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1. 发明授权

US07915135B2 Method of making multi-layer structure for metal-insulator-metal capacitor 有权
标题翻译：制造金属绝缘子金属电容器多层结构的方法
公开(公告)号：US07915135B2
公开(公告)日：2011-03-29
申请号：US12432772
申请日：2009-04-30
申请人： Chun-Kai Wang , Chun-Chih Huang , Chun-Ming Wu
发明人： Chun-Kai Wang , Chun-Chih Huang , Chun-Ming Wu
IPC分类号： H01L21/20 , H01L21/8242
CPC分类号： H01L28/75 , Y10T29/43
摘要： The present invention discloses a method of making a multi-layer structure for metal-insulator-metal capacitors, in which, a bottom electrode plate layer is formed on a substrate, wherein a Ti/TiN layer serving as a top anti-reflection coating (top ARC) of the bottom electrode plate layer including a titanium layer and a titanium nitride layer formed on the titanium layer is formed using a first and a second physical vapor deposition (PVD) processes at a temperature ranging from 25 to 400° C., and then a first capacitor dielectric layer, a middle electrode plate layer, a second capacitor dielectric layer, and a top electrode plate layer are formed on the bottom electrode plate layer in an order from bottom to top.
摘要翻译：本发明公开了一种金属 - 绝缘体 - 金属电容器的多层结构的制造方法，其中，在基板上形成有底部电极板层，其中，作为顶部防反射膜的Ti / TiN层（使用在25〜400℃的温度范围内的第一和第二物理气相沉积（PVD）工艺形成包括形成在钛层上的钛层和氮化钛层的底部电极板层的底部电极板层的顶部ARC）然后从底部到顶部的顺序，在底部电极板层上形成第一电容器电介质层，中间电极板层，第二电容器电介质层和顶部电极板层。

2. 发明申请

US20100279484A1 Method of making multi-layer structure for metal-insulator-metal capacitor 有权
标题翻译：制造金属绝缘子金属电容器多层结构的方法
公开(公告)号：US20100279484A1
公开(公告)日：2010-11-04
申请号：US12432772
申请日：2009-04-30
申请人： Chun-Kai Wang , Chun-Chih Huang , Chun-Ming Wu
发明人： Chun-Kai Wang , Chun-Chih Huang , Chun-Ming Wu
IPC分类号： H01L21/02
CPC分类号： H01L28/75 , Y10T29/43
摘要： The present invention discloses a method of making a multi-layer structure for metal-insulator-metal capacitors, in which, a bottom electrode plate layer is formed on a substrate, wherein a Ti/TiN layer serving as a top anti-reflection coating (top ARC) of the bottom electrode plate layer including a titanium layer and a titanium nitride layer formed on the titanium layer is formed using a first and a second physical vapor deposition (PVD) processes at a temperature ranging from 25 to 400° C., and then a first capacitor dielectric layer, a middle electrode plate layer, a second capacitor dielectric layer, and a top electrode plate layer are formed on the bottom electrode plate layer in an order from bottom to top.
摘要翻译：本发明公开了一种金属 - 绝缘体 - 金属电容器的多层结构的制造方法，其中，在基板上形成有底部电极板层，其中，作为顶部防反射膜的Ti / TiN层（使用在25〜400℃的温度范围内的第一和第二物理气相沉积（PVD）工艺形成包括形成在钛层上的钛层和氮化钛层的底部电极板层的底部电极板层的顶部ARC）然后从底部到顶部的顺序，在底部电极板层上形成第一电容器电介质层，中间电极板层，第二电容器电介质层和顶部电极板层。

