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    • 3. 发明申请
    • Mounting structure for LED lighting systems
    • LED照明系统的安装结构
    • US20070047243A1
    • 2007-03-01
    • US11510741
    • 2006-08-28
    • Christian HackerAlessandro MaschiettoGiovanni ScillaAlessandro Scordino
    • Christian HackerAlessandro MaschiettoGiovanni ScillaAlessandro Scordino
    • F21V19/00
    • F21V23/06F21S2/005F21S4/28F21V21/005F21Y2115/10
    • A mounting structure for LED lighting sources, includes a support body having attached on one side thereof a circuit board for mounting the LED lighting sources. The circuit board is preferably a printed-circuit board with conductive traces to feed electrical power to the LED lighting sources. The support body is in the form of an elongated bar or a box with a linear, round, square, hexagonal or octagonal shape. The support body is a drawn or molded body of a lightweight material and preferably exhibits good heat transfer properties. The support body includes a back side for mounting the structure on a supporting surface, such back side possibly having associated a heat dissipation fixture. Additionally, the support body may have free space inside and/or be at least partially apertured to permit cooling air flow for a driver circuit for driving the LED lighting source.
    • 一种用于LED照明源的安装结构,包括:其一侧安装有用于安装LED照明源的电路板的支撑体。 电路板优选地是具有用于将电力馈送到LED照明源的导电迹线的印刷电路板。 支撑体呈细长条形或具有线形,圆形,方形,六边形或八边形形状的盒子的形式。 支撑体是轻质材料的拉制或成型体,并且优选表现出良好的传热性能。 支撑体包括用于将结构安装在支撑表面上的后侧,该后侧可能具有相关联的散热夹具。 此外,支撑体可以具有内部和/或至少部分有孔的自由空间,以允许用于驱动LED照明源的驱动器电路的冷却空气流。
    • 4. 发明申请
    • HEAT SINK AND LIGHTING DEVICE COMPRISING A HEAT SINK
    • 包含散热器的散热和照明装置
    • US20100242519A1
    • 2010-09-30
    • US12746539
    • 2007-12-07
    • Nicole BreidenasselAlessandro ScordinoGiovanni Scilla
    • Nicole BreidenasselAlessandro ScordinoGiovanni Scilla
    • F25D27/00F28F7/00
    • F21V29/83F21V29/503F21V29/74F21V29/75F21V29/773F21Y2115/10
    • A heat sink may include a light source region for mounting a light source; a heat spreading and dissipation structure covering at least part of an exterior of the heat sink; wherein the structure comprises vertically aligned fins; wherein the structure comprises an air flow channel leading from a bottom region to a lateral region, the air flow channel being created by a gap between adjacent fins; wherein the light source region comprises an open cavity formed by a cavity wall comprising a light source mounting region adapted to receive the light source; wherein the fins are integrally connected to the exterior of the cavity wall; wherein the heat sink comprises a solid heat sink base extending from the light source mounting region to the exterior and protruding from the cavity wall; and wherein the structure is in thermal connection with the heat sink base.
    • 散热器可以包括用于安装光源的光源区域; 覆盖散热器外部的至少一部分的散热和散热结构; 其中所述结构包括垂直排列的翅片; 其中所述结构包括从底部区域引导到横向区域的空气流动通道,所述空气流动通道由相邻翅片之间的间隙产生; 其中所述光源区域包括由空腔壁形成的开放空腔,所述空腔壁包括适于接收所述光源的光源安装区域; 其中所述翅片一体地连接到所述腔壁的外部; 其中所述散热器包括从所述光源安装区域延伸到外部并从所述空腔壁突出的固体散热器基座; 并且其中所述结构与所述散热器基座热连接。
    • 5. 发明授权
    • Housing for electrical components
    • 电气元件外壳
    • US08665603B2
    • 2014-03-04
    • US12745696
    • 2007-12-03
    • Alessandro BriedaGiovanni ScillaAlessandro Scordino
    • Alessandro BriedaGiovanni ScillaAlessandro Scordino
    • H05K5/00
    • H05K7/1417
    • A housing for electrical components is provided. The housing may include a mouth portion to cooperate with a circuit board in an assembled condition wherein said circuit board is applied against said mouth portion of the housing. The housing may include at least one spring formation located at said mouth portion to cooperate with said circuit board to elastically urge said circuit board away from said mouth portion, and at least one hook-like formation extending from said mouth portion distally of said housing, said hook-like formation adapted to cooperate with said circuit board to retain said circuit board assembled to said housing against the force exerted by said spring formation.
    • 提供了用于电气部件的壳体。 壳体可以包括在组装状态下与电路板协作的口部分,其中所述电路板被施加在壳体的所述口部上。 壳体可以包括位于所述嘴部处的至少一个弹簧形式,以与所述电路板配合以弹性地迫使所述电路板远离所述口部;以及至少一个从所述口部向远侧延伸的钩状结构, 所述钩状结构适于与所述电路板配合,以克服所述弹簧形成所施加的力而将组装在所述壳体上的所述电路板保持在一起。