专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100167498A1 SUBSTRATE LEVEL BONDING METHOD AND SUBSTRATE LEVEL PACKAGE 有权
标题翻译：衬底水平焊接方法和衬底层封装
公开(公告)号：US20100167498A1
公开(公告)日：2010-07-01
申请号：US12646691
申请日：2009-12-23
申请人： Chul-Soo KIM , Kuk-Jin Chun , Sung-Chan Kang , Jong-Hyuk Kim , In-Sang Song , Duck-Hwan Kim , Jae-Shik Shin
发明人： Chul-Soo KIM , Kuk-Jin Chun , Sung-Chan Kang , Jong-Hyuk Kim , In-Sang Song , Duck-Hwan Kim , Jae-Shik Shin
IPC分类号： H01L21/50
CPC分类号： H01L23/10 , H01L21/50 , H01L21/76898 , H01L25/50 , H01L27/14601 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured.
摘要翻译：公开了一种由此形成的衬底水平焊接方法和衬底层封装。基板级封装包括多个单元基板部分，基底基板和多个基板粘合部分。单元基板部分通过孔彼此分离。基底基板设置成面对单元基板部分。基板粘合部分插入在单元基板部分和基底基板之间，以将单元基板部分粘合到基底基板上，并且由至少一部分未固化的DFR材料形成。

2. 发明授权

US07998834B2 Substrate level bonding method and substrate level package 有权
标题翻译：基板级接合方法和基板级封装
公开(公告)号：US07998834B2
公开(公告)日：2011-08-16
申请号：US12646691
申请日：2009-12-23
申请人： Chul-Soo Kim , Kuk-Jin Chun , Sung-Chan Kang , Jong-Hyuk Kim , In-Sang Song , Duck-Hwan Kim , Jae-Shik Shin
发明人： Chul-Soo Kim , Kuk-Jin Chun , Sung-Chan Kang , Jong-Hyuk Kim , In-Sang Song , Duck-Hwan Kim , Jae-Shik Shin
IPC分类号： H01L21/30 , H01L21/00
CPC分类号： H01L23/10 , H01L21/50 , H01L21/76898 , H01L25/50 , H01L27/14601 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured.
摘要翻译：公开了一种由此形成的衬底水平焊接方法和衬底层封装。基板级封装包括多个单元基板部分，基底基板和多个基板粘合部分。单元基板部分通过孔彼此分离。基底基板设置成面对单元基板部分。基板粘合部分插入在单元基板部分和基底基板之间，以将单元基板部分粘合到基底基板上，并且由至少一部分未固化的DFR材料形成。

3. 发明授权

US07804382B2 Tunable resonator using film bulk acoustic resonator (FBAR) 有权
标题翻译：使用膜体声波谐振器（FBAR）的可调谐谐振器
公开(公告)号：US07804382B2
公开(公告)日：2010-09-28
申请号：US12048481
申请日：2008-03-14
申请人： Jea-Shik Shin , Yun-Kwon Park , In-Sang Song , Duck-Hwan Kim , Chul-Soo Kim
发明人： Jea-Shik Shin , Yun-Kwon Park , In-Sang Song , Duck-Hwan Kim , Chul-Soo Kim
IPC分类号： H03H9/13 , H03H9/15 , H03H9/54 , H03H3/04
CPC分类号： H03H9/171 , H03H2009/02173
摘要： A tunable resonator is provided. The tunable resonator includes a film bulk acoustic resonator (FBAR) for performing a resonance, and at least one driver which is arranged at a side of the FBAR and is deformed and brought into contact with the FBAR by an external signal, thereby changing a resonance frequency of the FBAR. Accordingly, a multiband integration and a one-chip manufacture can be implemented simply using a micro electro mechanical system (MEMS) technology and a mass production is possible.
摘要翻译：提供可调谐谐振器。可调谐谐振器包括用于进行谐振的膜体声波谐振器（FBAR）和至少一个驱动器，该驱动器布置在FBAR的一侧并通过外部信号变形并与FBAR接触，从而改变谐振 FBAR的频率。因此，可以简单地使用微机电系统（MEMS）技术来实现多频带集成和单芯片制造，并且可以批量生产。

4. 发明授权

US5432558A Circuit and method for transmitting/receiving a code-inserted video signal 失效
标题翻译：用于发送/接收代码插入视频信号的电路和方法
公开(公告)号：US5432558A
公开(公告)日：1995-07-11
申请号：US142909
申请日：1993-10-29
申请人： Duck-Hwan Kim
发明人： Duck-Hwan Kim
IPC分类号： H04N5/44 , H04N7/08 , H04N7/088 , H04N7/04
CPC分类号： H04N7/0882 , H04N7/08 , H04N7/0887
摘要： A circuit and method for performing a specific function at a receiving side if a video signal in which a code is inserted is transmitted. A transmitting side of a broadcasting system transmits a video signal in which a given code relating to a specific function like a time correction or a program reservation of a receiving side is inserted. The receiving side detects the code and then transmits the detected code to a circuit for performing the specific function by inputting a one touch key. Without the key input of a user, the corresponding time correction function is automatically controlled according to the code detected from a received video signal.
摘要翻译：如果发送其中插入有代码的视频信号，则在接收侧执行特定功能的电路和方法。广播系统的发送侧发送其中插入与诸如接收侧的时间校正或节目预约的特定功能相关的给定代码的视频信号。接收侧检测代码，然后通过输入一个触摸键将检测到的代码发送到用于执行特定功能的电路。没有用户的键输入，根据从接收到的视频信号检测到的代码自动控制对应的时间校正功能。

