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1. 发明授权

US07075790B2 Heat dissipating device incorporating clip 失效
标题翻译：散热装置结合夹子
公开(公告)号：US07075790B2
公开(公告)日：2006-07-11
申请号：US10900553
申请日：2004-07-27
申请人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
发明人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.
摘要翻译：散热装置包括散热器（50）和用于将散热器安装到围绕电子部件（65）的保持模块（60）的两个夹子（10）。散热器提供两个肩部（72）。每个夹子包括支撑在一个肩部上的带子（21），具有枢转地连接到带子上的凸轮的杠杆（40），可枢转地连接到带子的相对端部的两个腿部（30），以及两个弹簧指从带的相对端延伸。在组装中，带子被向下按压，并且保持模块推动腿部以便将脚从原始状态转移到强制状态。当腿部到达保持模块的开口时，手指推动腿进入开口。然后，杠杆枢转以推动带子向上移动，从而使腿部牢固地接合在开口中。

2. 发明申请

US20050045311A1 Heat dissipating device incorporating clip 失效
标题翻译：散热装置结合夹子
公开(公告)号：US20050045311A1
公开(公告)日：2005-03-03
申请号：US10900553
申请日：2004-07-27
申请人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Lee , Cheng-Tien Lai , Zhi-Yong Zhou
发明人： Chun-Chi Chen , Xue-Wen Peng , Hsieh Lee , Cheng-Tien Lai , Zhi-Yong Zhou
IPC分类号： H05K7/20 , H01L23/40 , H01L23/467 , F28D15/00
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.
摘要翻译：散热装置包括散热器（50）和用于将散热器安装到围绕电子部件（65）的保持模块（60）的两个夹子（10）。散热器提供两个肩部（72）。每个夹子包括支撑在一个肩部上的带子（21），具有枢转地连接到带子上的凸轮的杠杆（40），可枢转地连接到带子的相对端部的两个腿部（30），以及两个弹簧指从带的相对端延伸。在组装中，带子被向下按压，并且保持模块推动腿部以便将脚从原始状态转移到强制状态。当腿部到达保持模块的开口时，手指推动腿进入开口。然后，杠杆枢转以推动带子向上移动，从而使腿部牢固地接合在开口中。

3. 发明授权

US07327576B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07327576B2
公开(公告)日：2008-02-05
申请号：US11166311
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/0275
摘要： A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together. The evaporating segment and the condensing segment of the at least one heat pipe are movably received in the first and second heat dissipation units respectively before the heat dissipation device is installed to the electronic card device and dissipating heat generated therefrom, and are firmly secured in the first and second heat dissipation units respectively after the heat dissipation device is installed to the electronic card device and dissipate heat generated therefrom.
摘要翻译：一种用于安装和冷却电子卡装置（40）的散热装置包括第一和第二散热单元（10,20）和至少一个热管（30）。散热单元各自包括基板（12,22）和与基板接合的翅片板（14,24）。所述至少一个热管包括容纳在所述基板和所述第一散热单元的翅片之间的蒸发段（32），以及容纳在所述基板和所述翅片板之间的第二散热的冷凝段（34）从而将第一和第二散热单元连接在一起。所述至少一个热管的蒸发段和冷凝段分别可移动地容纳在第一和第二散热单元中，然后将散热装置安装到电子卡装置上并散发由其产生的热量，并牢固地固定在第一和第二散热单元分别在散热装置安装到电子卡装置上并散发由其产生的热量之后。

4. 发明申请

US20060012959A1 Heat dissipation device 失效
公开(公告)号：US20060012959A1
公开(公告)日：2006-01-19
申请号：US10892846
申请日：2004-07-16
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50′) thermally connected to the first heat sink, a second heat pipe (60, 60′) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80′) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.

5. 外观设计

USD509806S1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：USD509806S1
公开(公告)日：2005-09-20
申请号：US29209512
申请日：2004-07-16
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
设计人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen

6. 发明授权

US07019974B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07019974B2
公开(公告)日：2006-03-28
申请号：US10892846
申请日：2004-07-16
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50′) thermally connected to the first heat sink, a second heat pipe (60, 60′) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80′) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.
摘要翻译：散热装置包括安装在视频图形适配器（VGA）卡（70）的一侧上的第一散热器（10），其上安装有发热元件（74）以散发由发热元件产生的热量，安装在所述卡的相对侧上的第二散热器（30），与所述第一散热器热连接的第一热管（50,50'），与所述第一热管分离的第二热管（60,60'），连接到第二散热器，以及连接在第一和第二热管之间的连接构件（80,80'），用于将热量从第一热管传递到第二热管。

