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1. 发明授权

US09532454B2 Monolithic ceramic component and production method 有权
标题翻译：单片陶瓷元件及其制作方法
公开(公告)号：US09532454B2
公开(公告)日：2016-12-27
申请号：US12159809
申请日：2007-01-03
申请人： Christian Block , Pavol Dudesek , Thomas Feichtinger , Christian Hoffmann , Guenter Pudmich
发明人： Christian Block , Pavol Dudesek , Thomas Feichtinger , Christian Hoffmann , Guenter Pudmich
IPC分类号： B32B18/00 , C04B35/46 , B32B17/00 , B32B5/00 , C03C3/00 , H05K1/16 , H01C1/14 , H01C7/18 , H01G4/232 , H01G4/30 , H01G4/40 , H01L21/48 , H01L23/498 , H01L23/552 , H01F10/20 , H01F17/00 , H01L25/16 , H03H1/00 , H05K1/03 , H05K3/46 , H01F10/26
CPC分类号： H01F27/2804 , B32B18/00 , B32B37/06 , B32B37/18 , B32B38/0036 , B32B38/145 , B32B2255/205 , B32B2264/101 , B32B2264/107 , B32B2264/12 , B32B2305/77 , B32B2305/80 , B32B2307/202 , B32B2307/204 , B32B2307/704 , B32B2457/16 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2237/341 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/366 , C04B2237/564 , C04B2237/62 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01C1/14 , H01C7/008 , H01C7/10 , H01C7/18 , H01C17/06 , H01F10/20 , H01F10/265 , H01F17/0013 , H01F27/29 , H01F27/32 , H01F41/041 , H01F41/12 , H01F2027/2809 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/232 , H01G4/30 , H01G4/40 , H01L21/4857 , H01L23/49822 , H01L23/552 , H01L25/16 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H2001/0085 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/4611 , H05K3/4629 , H05K3/4688 , Y10T428/265 , H01L2924/00
摘要： A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.
摘要翻译：公开了一种由压实的绿色薄膜制成并且能够被烧结以形成具有整体多层结构的陶瓷部件的薄膜叠层。薄膜叠层包括功能层，其功能层包括包含功能性陶瓷的绿膜和包含包含电介质材料的绿膜的张力层。张力层与多层结构中的功能层直接相邻。多层结构还包括第一金属化平面和第二金属化平面。功能层位于第一金属化平面和第二金属化平面之间。

2. 发明申请

US20090035560A1 Monolithic Ceramic Component and Production Method 有权
标题翻译：单片陶瓷成分及生产方法
公开(公告)号：US20090035560A1
公开(公告)日：2009-02-05
申请号：US12159809
申请日：2007-01-03
申请人： Christian Block , Pavol Dudesek , Thomas Feichtinger , Christian Hoffmann , Guenter Pudmich
发明人： Christian Block , Pavol Dudesek , Thomas Feichtinger , Christian Hoffmann , Guenter Pudmich
IPC分类号： B32B18/00 , C04B35/46 , B32B17/00 , B32B5/00 , C03C3/00
CPC分类号： H01F27/2804 , B32B18/00 , B32B37/06 , B32B37/18 , B32B38/0036 , B32B38/145 , B32B2255/205 , B32B2264/101 , B32B2264/107 , B32B2264/12 , B32B2305/77 , B32B2305/80 , B32B2307/202 , B32B2307/204 , B32B2307/704 , B32B2457/16 , C04B2235/6562 , C04B2235/6565 , C04B2235/6567 , C04B2237/341 , C04B2237/343 , C04B2237/346 , C04B2237/348 , C04B2237/366 , C04B2237/564 , C04B2237/62 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H01C1/14 , H01C7/008 , H01C7/10 , H01C7/18 , H01C17/06 , H01F10/20 , H01F10/265 , H01F17/0013 , H01F27/29 , H01F27/32 , H01F41/041 , H01F41/12 , H01F2027/2809 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/232 , H01G4/30 , H01G4/40 , H01L21/4857 , H01L23/49822 , H01L23/552 , H01L25/16 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H2001/0085 , H05K1/0306 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/4611 , H05K3/4629 , H05K3/4688 , Y10T428/265 , H01L2924/00
摘要： A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure, also includes a first metallization plane and a second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.
摘要翻译：公开了一种由压实的绿色薄膜制成并且能够被烧结以形成具有整体多层结构的陶瓷部件的薄膜叠层。薄膜叠层包括功能层，其功能层包括包含功能性陶瓷的绿膜和包含包含电介质材料的绿膜的张力层。张力层与多层结构中的功能层直接相邻。多层结构还包括第一金属化平面和第二金属化平面。功能层位于第一金属化平面和第二金属化平面之间。

