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1. 发明授权

US07304381B2 Package and method for attaching an integrated heat spreader 有权
标题翻译：用于安装集成散热器的包装和方法
公开(公告)号：US07304381B2
公开(公告)日：2007-12-04
申请号：US11461803
申请日：2006-08-02
申请人： Christopher L. Rumer , Sabina J. Houle , Oswald L. Skeete , Mike T. Reiter , Jeff R. Wienrich
发明人： Christopher L. Rumer , Sabina J. Houle , Oswald L. Skeete , Mike T. Reiter , Jeff R. Wienrich
IPC分类号： H01L23/34
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/4093 , H01L2023/4062 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/16251 , H01L2924/19105 , H01L2924/19106 , H01L2924/00012 , H01L2224/0401
摘要： In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.
摘要翻译：在一些实施例中，集成电路封装包括基板和通过紧固件联接到基板的散热器。热界面材料将模具热耦合到散热器上。散热器设置在模具上并且用紧固件而不是密封剂粘合剂附接到基板。合适的紧固件的一些示例可以包括铆钉，带倒钩的连接器和夹紧夹。

2. 发明申请

US20080156895A1 FLUX OVERSPRAY REDUCTION APPARATUS, SYSTEMS, AND METHODS 审中-公开
标题翻译： FLUX OVERSPRAY减少装置，系统和方法
公开(公告)号：US20080156895A1
公开(公告)日：2008-07-03
申请号：US11617819
申请日：2006-12-29
申请人： James P. Mellody , Sabina J. Houle , James C. Matayabas , Oswald L. Skeete
发明人： James P. Mellody , Sabina J. Houle , James C. Matayabas , Oswald L. Skeete
IPC分类号： B05B5/00
CPC分类号： H05K3/0091 , H05K3/3489 , H05K2203/105 , H05K2203/1366
摘要： Apparatus and systems, as well as methods and articles, may operate to charge a quantity of flux using a first charge to provide a charged flux portion, dispense the charged flux portion toward a circuit, and direct distribution of the charged flux portion using a second charge to attract or repel the charged flux portion. Other embodiments are described and claimed.
摘要翻译：设备和系统以及方法和物品可以操作以使用第一电荷对一定量的通量进行充电以提供电荷通量部分，将电荷通量部分分配给电路，并且使用第二电荷直接分配电荷通量部分充电以吸引或排斥电荷通量部分。描述和要求保护其他实施例。

3. 发明申请

US20090212416A1 INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING SAME 有权
标题翻译：集成电路封装及其制造方法
公开(公告)号：US20090212416A1
公开(公告)日：2009-08-27
申请号：US12036143
申请日：2008-02-22
申请人： Oswald L. Skeete
发明人： Oswald L. Skeete
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H01L23/50 , H01L23/13 , H01L23/16 , H01L23/3121 , H01L23/49833 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate.
摘要翻译：集成电路封装包括具有第一表面（111,211）和相对的第二表面（112,212）的基板（110,210）以及与基板的第一表面相邻的模具平台（130,230）。基板在其中具有凹部（120,220）。集成电路封装还包括在衬底的凹部中的电容器（140,240）。

4. 发明授权

US08035216B2 Integrated circuit package and method of manufacturing same 有权
标题翻译：集成电路封装及其制造方法
公开(公告)号：US08035216B2
公开(公告)日：2011-10-11
申请号：US12036143
申请日：2008-02-22
申请人： Oswald L. Skeete
发明人： Oswald L. Skeete
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H01L23/50 , H01L23/13 , H01L23/16 , H01L23/3121 , H01L23/49833 , H01L2924/0002 , H01L2924/00
摘要： Decoupling capacitors are frequently used in computer systems in order to control noise. In general, decoupling capacitors are placed as close as possible to the devices they protect in order to minimize the amount of line inductance and series resistance between the devices and the capacitors. An integrated circuit package includes a substrate (110, 210) having a first surface (111, 211) and an opposing second surface (112, 212), and a die platform (130, 230) adjacent to the first surface of the substrate. The substrate has a recess (120, 220) therein. The integrated circuit package further includes a capacitor (140, 240) in the recess of the substrate. The presence of a recess in the substrate provides an opportunity to reduce the separation distance between a die supported by the die platform and the decoupling capacitors. A further advantage of embodiments of the invention lies in its ability to maintain socket compatibility.
摘要翻译：去耦电容器经常用于计算机系统中以控制噪声。通常，去耦电容器尽可能靠近其保护的器件，以便最小化器件与电容器之间的线路电感和串联电阻的数量。集成电路封装包括具有第一表面（111,211）和相对的第二表面（112,212）的基板（110,210）以及与基板的第一表面相邻的模具平台（130,230）。基板在其中具有凹部（120,220）。集成电路封装还包括在衬底的凹部中的电容器（140,240）。在衬底中存在凹陷提供了降低由模具平台支撑的模具与去耦电容器之间的间隔距离的机会。本发明的实施例的另一优点在于其维持套接字兼容性的能力。

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