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1. 发明申请

US20050059371A1 Circuit arrangement, switching module comprising said circuit arrangement and use of switching module 审中-公开
标题翻译：电路布置，开关模块，包括所述电路装置和开关模块的使用
公开(公告)号：US20050059371A1
公开(公告)日：2005-03-17
申请号：US10490753
申请日：2002-09-30
申请人： Christian Block , Holger Fluhr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossnig , Heinz Florian , Gunther Greier
发明人： Christian Block , Holger Fluhr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossnig , Heinz Florian , Gunther Greier
IPC分类号： H01Q1/50 , H04B1/18 , H04B1/48 , H04B1/06 , H04B1/16 , H04B7/00
CPC分类号： H01Q1/50 , H04B1/18 , H04B1/48
摘要： The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first protective device (6) has an antenna input (111) and a switch output (112), which are connected to one another by a line (113), and in which a voltage-limiting element (114) is connected to a ground (8) in parallel to the line (113). The advantage of the circuit array of the invention is that the protective device (6) has a low insertion loss. The invention also relates to a circuit module as well as the use of the circuit module as a front-end module.
摘要翻译：本发明涉及一种具有天线输入（1），信号输入（2）和信号输出（3），开关单元（4）的电路阵列，其中天线输入（1）连接到第一保护装置（6），其中所述第一保护装置（6）具有通过线（113）彼此连接的天线输入（111）和开关输出（112），并且其中，限制元件（114）连接到与线路（113）平行的接地（8）。本发明的电路阵列的优点在于保护装置（6）具有低插入损耗。本发明还涉及电路模块以及电路模块作为前端模块的使用。

2. 发明申请

US20050059358A1 Circuit, switching module comprising the same, and use of said switching module 有权
标题翻译：电路，包括该电路的开关模块，以及所述开关模块的使用
公开(公告)号：US20050059358A1
公开(公告)日：2005-03-17
申请号：US10490930
申请日：2002-09-27
申请人： Christian Block , Holger Fluhr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossing , Heinz Florian , Gunther Greier
发明人： Christian Block , Holger Fluhr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossing , Heinz Florian , Gunther Greier
IPC分类号： H04B1/40 , H01Q1/50 , H04B1/18 , H04B1/48 , H04B1/44
CPC分类号： H04B1/18 , H01Q1/50 , H04B1/48
摘要： The invention relates to a circuit array with an antenna input (1), a signal input (2) and a signal output (3), a switch unit (4), in which the antenna input (1) is connected to a first protective device (6) against electrostatic discharges, wherein the first5 protective device (6) is a band-pass filter in a π configuration. An advantage of the first protective device (6) is that when it is used in a mobile telephone, a band-pass filter in the front-end module can be omitted. In addition, the band-pass filter has very favorable filtering characteristics, so that ESD-related interference can be effectively suppressed. The invention also relates to a circuit module and the use of the circuit module.
摘要翻译：本发明涉及一种具有天线输入（1），信号输入（2）和信号输出（3），开关单元（4）的电路阵列，其中天线输入（1）连接到第一保护装置（6），其防止静电放电，其中所述第一保护装置（6）是pi配置的带通滤波器。第一保护装置（6）的优点在于，当在移动电话中使用时，可以省略前端模块中的带通滤波器。此外，带通滤波器具有非常好的滤波特性，从而可以有效地抑制ESD相关干扰。本发明还涉及电路模块和电路模块的用途。

