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1. 发明授权

US07511261B2 Image sensor module structure with lens holder having vertical inner and outer sidewalls 失效
标题翻译：图像传感器模块结构，透镜架具有垂直的内侧壁和外侧壁
公开(公告)号：US07511261B2
公开(公告)日：2009-03-31
申请号：US10923908
申请日：2004-08-21
申请人： Chung Hsien Hsin , Tony Wang , Figo Hsieh , Chin Hai Chou
发明人： Chung Hsien Hsin , Tony Wang , Figo Hsieh , Chin Hai Chou
IPC分类号： H01L23/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The chip is mounted on the upper surface, and is electrically connected to the first electrodes. The lens holder has an upper end face, a lower end face, and an opening penetrating through the lens holder. The upper end portion of the opening is formed with an internal thread, and the lower end portion of the opening is formed with a breach. The lens holder is adhered on the upper surface by glue. The photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.
摘要翻译：图像传感器模块结构包括基板，感光芯片，透镜保持架和镜筒。基板具有形成有第一电极的上表面和形成有第二电极的下表面。芯片安装在上表面上，并与第一电极电连接。透镜架具有上端面，下端面以及穿透透镜保持架的开口。开口的上端部形成有内螺纹，开口部的下端部形成有突出部。透镜架通过胶粘在上表面。感光芯片位于透镜架的开口内。透镜镜筒具有上端面，下端面和螺纹连接到透镜保持架的内螺纹的外螺纹。

2. 发明授权

US07064404B1 Image sensor structure 有权
标题翻译：图像传感器结构
公开(公告)号：US07064404B1
公开(公告)日：2006-06-20
申请号：US11052990
申请日：2005-02-07
申请人： Chung Hsien Hsin , Tony Wang , Worrell Tsai , Figo Hsieh , Wei Chang , Jun Jie Yen
发明人： Chung Hsien Hsin , Tony Wang , Worrell Tsai , Figo Hsieh , Wei Chang , Jun Jie Yen
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203 , H01L23/10 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/16195 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An image sensor structure includes a substrate, four posts, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The four posts are arranged on the four angle of the upper surface of the substrate individually. The photosensitive chip is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrodes of the substrate. The glue layer is surrounded to the periphery of the upper surface of the substrate for surrounding the photosensitive chip, and covered the part of the wires. The transparent layer is arranged onto the four posts and the glue layer to cover the photosensitive chip.
摘要翻译：图像传感器结构包括基板，四个柱，感光芯片，多个导线，胶层和透明层。基板具有形成有第一电极的上表面和形成有第二电极的下表面。四个柱分别布置在基板的上表面的四个角度上。感光芯片安装在基板的上表面上。多个导线将感光芯片电连接到基板的第一电极。胶层被包围在基片的上表面周围，用于包围感光芯片，并覆盖电线的一部分。透明层布置在四个柱和胶层上以覆盖感光芯片。

3. 发明授权

US07196322B1 Image sensor package 有权
标题翻译：图像传感器封装
公开(公告)号：US07196322B1
公开(公告)日：2007-03-27
申请号：US10961649
申请日：2004-10-08
申请人： Chung Hsien Hsin , Figo Hsieh , Wei Chang
发明人： Chung Hsien Hsin , Figo Hsieh , Wei Chang
IPC分类号： H01L23/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An image sensor module includes a substrate, frame layer, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface, and a lower surface on which second electrodes are formed. The frame layer is arranged on the upper surface of the substrate, a cavity formed between the frame layer and substrate. The photosensitive chip is mounted on the upper surface of the substrate and located within the cavity. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder from the upper end face to the lower end face, the upper end of the opening is formed with an internal thread and the lower end of the opening is formed with a breach, so that the internal diameter of the upper end of the opening is smaller than the lower end of the opening, the lens holder is adhered on the upper surface of the substrate by glue, therefore, the frame layer is located within the breach of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread is screwed to the internal thread of the lens holder.
摘要翻译：图像传感器模块包括基板，框架层，感光芯片，透镜保持架和镜筒。基板具有上表面和形成有第二电极的下表面。框架层布置在基板的上表面上，在框架层和基板之间形成空腔。感光芯片安装在基板的上表面上并位于空腔内。透镜架具有上端面，下下表面和从上端面向下端面贯穿透镜保持架的开口，开口的上端形成有内螺纹，下端开口形成有裂缝，使得开口的上端的内径小于开口的下端，透镜保持器通过胶粘在基板的上表面上，因此，框架层位于透镜架的突破之内。镜筒具有上端面，下端面，外螺纹与透镜保持架的内螺纹螺纹连接。

