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    • 4. 发明授权
    • Rapid method for reservoir connectivity analysis using a fast marching method
    • 使用快速行进方法进行油藏连通分析的快速方法
    • US07565243B2
    • 2009-07-21
    • US11884695
    • 2006-04-10
    • Chul-Sung KimMark Dobin
    • Chul-Sung KimMark Dobin
    • G06F3/00
    • G01V99/005E21B43/00G01V1/302G01V2210/641G01V2210/644
    • Methods for analyzing the connected quality of a hydrocarbon reservoir are disclosed. A model of a portion of the reservoir is divided into cells, each cell having a volume and some attributes, and wherein a speed function is assigned to a portion of the cells. A reference cell is chosen. A connectivity between cells in the reservoir is determined by solving an Eikonal equation that describes the travel time propagation, said propagating front progressing outward from a reference cell until an ending condition is met, said Eikonal equation being solved by a fast marching method with propagation velocity as a function of spatial position being provided by the speed function. Regions of the reservoir are characterized by their connective quality to the reference cell using the connectivity.
    • 公开了分析烃储层连通质量的方法。 储存器的一部分的模型被分成单元,每个单元具有一个体积和一些属性,并且其中一个速度函数被分配给该单元的一部分。 选择参考单元。 通过解决描述旅行时间传播的Eikonal方程来确定储层中的细胞之间的连通性,所述传播前沿从参考细胞向外进展直到满足结束条件,所述Eikonal方程通过具有传播速度的快速行进方法 作为由速度函数提供的空间位置的函数。 水库的区域的特点是使用连接性与参考单元的连接质量。
    • 5. 发明申请
    • Rapid Method for Reservoir Connectivity Analysis Using a Fast Marching Method
    • 使用快速前进法进行油藏连通性分析的快速方法
    • US20080154505A1
    • 2008-06-26
    • US11884695
    • 2006-04-10
    • Chul-Sung KimMark Dobin
    • Chul-Sung KimMark Dobin
    • G01V1/30
    • G01V99/005E21B43/00G01V1/302G01V2210/641G01V2210/644
    • Methods for analyzing the connected quality of a hydrocarbon reservoir are disclosed. A model of a portion of the reservoir is divided into cells, each cell having a volume and some attributes, and wherein a speed function is assigned to a portion of the cells. A reference cell is chosen. A connectivity between cells in the reservoir is determined by solving an Eikonal equation that describes the travel time propagation, said propagating front progressing outward from a reference cell until an ending condition is met, said Eikonal equation being solved by a fast marching method with propagation velocity as a function of spatial position being provided by the speed function. Regions of the reservoir are characterized by their connective quality to the reference cell using the connectivity.
    • 公开了分析烃储层连通质量的方法。 储存器的一部分的模型被分成单元,每个单元具有一个体积和一些属性,并且其中一个速度函数被分配给该单元的一部分。 选择参考单元。 通过解决描述旅行时间传播的Eikonal方程来确定储层中的细胞之间的连通性,所述传播前沿从参考细胞向外进展直到满足结束条件,所述Eikonal方程通过具有传播速度的快速行进方法 作为由速度函数提供的空间位置的函数。 水库的区域的特点是使用连接性与参考单元的连接质量。
    • 8. 发明申请
    • METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20120171826A1
    • 2012-07-05
    • US13243147
    • 2011-09-23
    • Jin-Bum KimChul-Sung KimYu-Gyun ShinDae-Yong KimJoon-Gon LeeKwang-Young Lee
    • Jin-Bum KimChul-Sung KimYu-Gyun ShinDae-Yong KimJoon-Gon LeeKwang-Young Lee
    • H01L21/8238
    • H01L21/823807H01L21/823814
    • A method of fabricating a semiconductor includes providing a substrate having a first region and a second region defined therein, forming a first gate and a first source and drain region in the first region and forming a second gate and a second source and drain region in the second region, forming an epitaxial layer in the second source and drain region, forming a first metal silicide layer in the first source and drain region, forming an interlayer dielectric layer on the first region and the second region, forming a plurality of contact holes exposing the first metal silicide layer and the epitaxial layer while penetrating the interlayer dielectric layer, forming a second metal silicide layer in the exposed epitaxial layer, and forming a plurality of contacts contacting the first and second metal silicide layers by filling the plurality of contact holes.
    • 制造半导体的方法包括提供具有限定在其中的第一区域和第二区域的衬底,在第一区域中形成第一栅极和第一源极和漏极区域,并在第一区域中形成第二栅极和第二源极和漏极区域 在所述第二源极和漏极区域中形成外延层,在所述第一源极和漏极区域中形成第一金属硅化物层,在所述第一区域和所述第二区域上形成层间电介质层,形成多个接触孔, 第一金属硅化物层和外延层,同时穿透层间电介质层,在暴露的外延层中形成第二金属硅化物层,并且通过填充多个接触孔形成与第一和第二金属硅化物层接触的多个触点。