3. 发明授权

US07343137B2 Circuit, switching module comprising the same, and use of said switching module 有权
标题翻译：电路，包括该电路的开关模块，以及所述开关模块的使用
公开(公告)号：US07343137B2
公开(公告)日：2008-03-11
申请号：US10490930
申请日：2002-09-27
申请人： Christian Block , Holger Flühr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossnig , Heinz Florian , Günther Greier
发明人： Christian Block , Holger Flühr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossnig , Heinz Florian , Günther Greier
IPC分类号： H04B1/44
CPC分类号： H04B1/18 , H01Q1/50 , H04B1/48
摘要： The invention relates to a circuit comprising an antenna input (1), a signal input (2) and a signal output (3), and a switching unit (4), wherein the antenna input (1) is connected to a first protection device (6) against electrostatic discharges, said first protection device (6) being a band-pass filter in a π-configuration. The advantage of the first protection device (6) is that it eliminates the need for a band-pass filter in the front end module, when used in a mobile telephone. Furthermore, the band-pass filter has a very good filtering characteristic, enabling ESD-related disturbances to be effectively suppressed. The invention also relates to a switching module and to the use of the same.
摘要翻译：本发明涉及一种包括天线输入（1），信号输入（2）和信号输出（3）以及开关单元（4）的电路，其中天线输入（1）连接到第一保护装置（6）抵抗静电放电，所述第一保护装置（6）是pi结构的带通滤波器。第一保护装置（6）的优点在于，当在移动电话中使用时，其不需要前端模块中的带通滤波器。此外，带通滤波器具有非常好的滤波特性，能够有效地抑制ESD相关干扰。本发明还涉及一种开关模块及其使用。

4. 发明授权

US07492565B2 Bandpass filter electrostatic discharge protection device 有权
标题翻译：带通滤波器静电放电保护装置
公开(公告)号：US07492565B2
公开(公告)日：2009-02-17
申请号：US10490914
申请日：2002-09-27
申请人： Christian Block , Holger Flühr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossnig , Heinz Florian , Günther Greier
发明人： Christian Block , Holger Flühr , Kurt Wiesbauer , Johann Riedler , Heinz Ragossnig , Heinz Florian , Günther Greier
IPC分类号： H02H9/00
CPC分类号： H01Q1/50 , H04B1/48
摘要： A circuit array includes an antenna input, a signal input, a signal output, and a switch unit. The switch unit connects the antenna to either the signal input or the signal output. The antenna input is connected to a first productive device. The first protective device is a band-pass filter in a T configuration.
摘要翻译：电路阵列包括天线输入，信号输入，信号输出和开关单元。开关单元将天线连接到信号输入或信号输出。天线输入连接到第一生产设备。第一保护装置是T配置中的带通滤波器。

5. 发明申请

US20050237684A1 Circuit arrangement 有权
标题翻译：电路布置
公开(公告)号：US20050237684A1
公开(公告)日：2005-10-27
申请号：US10526278
申请日：2003-10-01
申请人： Christian Block , Holger Fluhr , Andreas Przadka , Heinz Ragossnig
发明人： Christian Block , Holger Fluhr , Andreas Przadka , Heinz Ragossnig
IPC分类号： H02H9/06 , H04B1/18 , H04B1/48 , H02H9/04
CPC分类号： H04B1/48 , H02H9/06 , H04B1/18
摘要： A circuit arrangement is described having a terminal (1) for a high-frequency signal, having at least two additional signal leads (21a, 21b, 21c, 22a, 22b), having a switching unit (3) for connecting the terminal (1) to a signal lead (21a, 21b, 21c, 22a, 22b), having a primary protection device (41) against electrostatic discharges, which is connected between the terminal (1) and the switching unit (3), the protection device (41) containing a first voltage limitation element (51), which diverts voltage pulses that exceed a switching voltage of 200 V to a reference potential (7). The use of a gallium arsenide double diode makes it possible to attain the advantage of a low insertion loss coupled with a low switching voltage.
摘要翻译：描述了具有用于高频信号的端子（1）的电路装置，其具有至少两个附加信号引线（21a，21b，21c，22a，22b），其具有开关单元（3），用于将端子（1）连接到具有抵抗静电放电的主保护装置（41）的信号引线（21a，21b，21c，22a，22b），所述主保护装置连接在端子（1）和开关单元（3），所述保护装置（41）包含第一电压限制元件（51），其将超过200V的开关电压的电压脉冲转换为参考电位（7）。使用砷化镓双重二极管可以实现与低开关电压相结合的低插入损耗的优点。