4. 发明授权

US08314481B2 Substrate structure for an image sensor package and method for manufacturing the same 有权
标题翻译：用于图像传感器封装的基板结构及其制造方法
公开(公告)号：US08314481B2
公开(公告)日：2012-11-20
申请号：US11131727
申请日：2005-05-18
申请人： Chung Hsien Hsin , Yves Huang , Kevin Chang , Chief Lin
发明人： Chung Hsien Hsin , Yves Huang , Kevin Chang , Chief Lin
IPC分类号： H01L23/06
CPC分类号： H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A substrate structure for an image sensor package includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes. An insulation layer is coated between the first electrodes and in direct surface contact with the upper surface of the bottom base. A frame layer is arranged on and in direct surface contact with the first electrodes and the insulation layer to form a cavity together with the bottom base. The insulation layer is interposed between the bottom base and the frame layer.
摘要翻译：用于图像传感器封装的衬底结构包括底部底座和框架层。底部底部具有形成有多个第一电极的上表面和形成有多个第二电极的下表面。绝缘层涂覆在第一电极之间并且直接与底部底部的上表面接触。框架层布置成与第一电极和绝缘层直接表面接触以与底部底部一起形成空腔。绝缘层位于底部底座和框架层之间。

5. 发明授权

US06876544B2 Image sensor module and method for manufacturing the same 有权
公开(公告)号：US06876544B2
公开(公告)日：2005-04-05
申请号：US10621962
申请日：2003-07-16
申请人： Chung Hsien Hsin
发明人： Chung Hsien Hsin
IPC分类号： H04N5/225 , H05K5/00 , H05K7/00
CPC分类号： H04N5/2254 , H01L31/02325 , H04N5/2253
摘要： An image sensor module and a method for manufacturing the same. The image sensor module includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround the photosensitive chip, and a lens barrel formed with a chamber at a center thereof and an external thread at an outer edge thereof. An inner edge of the frame layer is formed with an internal thread, and a transparent layer is fixed by the frame layer such that the photosensitive chip may receive optical signals passing through the transparent layer. The external thread is screwed to the internal thread of the frame layer. The lens barrel has a through hole and an aspheric lens from top to bottom.

6. 发明授权

US07368795B2 Image sensor module with passive component 失效
标题翻译：具有无源元件的图像传感器模块
公开(公告)号：US07368795B2
公开(公告)日：2008-05-06
申请号：US11317071
申请日：2005-12-22
申请人： Chung Hsien Hsin
发明人： Chung Hsien Hsin
IPC分类号： H01L27/14 , H01L23/02
CPC分类号： H01L27/14618 , H01L25/167 , H01L27/14625 , H01L27/14636 , H01L31/0203 , H01L31/02162 , H01L31/0232 , H01L2224/48091 , H01L2224/48227 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/19103 , H05K1/189 , H05K2201/10515 , H01L2924/00014
摘要： An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second surface and a penetrated hole. The second surface of the substrate is mounted on the upper surface of the circuit board so that the passive component is located within the penetrated hole. A chip is mounted on the first surface of the substrate, and is located onto the penetrated hole. Wires are electrically connected to the chip and the substrate. A lens holder is mounted on the first surface of the substrate and formed with an internal thread. A lens barrel is formed with an external thread screwed on the internal thread and is formed with an opening, an aspheric lens and an infrared filter.
摘要翻译：图像传感器模块包括具有上表面的柔性印刷电路板，其形成有电路和下表面。无源元件布置在电路板的上表面上。基板具有第一表面，第二表面和穿透孔。基板的第二表面安装在电路板的上表面上，使得被动部件位于穿透孔内。芯片安装在基板的第一表面上，并且位于穿透孔上。电线电连接到芯片和基板。透镜架安装在基板的第一表面上并形成有内螺纹。镜筒形成有螺纹拧在内螺纹上的外螺纹，并形成有开口，非球面透镜和红外过滤器。

7. 发明授权

US06874227B2 Method for packaging an image sensor 失效
标题翻译：包装图像传感器的方法
公开(公告)号：US06874227B2
公开(公告)日：2005-04-05
申请号：US10454649
申请日：2003-06-03
申请人： Chung Hsien Hsin , Hsiu-Wen Tu , Jason Chuang , Irving You
发明人： Chung Hsien Hsin , Hsiu-Wen Tu , Jason Chuang , Irving You
IPC分类号： G01R1/00 , H01L27/146 , H05K3/30
CPC分类号： H01L27/14685 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49169 , H01L2924/00014
摘要： A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.
摘要翻译：包装图像传感器的方法包括以下步骤：提供具有上表面和下表面的基底; 将框架层安装到基板的上表面以与基板一起形成室; 将光敏芯片安装到基板的上表面和室内，并将感光芯片电连接到基板上; 在其间施加B阶粘合剂将透明层安装到框架层; 预烘烤B阶粘合剂以将透明层稍微粘附到框架层; 测试图像传感器以确定图像传感器是否通过或失败; 并且对通过的图像传感器进行后烘烤以完全固化B级粘合剂，使得透明层牢固地粘附到框架层。

