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1. 发明授权

US06982380B2 Encapsulated component which is small in terms of height and method for producing the same 有权
标题翻译：高度小的密封部件及其制造方法
公开(公告)号：US06982380B2
公开(公告)日：2006-01-03
申请号：US10500371
申请日：2002-12-11
申请人： Christian Hoffmann , Jürgen Portmann , Hans Krueger
发明人： Christian Hoffmann , Jürgen Portmann , Hans Krueger
IPC分类号： H01L23/28 , H05K5/06
CPC分类号： H03H9/1078 , H01L24/31 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/16237 , H01L2224/291 , H01L2224/29111 , H01L2224/73203 , H01L2224/83136 , H01L2224/83951 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01068 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/0133 , H01L2924/09701 , H01L2924/10157 , H01L2924/12042 , H01L2924/1517 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H03H9/059 , H01L2924/0105 , H01L2224/13111 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.
摘要翻译：为了更简单和更安全地封装组件，建议通过沉积在载体衬底上的凹陷中的凸块连接来产生芯片和载体衬底之间的连接。因此，该部件直接位于载体基板上，特别是在限定芯片上的部件结构的框架上。

2. 发明授权

US07388281B2 Encapsulated electronic component and production method 有权
标题翻译：封装电子元器件及生产方法
公开(公告)号：US07388281B2
公开(公告)日：2008-06-17
申请号：US10523875
申请日：2003-06-23
申请人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
发明人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H03H9/0557 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10157 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H03H9/059 , H03H9/1071 , H03H9/1078 , Y10T29/49146 , H01L2924/00 , H01L2924/00014
摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.
摘要翻译：本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。芯片的封装是用密封或介电层完成的。由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。

3. 发明申请

US20050034888A1 Encapsulated component which is small in terms of height and method for producing the same 有权
标题翻译：高度小的密封部件及其制造方法
公开(公告)号：US20050034888A1
公开(公告)日：2005-02-17
申请号：US10500371
申请日：2002-12-11
申请人： Christian Hoffmann , Jurgen Portmann , Hans Krueger
发明人： Christian Hoffmann , Jurgen Portmann , Hans Krueger
IPC分类号： H01L23/12 , H01L29/06 , H03H3/02 , H03H3/06 , H03H3/08 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/25 , H03H9/56 , H01L23/02
CPC分类号： H03H9/1078 , H01L24/31 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/16225 , H01L2224/16237 , H01L2224/291 , H01L2224/29111 , H01L2224/73203 , H01L2224/83136 , H01L2224/83951 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01068 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/0133 , H01L2924/09701 , H01L2924/10157 , H01L2924/12042 , H01L2924/1517 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H03H9/059 , H01L2924/0105 , H01L2224/13111 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.
摘要翻译：为了更简单和更安全地封装组件，建议通过沉积在载体衬底上的凹陷中的凸块连接来产生芯片和载体衬底之间的连接。因此，该部件直接位于载体基板上，特别是在限定芯片上的部件结构的框架上。

4. 发明授权

US08865499B2 MEMS microphone and method for producing the MEMS microphone 有权
标题翻译： MEMS麦克风和MEMS麦克风的制造方法
公开(公告)号：US08865499B2
公开(公告)日：2014-10-21
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
IPC分类号： H01L21/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.
摘要翻译：本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。

5. 发明授权

US08759677B2 Hermetically sealed housing for electronic components and manufacturing method 有权
标题翻译：电子元器件密封外壳及制造方法
公开(公告)号：US08759677B2
公开(公告)日：2014-06-24
申请号：US12993299
申请日：2009-05-26
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
IPC分类号： H01J5/00 , H01J15/00 , H05K5/06 , H05H1/00 , H05K7/00 , H05K7/10 , H05K7/12
CPC分类号： H01L23/06 , B81B7/0077 , B81C2203/0136 , H01L23/053 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/00
摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
摘要翻译：施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

