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1. 发明申请

US20070263358A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070263358A1
公开(公告)日：2007-11-15
申请号：US11308847
申请日：2006-05-15
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/467 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.
摘要翻译：散热装置包括与中央处理单元接触的主散热器（10）和附接在与中央处理单元相邻的发热电子元件上的二次散热器（20）。主散热器包括设置在基座中间的基座（12）和散热部分（14）。二次散热器包括基板（22）和布置在基板上的多个翅片组件（24）。底座被放置在基板上，翅片组件布置在散热部分周围。主散热器部分地叠置在具有紧凑结构的二次散热器上。散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。

2. 发明申请

US20070000646A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 审中-公开
标题翻译：热管散热装置
公开(公告)号：US20070000646A1
公开(公告)日：2007-01-04
申请号：US11164592
申请日：2005-11-30
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes a U-shaped first portion, a second portion and a connecting portion interconnecting the first and second portions. The first portion of the heat pipe thermally engages the base. The second portion of the heat pipe is located above the base, and thermally engages with the plurality of fins.
摘要翻译：散热装置用于与发热电子装置接触以从电子装置移除热量。散热装置包括基座，布置在基座上的多个翅片和至少一个热定位在基座上的热管。热管包括U形第一部分，第二部分和互连第一和第二部分的连接部分。热管的第一部分热接合基座。热管的第二部分位于基座的上方，并与多个翅片热接合。

3. 发明授权

US07345879B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07345879B2
公开(公告)日：2008-03-18
申请号：US11308847
申请日：2006-05-15
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L21/4882 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.
摘要翻译：散热装置包括与中央处理单元接触的主散热器（10）和附接在与中央处理单元相邻的发热电子元件上的二次散热器（20）。主散热器包括设置在基座中间的基座（12）和散热部分（14）。二次散热器包括基板（22）和布置在基板上的多个翅片组件（24）。底座被放置在基板上，翅片组件布置在散热部分周围。主散热器部分地叠置在具有紧凑结构的二次散热器上。散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。

4. 发明授权

US07631850B2 Apparatus for supporting cooling device 失效
标题翻译：用于支撑冷却装置的装置
公开(公告)号：US07631850B2
公开(公告)日：2009-12-15
申请号：US11135745
申请日：2005-05-24
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).
摘要翻译：一种用于在其上支撑冷却装置（30）的装置（1）包括托架（10）和在其上承载冷却装置（30）的鞍座（20）。支架（10）限定了两个相对的轨道（12），（13）和沿轨道（12），（13）延伸的方向延伸的洗衣板状构件（14）。所述鞍座（20）包括定位构件（26），所述定位构件（26）接合在所述盥洗板状构件（14）中，以将所述鞍座（20）定位到所述支架（10）以及可在所述轨道（12）上滑动的两个块（24），在定位构件（26）与盥洗板状构件（14）分离的条件下，支架（10）的底面（13）是13。

5. 发明授权

US07296617B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07296617B2
公开(公告)日：2007-11-20
申请号：US11221285
申请日：2005-09-07
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号： F28D15/04
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译：一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管基础。第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

6. 发明授权

US07755894B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07755894B2
公开(公告)日：2010-07-13
申请号：US11309344
申请日：2006-07-28
申请人： Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Ping-An Yang , Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F2210/10 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.
摘要翻译：散热装置包括具有平坦顶面的第一基板，多个平坦化的热管，位于热管上方的散热片组件和形成在热管和散热片组件之间的导热层。导热层具有与热管接触的平坦表面。热管被支撑在第一基板的顶表面上。第一底板具有用于与电子包装件接合的平坦底面。每个热管包括蒸发部分和从蒸发部分弯曲的冷凝部分，并且热管的蒸发部分彼此并排地邻接。

7. 发明授权

US07218522B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07218522B2
公开(公告)日：2007-05-15
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

8. 发明申请

US20060018096A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060018096A1
公开(公告)日：2006-01-26
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

9. 发明授权

US07391615B2 Clip for heat sink 失效
标题翻译：夹子为散热片
公开(公告)号：US07391615B2
公开(公告)日：2008-06-24
申请号：US11309839
申请日：2006-10-10
申请人： Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Meng Fu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2224/16 , Y10T24/44427 , Y10T24/4447
摘要： A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.
摘要翻译：夹具包括具有相对的第一和第二腿部的主体，可移动紧固件，致动构件和滑动轴。可移动紧固件具有限定在其中的保持孔，用于与保持模块和保持孔上方的细长狭槽接合。致动构件包括弯曲槽，并且经由枢轴枢转地联接到可动紧固件。滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起，并且滑动轴具有插入致动构件的弯曲槽中的一个部分。当致动构件围绕枢轴旋转时，可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。

10. 发明申请

US20060054307A1 Heat sink 失效
标题翻译：散热器
公开(公告)号：US20060054307A1
公开(公告)日：2006-03-16
申请号：US11221285
申请日：2005-09-07
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.
摘要翻译：一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管基础。第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

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