3. 发明申请

US20130089534A1 METHODS FOR ASSISTING ANTI-CANCER DRUGS 有权
标题翻译：协助抗癌药物的方法
公开(公告)号：US20130089534A1
公开(公告)日：2013-04-11
申请号：US13594569
申请日：2012-08-24
申请人： Wen-Li Yeh , Chun-Chih Huang
发明人： Wen-Li Yeh , Chun-Chih Huang
IPC分类号： A61K38/44 , A61P35/00
CPC分类号： A61K38/44 , A61K36/07 , A61K2236/19
摘要： A method for assisting an anti-cancer drug comprising administrating an effective amount of Antrodia camphorata fermentation solution to improve life quality of patient suffering from cancers after chemotherapy is provided.
摘要翻译：提供一种辅助抗癌药物的方法，其包括施用有效量的樟芝发酵溶液以改善化疗后患癌症患者的生命质量。

4. 发明授权

US06667888B1 Cassette structure with a card connector 失效
标题翻译：带有卡连接器的盒式结构
公开(公告)号：US06667888B1
公开(公告)日：2003-12-23
申请号：US10224611
申请日：2002-08-21
申请人： Cheng-Tsai Chang , Chin-Fa Lee , Chun-Chih Huang
发明人： Cheng-Tsai Chang , Chin-Fa Lee , Chun-Chih Huang
IPC分类号： H05K114
CPC分类号： H05K5/0269
摘要： A structure of the cassette with a card connector is disclosed. The cassette comprises a chassis, an upper metallic board, a lid, and a bottom metallic board. The upper metallic board is detachably mounted onto the top of the chassis by engaging a plurality of fitting elements of the upper metallic board with the receiving cavities and slots of the chassis. The slot of the lid is slid into the groove of the chassis, until the protruded shafts of the lid fits into the corresponding receiving cavities on the chassis, and a front part of the lid stacks on a distal plate of the upper metallic board for securely coupling the upper metallic board onto the chassis. Thus, the present invention not only allows the repair, or replacement of parts of the PCB, or the replacement of the PCB, but also reuse of the parts of the cassette.
摘要翻译：公开了具有卡连接器的盒的结构。盒子包括底盘，上金属板，盖子和底部金属板。上金属板通过将上金属板的多个装配元件与底盘的接收腔和槽接合而可拆卸地安装在底盘的顶部上。盖的槽滑入底盘的槽中，直到盖的突出的轴适配到底盘上相应的接收腔中，并且盖的前部在上金属板的远侧板上堆叠，以便安全地将上金属板连接到底盘上。因此，本发明不仅允许修复或更换PCB的部件或更换PCB，而且还可以重新使用盒的部件。

5. 发明申请

US20130105943A1 PACKAGING SUBSTRATE HAVING EMBEDDED CAPACITORS AND FABRICATION METHOD THEREOF 有权
标题翻译：具有嵌入式电容器的封装基板及其制造方法
公开(公告)号：US20130105943A1
公开(公告)日：2013-05-02
申请号：US13458059
申请日：2012-04-27
申请人： Chien-Kuang Lai , Chun-Chih Huang
发明人： Chien-Kuang Lai , Chun-Chih Huang
IPC分类号： H01L27/08 , H01L21/50
CPC分类号： H01G4/30 , H01L23/49822 , H01L23/49827 , H01L23/642 , H01L28/40 , H01L2924/0002 , H05K1/185 , H05K3/4602 , H05K2201/10015 , H05K2201/10515 , H01L2924/00
摘要： A packaging substrate includes: a substrate having a core layer, a cavity penetrating the core layer and circuit layers formed on surfaces of the core layer; a first capacitor disposed in the cavity; a bonding layer formed on the first capacitor in the cavity of the substrate; a second capacitor disposed on the bonding layer so as to be received in the cavity; and a dielectric layer formed on the substrate and in the cavity for covering the first and second capacitors. By stacking the first and second capacitors in the cavity through the bonding layer, the single core layer is embedded with two layers of the capacitors to thereby meet the multi-function requirement.
摘要翻译：封装基板包括：具有芯层的基板，穿透芯层的空腔和形成在芯层表面上的电路层; 设置在所述空腔中的第一电容器; 形成在所述基板的空腔中的所述第一电容器上的接合层; 设置在所述接合层上以便容纳在所述空腔中的第二电容器; 以及形成在所述基板上和所述空腔中的用于覆盖所述第一和第二电容器的电介质层。通过结合层将空腔中的第一和第二电容器堆叠起来，单芯层嵌有两层电容器，从而满足多功能要求。

