hao CHANG , Chia-Ying Chang
发明人： Chung-Hao CHANG , Chia-Ying Chang
IPC分类号： A43B23/02
摘要： A moisture-permeable waterproof shoe includes a shoe-shaped inner sleeve defining a foot space and having an inclined annular top edge inclining downwardly from a front side to a rear side thereof, and an outer sock body including a main sock body portion that is sleeved on the shoe-shaped inner sleeve, an insertion portion higher than the inclined annular top edge, and an annular sewing portion extending from the insertion portion to the foot space and fixed to the shoe-shaped inner sleeve. The insertion portion defines an insertion opening communicating with the foot space, and has opposite front and rear ears, and two side portions connected between the front and rear ears.

5. 发明申请

US20200323304A1 ZIPPER-FREE MOISTURE-PERMEABLE WATERPROOF HIGH-TOP SHOE 审中-公开
公开(公告)号：US20200323304A1
公开(公告)日：2020-10-15
申请号：US16426653
申请日：2019-05-30
申请人： Chung-Hao CHANG , Chia-Ying CHANG
发明人： Chung-Hao CHANG , Chia-Ying CHANG
IPC分类号： A43B7/12 , A43C9/00 , A43B23/02
摘要： A zipper-free moisture-permeable waterproof high-top shoe includes a high-top inner sock body having a first foot portion and a first leg portion cooperating with each other to define a foot space. A moisture-permeable waterproof high-top shoe-like sleeve is sleeved on the high-top inner sock body and has a second foot portion. A moisture-permeable waterproof low-top shoe-like sleeve is sleeved on the second foot portion and has a sleeve body. A high-top outer sock body is sleeved on an assembly of the inner sock body, the high-top shoe-like sleeve and the low-top shoe-like sleeve, and has a third foot portion. A sole is fixed to a bottom portion of the third foot portion.

6. 发明申请

US20220338598A1 METHOD FOR MAKING MOISTURE-PERMEABLE WATERPROOF SHOE HAVING INTEGRALLY FORMED UPPER 有权
公开(公告)号：US20220338598A1
公开(公告)日：2022-10-27
申请号：US17374629
申请日：2021-07-13
申请人： Chung-Hao CHANG , Chia-Ying CHANG
发明人： Chung-Hao CHANG , Chia-Ying CHANG
IPC分类号： A43D95/02
摘要： A method for making a moisture-permeable waterproof shoe includes: (A) sleeving an inner sleeve unit on a last; (B) coating a bonding agent on an inner surface of an upper unit; (C) sleeving the upper unit on an assembly of the inner sleeve unit and the last; (D) placing an assembly of the upper unit, the inner sleeve unit and the last in a heating device; (E) placing the assembly in a vacuum bag; (F) placing the vacuum bag in a freezing device; (G) removing the assembly from the vacuum bag; (H) pulling out the last from the inner sleeve unit; and (I) fixing a sole to a bottom portion of a three-dimensional upper structure.

7. 发明申请

US20220338597A1 SHOE HAVING INTEGRALLY FORMED UPPER 有权
公开(公告)号：US20220338597A1
公开(公告)日：2022-10-27
申请号：US17374599
申请日：2021-07-13
申请人： Chung-Hao CHANG , Chia-Ying CHANG
发明人： Chung-Hao CHANG , Chia-Ying CHANG
IPC分类号： A43B23/02 , A43B3/00
摘要： A shoe is suitable to be made in cooperation with a last having a wear forming portion with a forming volume, and includes an upper unit having a bottom surface and a peripheral surface cooperatively defining a foot space that has a top open end for entry of the wear forming portion and that has a volume smaller than the forming volume of the wear forming portion by 5-10%. The upper unit has a toe stitching portion and a heel stitching portion located on the bottom surface of the upper unit. A sole is fixedly disposed on the bottom surface of the upper unit.

8. 发明申请

US20110073798A1 HIGH THERMAL CONDUCTIVITY AND LOW DISSIPATION FACTOR ADHESIVE VARNISH FOR BUILD-UP ADDITIONAL INSULATION LAYERS 审中-公开
标题翻译：高导热性和低消耗因子粘合剂用于建立额外的绝缘层
公开(公告)号：US20110073798A1
公开(公告)日：2011-03-31
申请号：US12567296
申请日：2009-09-25
申请人： Yun-Chao YEH , Chung-Hao CHANG , Cheng-Nan YEN , Li-Hung LIU
发明人： Yun-Chao YEH , Chung-Hao CHANG , Cheng-Nan YEN , Li-Hung LIU
IPC分类号： C09K5/00
CPC分类号： C08G59/56 , C08K3/00 , C08L63/00 , C08L2205/02 , C09J163/00 , H05K1/0353 , H05K3/4676 , H05K2201/0209 , H05K2201/0358
摘要： A high thermal conductivity and low dissipation factor adhesive varnish for (build-up) combining additional insulation layers is disclosed to be used for high-density interconnected printed circuit boards or IC-package substrates and to be formed by well mixing an epoxy resin precursor, a bi-hardener mixture, a catalyst, a flow modifier, an inorganic filler with high thermal conductivity, and a solvent. The epoxy resin precursor is formed by mixing at least two epoxy resins with a certain ratio, where the at least two epoxy resins are selected from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-free/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin.
摘要翻译：公开了高密度互连印刷电路板或IC封装基板的高导热性和低耗散因数粘合剂清漆（积聚）组合附加绝缘层，并且通过将环氧树脂前体，双硬化剂混合物，催化剂，流动改性剂，具有高导热性的无机填料和溶剂。环氧树脂前体是通过混合至少两种一定比例的环氧树脂形成的，其中至少两种环氧树脂选自三官能环氧树脂，橡胶改性或二聚酸改性环氧树脂，含溴化物的环氧树脂，无卤素/含磷环氧树脂，无卤素/无磷环氧树脂，长链/无卤环氧树脂和双酚A（BPA）环氧树脂。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式