3. 发明授权

US08970324B2 Multilayer component and production method 有权
标题翻译：多层成分及生产方法
公开(公告)号：US08970324B2
公开(公告)日：2015-03-03
申请号：US13201173
申请日：2010-02-08
申请人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
发明人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
IPC分类号： H01G4/12 , H01C7/18 , B32B18/00 , C04B35/453 , C04B35/495 , H03H1/00
CPC分类号： H01G4/1209 , B32B18/00 , C04B35/453 , C04B35/495 , C04B2235/3241 , C04B2235/3251 , C04B2235/3275 , C04B2235/3279 , C04B2235/3284 , C04B2235/3294 , C04B2235/3298 , C04B2237/34 , C04B2237/345 , H01C7/18 , H03H2001/0085
摘要： A multilayer component includes a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. The multilayer component therefore includes a layer of a varistor ceramic and another layer of a dielectric. Both layers can be arranged directly adjacent to one another in the multilayer component. In the multilayer component, metallizations are arranged on or between the ceramic layers. The metallizations are structured to form conductor sections and metallized areas. The metallizations form together with the ceramic layers alongside a varistor at least one further component selected from at least one of the component functions.
摘要翻译：多层组件包括可与变阻器陶瓷共烧结以形成根据本发明的整体式多层组件的电介质陶瓷材料。因此，多层组件包括一个变阻器陶瓷层和另一层电介质层。两层可以在多层组件中彼此直接相邻布置。在多层组件中，金属化被布置在陶瓷层上或陶瓷层之间。金属化被构造成形成导体部分和金属化区域。金属化与陶瓷层一起与变阻器一起形成至少一个选自至少一个部件功能的其它部件。

4. 发明申请

US20120032757A1 Multilayer Component and Production Method 有权
标题翻译：多层构件和生产方法
公开(公告)号：US20120032757A1
公开(公告)日：2012-02-09
申请号：US13201173
申请日：2010-02-08
申请人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
发明人： Pavol Dudesek , Guenter Pudmich , Hannes Schiechl , Edmund Payr , Thomas Feichtinger , Werner Salz , Christian Hoffmann
IPC分类号： H03H7/06 , C09K3/00 , B32B37/06 , B32B37/14 , H05K13/00 , B32B37/02
CPC分类号： H01G4/1209 , B32B18/00 , C04B35/453 , C04B35/495 , C04B2235/3241 , C04B2235/3251 , C04B2235/3275 , C04B2235/3279 , C04B2235/3284 , C04B2235/3294 , C04B2235/3298 , C04B2237/34 , C04B2237/345 , H01C7/18 , H03H2001/0085
摘要： A multilayer component includes a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. The multilayer component therefore includes a layer of a varistor ceramic and another layer of a dielectric. Both layers can be arranged directly adjacent to one another in the multilayer component. In the multilayer component, metallizations are arranged on or between the ceramic layers. The metallizations are structured to form conductor sections and metallized areas. The metallizations form together with the ceramic layers alongside a varistor at least one further component selected from at least one of the component functions.
摘要翻译：多层组件包括可与变阻器陶瓷共烧结以形成根据本发明的整体式多层组件的电介质陶瓷材料。因此，多层组件包括一个变阻器陶瓷层和另一层电介质层。两层可以在多层组件中彼此直接相邻布置。在多层组件中，金属化被布置在陶瓷层上或陶瓷层之间。金属化被构造成形成导体部分和金属化区域。金属化与陶瓷层一起与变阻器一起形成至少一个选自至少一个部件功能的其它部件。