6. 发明申请

US20110085349A1 OPTICAL FILM AND BACK LIGHT MODULE 有权
标题翻译：光学薄膜和背光模组
公开(公告)号：US20110085349A1
公开(公告)日：2011-04-14
申请号：US12576247
申请日：2009-10-09
申请人： Zhi-Ting Ye , Chun-Chih Huang
发明人： Zhi-Ting Ye , Chun-Chih Huang
IPC分类号： F21V7/22 , F21V11/00
CPC分类号： G02B5/0231 , G02B6/0053 , G02B6/0055 , G02F1/133615 , G02F2001/133607
摘要： An optical film includes a body and a plurality of first linear protrusions. The body has a first surface and a second surface opposite to the first surface. The first linear protrusions are disposed on the first surface, and each first linear protrusion is extended along a first direction and has a first curvy ridge line departing from the first surface, wherein the first curvy ridge lines are concave towards a fixed direction. When the first curvy ridge line is located on a suppositional plan, the suppositional plan is not parallel to the first surface. The above-mentioned optical film is not easy to be worn.
摘要翻译：光学膜包括主体和多个第一直线突起。主体具有与第一表面相对的第一表面和第二表面。第一直线突起设置在第一表面上，并且每个第一直线突起沿着第一方向延伸并且具有从第一表面离开的第一弯曲脊线线，其中第一弯曲脊线朝向固定方向凹入。当第一弯曲脊线位于假想计划时，假想平面不平行于第一表面。上述光学膜不易磨损。

7. 发明授权

US08610250B2 Packaging substrate having embedded capacitors and fabrication method thereof 有权
标题翻译：具有嵌入式电容器的封装基板及其制造方法
公开(公告)号：US08610250B2
公开(公告)日：2013-12-17
申请号：US13458059
申请日：2012-04-27
申请人： Chien-Kuang Lai , Chun-Chih Huang
发明人： Chien-Kuang Lai , Chun-Chih Huang
IPC分类号： H01L21/02
CPC分类号： H01G4/30 , H01L23/49822 , H01L23/49827 , H01L23/642 , H01L28/40 , H01L2924/0002 , H05K1/185 , H05K3/4602 , H05K2201/10015 , H05K2201/10515 , H01L2924/00
摘要： A packaging substrate includes: a substrate having a core layer, a cavity penetrating the core layer and circuit layers formed on surfaces of the core layer; a first capacitor disposed in the cavity; a bonding layer formed on the first capacitor in the cavity of the substrate; a second capacitor disposed on the bonding layer so as to be received in the cavity; and a dielectric layer formed on the substrate and in the cavity for covering the first and second capacitors. By stacking the first and second capacitors in the cavity through the bonding layer, the single core layer is embedded with two layers of the capacitors to thereby meet the multi-function requirement.
摘要翻译：封装基板包括：具有芯层的基板，穿透芯层的空腔和形成在芯层表面上的电路层; 设置在所述空腔中的第一电容器; 形成在所述基板的空腔中的所述第一电容器上的接合层; 设置在所述接合层上以便容纳在所述空腔中的第二电容器; 以及形成在所述基板上和所述空腔中的用于覆盖所述第一和第二电容器的电介质层。通过结合层将空腔中的第一和第二电容器堆叠起来，单芯层嵌有两层电容器，从而满足多功能要求。