6. 发明申请

US20120159778A1 Method for Connecting a Plurality of Unpackaged Substrates 有权
标题翻译：连接多个非封装基板的方法
公开(公告)号：US20120159778A1
公开(公告)日：2012-06-28
申请号：US13330422
申请日：2011-12-19
申请人： Hans Krueger , Alexander Schmajew , Alois Stelzl
发明人： Hans Krueger , Alexander Schmajew , Alois Stelzl
IPC分类号： H05K3/36
CPC分类号： H01L24/94 , B81B7/007 , B81B2207/098 , H01L24/24 , H01L24/82 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/24011 , H01L2224/24051 , H01L2224/24147 , H01L2224/24991 , H01L2224/94 , H01L2225/06513 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2924/1068 , H01L2924/14 , H01L2924/1461 , Y10T29/49126 , H01L2224/81 , H01L2224/82
摘要： A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks.
摘要翻译：公开了彼此连接的多个未封装的基板。第一基板的第一主区域和/或第一主区域中的阶梯结构包括多个集成电路。阶梯式结构在集成电路之间运行。第一导体轨道从各个集成电路的至少一些接触连接延伸到阶梯式结构。第一基板在第一主区域的一侧连接到另一基板。第一基板从与第一主区域相对的第二主区域切断，使得第一基板被分成多个基板块。每个衬底片具有一个集成电路。第一导体轨迹可在基片之间的间隙中接近。第二导体轨道由第二主区域形成。至少一些第二导体轨道从第二主区域超过衬底片的侧壁延伸，直到第一导体轨迹。

7. 发明申请

US20120061778A1 Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method 有权
标题翻译：用于生产芯片器件的方法和装置，以及通过该方法生产的芯片器件
公开(公告)号：US20120061778A1
公开(公告)日：2012-03-15
申请号：US13228971
申请日：2011-09-09
申请人： Michael Gerner , Hans Krueger , Alois Stelzl
发明人： Michael Gerner , Hans Krueger , Alois Stelzl
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： B81C1/00333
摘要： A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method.
摘要翻译：制造提供具有多个芯片部件的至少一个晶片的芯片器件。将晶片或晶片分离成各个芯片组件和/或分组成芯片组件。单个芯片组件和/或芯片组件组被施加到载体元件，使得在各个芯片组件和/或芯片组件组之间形成具有预定宽度的间隙。将聚合物引入到间隙中以形成由芯片部件和聚合物基体组成的复合元件。复合元件以这样的方式分离，即在每种情况下由芯片部件和聚合物基体的至少一个部分组成的芯片器件形成。本发明还涉及通过该方法制造的芯片器件。

8. 发明授权

US08110962B2 MEMS component and method for production 有权
标题翻译： MEMS组件和生产方法
公开(公告)号：US08110962B2
公开(公告)日：2012-02-07
申请号：US12642357
申请日：2009-12-18
申请人： Christian Bauer , Hans Krueger , Werner Ruile , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Werner Ruile , Alois Stelzl
IPC分类号： H01L29/84
CPC分类号： H03H9/02866 , H03H9/14538
摘要： A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.
摘要翻译： MEMS部件包括芯片，该芯片的后侧具有小于在部件中传播的声波的中心频率处波长的十分之一的粗糙度。用于散射体声波的金属结构设置在芯片的后侧，并且金属结构的材料与芯片的材料声学匹配。

9. 发明申请

US20110214905A1 Circuit Board with Flexible Region and Method for Production Thereof 有权
标题翻译：具有柔性区域的电路板及其制造方法
公开(公告)号：US20110214905A1
公开(公告)日：2011-09-08
申请号：US12997867
申请日：2009-06-08
申请人： Wolfgang Pahl , Hans Krueger , Peter Demmer
发明人： Wolfgang Pahl , Hans Krueger , Peter Demmer
IPC分类号： H05K1/02 , H05K3/00
CPC分类号： H05K1/189 , H01L2224/16225 , H05K3/4691 , H05K2201/0394 , H05K2201/09081 , H05K2201/09109 , H05K2203/308 , Y10T29/49124 , Y10T428/24322
摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
摘要翻译：一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域。

10. 发明申请

US20110114355A1 HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTURING METHOD 有权
标题翻译：电子元件密封外壳和制造方法
公开(公告)号：US20110114355A1
公开(公告)日：2011-05-19
申请号：US12993299
申请日：2009-05-26
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl
IPC分类号： H05K5/06
CPC分类号： H01L23/06 , B81B7/0077 , B81C2203/0136 , H01L23/053 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/3011 , H01L2924/00
摘要： Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
摘要翻译：施加在晶片（1）上的框架（3）被平整并用覆盖膜覆盖，使得形成用于组件结构（5）的气密壳体，特别是用于过滤器或MEMS结构。可以提供内柱（4）用于支撑壳体和接地连接; 可以为电连接提供外柱（4），并且通过与框架（3）电绝缘的导体轨道（6）连接到部件结构。

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