7. 发明授权

US07167370B2 Fastener for mounting heat-radiator to electronic device 失效
标题翻译：用于将散热器安装到电子设备的紧固件
公开(公告)号：US07167370B2
公开(公告)日：2007-01-23
申请号：US10950324
申请日：2004-09-23
申请人： Hsieh Kun Lee , Wan-Lin Xia , Xue-Wen Peng , Jin-Song Feng
发明人： Hsieh Kun Lee , Wan-Lin Xia , Xue-Wen Peng , Jin-Song Feng
IPC分类号： H05K7/20 , H01L23/34 , A44B17/00 , F16B13/00
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/306 , H01L2924/00
摘要： A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.
摘要翻译：公开了一种用于将散热器（20）安装到电路板（40）上的电子设备（30）的紧固件（10）。散热器和电路板具有对准的孔（22,44）。紧固件包括具有大直径的上部部分（112）和较小直径的下部（113）的头部（11），围绕头部的下部部分捕获的圆柱形弹簧（14），用于施加弹簧力以及金属线（15），其具有固定在所述头部上的第一端部和弯曲形成接合部分（152）的第二端部。金属丝的接合部压缩地穿过散热器和电路板的对准的孔，并与电路板的下侧接合。

8. 发明申请

US20060291172A1 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US20060291172A1
公开(公告)日：2006-12-28
申请号：US11166311
申请日：2005-06-24
申请人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
发明人： Hsieh-Kun Lee , Xue-Wen Peng , Bing Chen , Rui-Hua Chen
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D15/0275
摘要： A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together. The evaporating segment and the condensing segment of the at least one heat pipe are movably received in the first and second heat dissipation units respectively before the heat dissipation device is installed to the electronic card device and dissipating heat generated therefrom, and are firmly secured in the first and second heat dissipation units respectively after the heat dissipation device is installed to the electronic card device and dissipate heat generated therefrom.
摘要翻译：一种用于安装和冷却电子卡装置（40）的散热装置包括第一和第二散热单元（10,20）和至少一个热管（30）。散热单元各自包括基板（12,22）和与基板接合的翅片板（14,24）。所述至少一个热管包括容纳在所述基板和所述第一散热单元的翅片之间的蒸发段（32），以及容纳在所述基板和所述翅片板之间的第二散热的冷凝段（34）从而将第一和第二散热单元连接在一起。所述至少一个热管的蒸发段和冷凝段分别可移动地容纳在第一和第二散热单元中，然后将散热装置安装到电子卡装置上并散发由其产生的热量，并牢固地固定在第一和第二散热单元分别在散热装置安装到电子卡装置上并散发由其产生的热量之后。

9. 发明授权

US07885073B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07885073B2
公开(公告)日：2011-02-08
申请号：US12482405
申请日：2009-06-10
申请人： Xue-Wen Peng , Jun-Hai Li
发明人： Xue-Wen Peng , Jun-Hai Li
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.
摘要翻译：散热装置适用于从其上具有多个处理器的附加卡产生的热量。散热装置包括蒸气室和安装构件。蒸气室与处理器热接触。安装构件安装在蒸气室的底表面上。多个螺钉延伸穿过附加卡并与安装构件接合以将附加卡上的蒸气室组装。

10. 发明授权

US07382621B2 Video graphics array (VGA) card assembly 有权
标题翻译：视频图形阵列（VGA）卡组合
公开(公告)号：US07382621B2
公开(公告)日：2008-06-03
申请号：US11307109
申请日：2006-01-24
申请人： Xue-Wen Peng , Rui-Hua Chen
发明人： Xue-Wen Peng , Rui-Hua Chen
IPC分类号： H05K7/20 , H01L23/34 , F24H3/02
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A VGA card assembly comprises a VGA card (10) having a socket (13) thereon. A GPU (11) is attached on the socket. A base plate (22) is located on the VGA card and contacts with the GPU, for dissipating heat generated by the GPU. A back plate (30) is located below the VGA card, for supporting the VGA card. The back plate has studs extend upwardly through the VGA card. Fasteners extend downwardly through the socket to threadedly engage with the studs. Screws extend downwardly through the base plate to threadedly engage with the fasteners. A heat dissipation device including a fan, a heat pipe, fins and a lid is removably mounted on the base plate.
摘要翻译： VGA卡组件包括其上具有插座（13）的VGA卡（10）。 GPU（11）连接在插座上。基板（22）位于VGA卡上并与GPU接触，以消散由GPU产生的热量。背板（30）位于VGA卡下方，用于支持VGA卡。后板有螺柱向上延伸穿过VGA卡。紧固件通过插座向下延伸以与螺柱螺纹接合。螺钉向下延伸穿过底板以与紧固件螺纹接合。包括风扇，热管，翅片和盖的散热装置可拆卸地安装在基板上。

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