8. 发明申请

US20130075035A1 CUSHION MATERIAL FOR HOT-PRESS AND USE OF THE SAME 审中-公开
标题翻译：用于热压及其使用的衬垫材料
公开(公告)号：US20130075035A1
公开(公告)日：2013-03-28
申请号：US13309588
申请日：2011-12-02
申请人： Chun-Chih Huang
发明人： Chun-Chih Huang
IPC分类号： D04H3/105 , B32B37/00
CPC分类号： B32B37/10 , B30B15/061 , B32B2037/266 , D04H1/4342 , D04H1/4374 , D04H1/46 , Y10T442/682
摘要： A cushion material for a hot-press is provided. The cushion material comprises: a substrate; and a fiber material, the thermal conductivity coefficient of which is lower than about 0.15 W/m·K at about 20° C. and increases with increasing temperature, for example, the thermal conductivity coefficient may be higher than about 0.20 W/m·K at about 160° C., wherein the fiber material is needle-punched on the substrate.
摘要翻译：提供了一种用于热压机的缓冲材料。衬垫材料包括：衬底; 和在约20℃下的导热系数低于约0.15W / m·K的纤维材料，并且随温度升高而增加，例如导热系数可高于约0.20W / m· K在约160℃，其中纤维材料被针刺在基底上。

9. 发明申请

US20110242749A1 Electronic Device 审中-公开
标题翻译：电子设备
公开(公告)号：US20110242749A1
公开(公告)日：2011-10-06
申请号：US12868115
申请日：2010-08-25
申请人： Chun-Chih Huang , Te-Sen Chin , Jeng-Hong Chen , Po-An Lin
发明人： Chun-Chih Huang , Te-Sen Chin , Jeng-Hong Chen , Po-An Lin
IPC分类号： G06F1/16
CPC分类号： G06F1/1616
摘要： An electronic device is described. The electronic device includes an upper cover and a base. The upper cover includes at least one supporting beam formed in an inner surface thereof and positioned corresponding to at least one boundary of a cavity region of the base. The width of the supporting beam is more than three times of the thickness of the upper cover. In addition, a distance between the edge of the supporting beam and the cavity boundary is less than 10 mm.
摘要翻译：描述电子设备。电子设备包括上盖和底座。上盖包括形成在其内表面中的至少一个支撑梁，并且对应于基座的腔区域的至少一个边界定位。支撑梁的宽度是上盖厚度的三倍以上。此外，支撑梁的边缘和空腔边界之间的距离小于10mm。

10. 发明授权

US06900982B2 Multipurposes memory card connector 失效
标题翻译：多用途存储卡连接器
公开(公告)号：US06900982B2
公开(公告)日：2005-05-31
申请号：US10694856
申请日：2003-10-29
申请人： Cheng-Tsai Chang , Chun-Chih Huang , Yu-Hui Chien , Yi-Fen Huang
发明人： Cheng-Tsai Chang , Chun-Chih Huang , Yu-Hui Chien , Yi-Fen Huang
IPC分类号： G06F1/16 , G06F1/18 , H01R27/00
CPC分类号： G06F1/182 , A45C2011/188 , H01R12/721 , H01R27/00
摘要： A multipurpose memory card connector includes an electrically insulative housing defining a front-open receiving open chamber, the housing having a first set of terminals disposed at the rear side inside and second and third sets of terminals disposed near the front open side of the receiving open chamber, and a slide slidably mounted inside the receiving open chamber, the slide having a first stop face disposed at a rear bottom side thereof and second and third stop faces respectively spaced from the first stop face at a distance adapted to receive insertion force from one of a number of memory cards for enabling the slide to be moved in the receiving open chamber at a distance subject to the type of the memory card being inserted into the receiving open chamber.
摘要翻译：多用途存储卡连接器包括限定前开口接收开放室的电绝缘壳体，所述壳体具有设置在后侧内部的第一组端子，以及设置在接收开口的前开口侧附近的第二和第三组端子并且滑动件可滑动地安装在所述接收开放室内部，所述滑块具有设置在其后底侧的第一止动面和分别与所述第一止动面间隔开的距离的第二和第三止动面，所述距离适于接收来自一个的插入力的许多存储卡，用于使得滑块能够在存储卡的类型被插入到接收开放室内的距离处在接收开放室中移动。

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