8. 发明授权

US06791842B2 Image sensor structure 失效
标题翻译：图像传感器结构
公开(公告)号：US06791842B2
公开(公告)日：2004-09-14
申请号：US10292981
申请日：2002-11-12
申请人： Chung Hsien Hsin
发明人： Chung Hsien Hsin
IPC分类号： H05K100
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
摘要： An image sensor includes a substrate, a frame layer, signal input terminals, a photosensitive chip, a transparent layer, a plurality of wires and a glue layer. The substrate has a first surface and a second surface. The frame layer is placed on the first surface to form a cavity together with the substrate. The signal input terminals are formed on the frame layer. The photosensitive chip has plural bonding pads, and is placed on the first surface of the substrate and positioned within the cavity. The transparent layer is placed over the frame layer to define, in the cavity, at least one exposure area through which the bonding pads of the photosensitive chip are exposed. The wires penetrate through the exposure area and electrically connect the bonding pads to the signal input terminals. The glue layer covers the exposure area to seal the plurality of wires.
摘要翻译：图像传感器包括基板，框架层，信号输入端子，感光芯片，透明层，多根电线和胶层。基板具有第一表面和第二表面。框架层被放置在第一表面上以与基底一起形成空腔。信号输入端子形成在框架层上。感光芯片具有多个接合焊盘，并且被放置在基板的第一表面上并且位于空腔内。透明层被放置在框架层之上，以在空腔中限定感光芯片的接合焊盘露出的至少一个曝光区域。电线穿过曝光区域并将接合焊盘电连接到信号输入端子。胶层覆盖曝光区域以密封多根电线。

9. 发明授权

US07423334B2 Image sensor module with a protection layer and a method for manufacturing the same 有权
标题翻译：具有保护层的图像传感器模块及其制造方法
公开(公告)号：US07423334B2
公开(公告)日：2008-09-09
申请号：US11283596
申请日：2005-11-17
申请人： Hsiu Wen Tu , Chen Pin Peng , Mon Nan Ho , Chung Hsien Hsin
发明人： Hsiu Wen Tu , Chen Pin Peng , Mon Nan Ho , Chung Hsien Hsin
IPC分类号： H01L23/02 , H01L29/22
CPC分类号： H01L27/14625 , H01L23/10 , H01L23/3157 , H01L27/14618 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.
摘要翻译：具有保护层的图像传感器模块及其制造方法包括具有上表面和下表面的基板，芯片安装在基板的上表面上，多条导线电连接到芯片到基板的第一电极，粘合层涂覆在基板的上表面上，透镜保持器具有侧壁，保护层和内螺纹，侧壁粘附在基板的上表面上通过粘附层封装芯片，使得保护层位于与芯片的传感器区域相邻的位置，以防止粘附层流到芯片的传感器区域; 并且透镜筒形成有拧在透镜架的内螺纹上的外螺纹。

10. 发明授权

US07402839B2 Image sensor package structure 有权
标题翻译：图像传感器封装结构
公开(公告)号：US07402839B2
公开(公告)日：2008-07-22
申请号：US11378794
申请日：2006-03-16
申请人： Chung Hsien Hsin
发明人： Chung Hsien Hsin
IPC分类号： H01L33/00
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
摘要： An image sensor package structure includes a plastic substrate, frame layer, a chip, wires, a transparent layer, and an encapsulate layer. The plastic substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes. The frame layer is arranged on the upper surface of the plastic substrate, a cavity is formed between the plastic substrate and the frame layer. The chip is mounted on the upper surface of the plastic substrate, and is located within the cavity. The plurality of wires are electrically connected the chip to the first electrodes of the plastic substrate. The transparent layer is mounted on the frame layer to cover the chip. And the encapsulate layer is encapsulated the frame layer, and is covered on the periphery the transparent layer.
摘要翻译：图像传感器封装结构包括塑料基板，框架层，芯片，布线，透明层和封装层。塑料基板具有形成有第一电极的上表面和形成有第二电极的下表面。框架层布置在塑料基板的上表面上，在塑料基板和框架层之间形成空腔。芯片安装在塑料基板的上表面上，并位于模腔内。多个电线将芯片电连接到塑料基板的第一电极。透明层安装在框架层上以覆盖芯片。并且封装层被封装在框架层上，并且在周边覆盖透明层。

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