5. 发明申请

US20080020576A1 METHOD OF FORMING POLYSILICON PATTERN 审中-公开
标题翻译：形成多晶硅图案的方法
公开(公告)号：US20080020576A1
公开(公告)日：2008-01-24
申请号：US11782196
申请日：2007-07-24
申请人： Duck-Hwan Kim
发明人： Duck-Hwan Kim
IPC分类号： H01L21/302
CPC分类号： H01L21/32139
摘要： Embodiments relate to a method of forming a polysilicon pattern, which may be able to form a minute pattern. In embodiments, the method may in clued forming a first polysilicon pattern by selectively etching a polysilicon layer using a photoresist pattern at a fixed interval, forming an oxide layer having a concavo-convex pattern in the first polysilicon pattern, so as to form a second polysilicon pattern covered with the oxide layer, grinding the oxide layer in such an extent that exposes the upper surface of the second polysilicon pattern, etching the second polysilicon pattern exposed in state of using the oxide layer as a mask, forming an oxide-layer pattern used for a mask of a final polysilicon pattern being completed, by etching the oxide layer to a predetermined depth, and forming the final polysilicon pattern by selectively etching the polysilicon layer in state the oxide-layer pattern is used as a mask.
摘要翻译：实施例涉及形成多晶硅图案的方法，其可能能够形成微小图案。在实施例中，该方法可以通过以固定的间隔选择性地使用光致抗蚀剂图案蚀刻多晶硅层来形成第一多晶硅图案，形成在第一多晶硅图案中具有凹凸图案的氧化物层，以形成第二多晶硅图案用氧化物层覆盖的多晶硅图案，在暴露第二多晶硅图案的上表面的程度上研磨氧化物层，蚀刻在使用氧化物层作为掩模的状态下暴露的第二多晶硅图案，形成氧化物层图案用于通过将氧化物层蚀刻到预定深度来完成最终多晶硅图案的掩模，并且通过在氧化物层图案用作掩模的状态下选择性地蚀刻多晶硅层来形成最终的多晶硅图案。

6. 发明申请

US20110165734A1 MANUFACTURING METHOD OF SEMI-CONDUCTOR CHIP PACKAGE 审中-公开
标题翻译：半导体芯片封装的制造方法
公开(公告)号：US20110165734A1
公开(公告)日：2011-07-07
申请号：US12985900
申请日：2011-01-06
申请人： Seung-Woo Han , Jea-Hyuck Lee , Kyu-Sub Kwak , Kang-Ho Byun , Joon-II Kim , Duck-Hwan Kim , Kyung-Ho Park , Se-Mi Park
发明人： Seung-Woo Han , Jea-Hyuck Lee , Kyu-Sub Kwak , Kang-Ho Byun , Joon-II Kim , Duck-Hwan Kim , Kyung-Ho Park , Se-Mi Park
IPC分类号： H01L21/56
CPC分类号： H01L23/3128 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/24 , H01L2224/12105 , H01L2224/24195 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00
摘要： A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.
摘要翻译：半导体芯片封装的制造方法包括在半导体芯片和位于半导体芯片周围的空白空间中的无源器件的膜上配置半导体芯片和多个无源器件之后，去除膜，在除膜区域中形成粘合剂层，并将导电层附着到粘合剂层上; 蚀刻导电层从而形成导电电路图案; 以及提供将导电电路图案电连接到半导体芯片和无源器件的一个或多个导电焊盘。

7. 发明授权

US06226532B1 Cellular telephone with voice dialing function 失效
标题翻译：手机具有语音拨号功能
公开(公告)号：US06226532B1
公开(公告)日：2001-05-01
申请号：US09119284
申请日：1998-07-20
申请人： Duck-Hwan Kim , Seo-Yong Chin
发明人： Duck-Hwan Kim , Seo-Yong Chin
IPC分类号： H04B138
CPC分类号： H04M1/271
摘要： A cellular telephone with a voice dialing function effectively manages a voice recognition memory. The cellular telephone is capable of being connected to a hands-free kit, and has a voice recognition device for extracting feature data from an input voice signal so as to recognize the voice signal and a memory for storing the extended feature data. The memory is divided into a first storage area for storing the feature data input from the cellular telephone, a second storage area for storing the feature data input from the hands-free kit, and a third storage area for storing voice playback data. The third storage area includes a storage region for storing the voice playback data and another storage region for storing a telephone number associated with the voice playback data.
摘要翻译：具有语音拨号功能的蜂窝电话有效地管理语音识别存储器。蜂窝电话能够连接到免提套件，并具有用于从输入语音信号中提取特征数据以识别语音信号的语音识别装置和用于存储扩展特征数据的存储器。存储器被分成用于存储从蜂窝电话输入的特征数据的第一存储区域，用于存储从免提工具箱输入的特征数据的第二存储区域和用于存储语音播放数据的第三存储区域。第三存储区域包括用于存储语音播放数据的存储区域和用于存储与语音播放数据相关联的电话号码的另一个存储区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式