5. 发明申请

US20090155624A1 Ceramic Material, Sintered Ceramic and Component Made Therefrom, Production Method and Use of the Ceramic 有权
标题翻译：陶瓷材料，烧结陶瓷及其制造成分，陶瓷的制造方法和用途
公开(公告)号：US20090155624A1
公开(公告)日：2009-06-18
申请号：US12275645
申请日：2008-11-21
申请人： Pavol Dudesek , Christian Hoffmann , Matjaz Valant , Danilo Suvorov
发明人： Pavol Dudesek , Christian Hoffmann , Matjaz Valant , Danilo Suvorov
IPC分类号： B32B15/04 , C04B35/495
CPC分类号： H01G4/1263 , C04B35/495 , C04B35/497 , C04B2235/32 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3232 , C04B2235/3241 , C04B2235/3244 , C04B2235/3251 , C04B2235/3255 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3272 , C04B2235/3275 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/3293 , C04B2235/3294 , C04B2235/3298 , C04B2235/656 , C04B2235/76 , C04B2235/762 , C04B2235/765 , C04B2235/786 , C04B2235/80 , H01G4/1254 , H01G4/30 , H01G4/35 , H01G4/40 , H05K1/0306 , Y10T428/24926 , Y10T428/252
摘要： A ceramic mixed system is proposed that includes a two-phase mixture of pure components A and B, wherein phase A is based on the cubic to tetragonal modification of Bi3NbO7 and phase B is based on a monoclinic pyrochlore modification of Bi2(Zn2/3Nb4/3)O7. The electrical properties of ceramics produced therefrom make the material suitable for components having a multilayer structure in which capacitors and inductors are integrated and which can be used in data processing or signal processing.
摘要翻译：提出了一种陶瓷混合系统，其包括纯组分A和B的两相混合物，其中相A基于Bi 3 NbO 7的立方至四方形修饰，B相基于Bi2（Zn2 / 3Nb4 / 3）O7。由此制造的陶瓷的电性能使得该材料适合于具有集成电容器和电感器并且可用于数据处理或信号处理的具有多层结构的部件。

6. 发明授权

US07454178B2 Low-loss transmitter module 有权
标题翻译：低损耗发射器模块
公开(公告)号：US07454178B2
公开(公告)日：2008-11-18
申请号：US11272596
申请日：2005-11-14
申请人： Christian Block , Holger Flühr , Christian Hoffmann
发明人： Christian Block , Holger Flühr , Christian Hoffmann
IPC分类号： H04B1/02
CPC分类号： H04B1/0483 , H03H7/0138 , H04B1/0458 , H04B1/48 , H04B1/54
摘要： A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.
摘要翻译：具有设置在输入侧的具有功率放大器的至少一个传输路径的无线传输系统的发射机模块包括设置在输出侧的低通滤波器和设置在其间的阻抗转换器。因此，功率放大器和低通滤波器设置在多层载体衬底的顶表面上。优选地，阻抗转换器设置在载体衬底的金属化平面中。本发明将所有这些组件集成在一个模块中特别允许低阻抗放大器输出与具有确定的输出阻抗（例如50欧姆）的发射机模块的输出之间的逐步阻抗适配，由此阻抗适配部分由低通滤波器进行。多级阻抗适配允许减少例如在阻抗转换器中使用的线路段的长度和所涉及的信号损耗。

7. 发明申请

US20070108584A1 Transmitter module with improved heat dissipation 审中-公开
标题翻译：变送器模块具有改善的散热
公开(公告)号：US20070108584A1
公开(公告)日：2007-05-17
申请号：US10570189
申请日：2004-08-12
申请人： Holger Fluhr , Christian Block , Christian Hoffmann
发明人： Holger Fluhr , Christian Block , Christian Hoffmann
IPC分类号： H01L23/48
CPC分类号： H05K1/0209 , H01L2224/16227 , H01L2224/48227 , H01L2224/73253 , H01L2924/15313 , H01L2924/15323 , H04B1/036 , H05K1/0298 , H05K1/183 , H05K1/185 , H05K3/284 , H05K2201/09781 , H05K2201/10674
摘要： A transmitter module for mobile radio applications includes a multilayer module substrate with levels of metallization and intervening dielectric stacks in which a circuit is implemented by structuring the levels of metallization. In or on the module substrate, at least one HF filter or adjustment network is implemented. On the underside of the module substrate, a cutout, in which a chip element is soldered in a flip-chip-arrangement, is provided. The rear of the chip element pointing to the outside displays a metallization that makes a good thermal contact of the chip element with extrinsic circuit surroundings possible.
摘要翻译：用于移动无线电应用的发射机模块包括具有金属化水平和中间介电堆叠的多层模块衬底，其中通过构造金属化水平来实现电路。在模块衬底中或模块衬底上，实现至少一个HF滤波器或调节网络。在模块基板的下侧，设置有以倒装芯片布置焊接芯片元件的切口。指向外部的芯片元件的后部显示出使得芯片元件与外部电路环境的良好热接触可能的金属化。

8. 发明申请

US20060121874A1 Low-loss transmitter module 有权
标题翻译：低损耗发射器模块
公开(公告)号：US20060121874A1
公开(公告)日：2006-06-08
申请号：US11272596
申请日：2005-11-14
申请人： Christian Block , Holger Fluhr , Christian Hoffmann
发明人： Christian Block , Holger Fluhr , Christian Hoffmann
IPC分类号： H04B1/02 , H04B1/28
CPC分类号： H04B1/0483 , H03H7/0138 , H04B1/0458 , H04B1/48 , H04B1/54
摘要： A transmitter module of a wireless transmission system with at least one transmission path having a power amplifier disposed at the input side includes a low-pass filter disposed at the output side and an impedance converter disposed therebetween. The power amplifier and the low-pass filter are, thereby, disposed on the top surface of a multi-layer carrier substrate. Preferably, the impedance converter is disposed in metallization planes of the carrier substrate. The inventive integration of all of these components in one module especially allows for a step-wise impedance adaptation between the low-impedance amplifier output and the output of the transmitter module having a defined output impedance (e.g. 50 ohm), whereby the impedance adaptation is partially carried out by the low-pass filter. A multistage impedance adaptation allows for a reduction of, e.g., the length of the line sections used in the impedance converter and the signal losses involved.
摘要翻译：具有设置在输入侧的具有功率放大器的至少一个传输路径的无线传输系统的发射机模块包括设置在输出侧的低通滤波器和设置在其间的阻抗转换器。因此，功率放大器和低通滤波器设置在多层载体衬底的顶表面上。优选地，阻抗转换器设置在载体衬底的金属化平面中。本发明将所有这些组件集成在一个模块中特别允许低阻抗放大器输出与具有确定的输出阻抗（例如50欧姆）的发射机模块的输出之间的逐步阻抗适配，由此阻抗适配部分由低通滤波器进行。多级阻抗适配允许减少例如在阻抗转换器中使用的线路段的长度和所涉及的信号损耗。

9. 发明申请

US20090174054A1 Module with Flat Construction and Method for Placing Components 审中-公开
标题翻译：具有扁平结构的模块和放置组件的方法
公开(公告)号：US20090174054A1
公开(公告)日：2009-07-09
申请号：US12352436
申请日：2009-01-12
申请人： Christian Block , Sebastian Brunner , Christian Hoffmann
发明人： Christian Block , Sebastian Brunner , Christian Hoffmann
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/85 , H01L23/3121 , H01L23/3171 , H01L23/49822 , H01L24/05 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/83 , H01L2224/02166 , H01L2224/04042 , H01L2224/05073 , H01L2224/05644 , H01L2224/45014 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/49175 , H01L2224/4945 , H01L2224/78301 , H01L2224/83 , H01L2224/85051 , H01L2224/85186 , H01L2224/85191 , H01L2224/85201 , H01L2224/85205 , H01L2224/85207 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01068 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15798 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/4554 , H01L2924/206
摘要： A module for electrical components is proposed in which connection surfaces that can be bonded are provided on a multi-layer substrate with integrated wiring; a component chip is bonded on the top that has bond pads on its surface pointing upward and that contacts the substrate by means of bonding wires. Here, the wire guide of the bonding wires is so that they are each bonded with a ball on a connection surface and with the wedge directly on one of the bond pads.
摘要翻译：提出了一种用于电气部件的模块，其中可以结合的连接表面设置在具有集成布线的多层基板上; 部件芯片结合在顶部，其表面上具有接合焊盘，并且通过接合线与基板接触。这里，接合线的线导向器使得它们各自在连接表面上与球接合，并且楔子直接连接在一个接合焊盘上。

10. 发明授权

US09620266B2 Electrical device 有权
公开(公告)号：US09620266B2
公开(公告)日：2017-04-11
申请号：US14131559
申请日：2012-07-04
申请人： Markus Ortner , Michael Schossmann , Markus Koini , Günter Engel , Christian Hoffmann
发明人： Markus Ortner , Michael Schossmann , Markus Koini , Günter Engel , Christian Hoffmann
IPC分类号： H01G4/232 , H01C1/148 , H01C1/01 , H01C7/02 , H01C7/04 , H01C7/10 , H01G4/248 , H01G4/30 , H01C7/00 , H01G2/06
CPC分类号： H01C1/148 , H01C1/01 , H01C7/008 , H01C7/02 , H01C7/04 , H01C7/10 , H01G2/06 , H01G4/232 , H01G4/248 , H01G4/30
摘要： An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip.

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