6. 发明申请

US20110037559A1 ELECTRICAL MULTILAYER COMPONENT WITH REDUCED PARASITIC CAPACITANCE 有权
标题翻译：具有降低PARASIIC电容的电气多层组件
公开(公告)号：US20110037559A1
公开(公告)日：2011-02-17
申请号：US11993273
申请日：2006-06-19
申请人： Christian Block , Holger Flühr , Alois Kleewein , Günter Pudmich , Heinz Ragossnig
发明人： Christian Block , Holger Flühr , Alois Kleewein , Günter Pudmich , Heinz Ragossnig
IPC分类号： H01C7/10 , H01C7/13
CPC分类号： H01G4/30 , H01C1/148 , H01C7/1006 , H01C7/18 , H01G4/12 , H01G4/232
摘要： An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.
摘要翻译：电气多层部件包括具有顶部和底部的具有陶瓷层的堆叠的主体。第一和第二连接表面位于主体的底部。电极表面位于陶瓷层之间的金属化层中。通过触点位于金属化层之间。通孔触点中的至少一个电连接到电极表面或连接表面。通过相应的通孔接点连接到一个连接表面的电极表面是第一电极结构或第二电极结构。第一或第二电极结构中的至少一个包括具有盲端的通孔接触。第一和第二电极结构之间的最短距离是从盲端到（i）在盲端上方或下方的金属化层的垂直距离，或（ii）另一电极结构的盲端。

7. 发明授权

US08116046B2 Circuit arrangement that includes a device to protect against electrostatic discharge 有权
标题翻译：电路装置包括一个防止静电放电的装置
公开(公告)号：US08116046B2
公开(公告)日：2012-02-14
申请号：US10526278
申请日：2003-10-01
申请人： Christian Block , Holger Flühr , Andreas Przadka , Heinz Ragossnig
发明人： Christian Block , Holger Flühr , Andreas Przadka , Heinz Ragossnig
IPC分类号： H02H9/00
CPC分类号： H04B1/48 , H02H9/06 , H04B1/18
摘要： Circuitry includes a terminal for a high-frequency signal, at least two signal lines, a switching unit for connecting the terminal to a signal line, and a primary protection device for protecting against electrostatic discharges. The primary protection device is between the terminal and the switching unit. The primary protection device includes a first element that diverts voltages having a pulse height greater than 200V relative to a reference potential.
摘要翻译：电路包括用于高频信号的端子，至少两条信号线，用于将端子连接到信号线的开关单元，以及用于防止静电放电的主保护装置。主保护装置位于端子和开关单元之间。主保护装置包括相对于参考电位转移脉冲高度大于200V的电压的第一元件。

8. 发明申请

US20090039965A1 LOW-LOSS ELECTRICAL COMPONENT WITH AN AMPLIFIER 有权
标题翻译：带放大器的低损耗电气元件
公开(公告)号：US20090039965A1
公开(公告)日：2009-02-12
申请号：US11917590
申请日：2006-05-10
申请人： Christian Block , Miguel Falagan , Holger Fluhr
发明人： Christian Block , Miguel Falagan , Holger Fluhr
IPC分类号： H03F1/02
CPC分类号： H03F1/0211 , H01L2924/0002 , H01P1/2007 , H03F3/60 , H03F2200/12 , H01L2924/00
摘要： An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks.
摘要翻译：电气部件包括放大器，其包括输出级，以及用于为输出级供电的电源路径。电源路径包括并行包括导体轨道部分的线。电气部件还包括载体衬底，其包含放大器和具有导体轨迹的线。

9. 发明授权

US07848727B2 Integrated radio frequency module 有权
标题翻译：集成射频模块
公开(公告)号：US07848727B2
公开(公告)日：2010-12-07
申请号：US11175961
申请日：2005-07-06
申请人： Christian Block , Miguel Falagan , Isabel Gavela , Holger Fluhr
发明人： Christian Block , Miguel Falagan , Isabel Gavela , Holger Fluhr
IPC分类号： H04B1/10
CPC分类号： H01P5/10 , H01L23/49822 , H01L23/66 , H01L24/48 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/01068 , H01L2924/09701 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0237 , H05K1/0298 , H05K1/16 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A radio frequency (RF) module includes a multilayer substrate having dielectric layers and metallization layers that include one or more circuit elements. The metallization layers are located between the dielectric layers. The RF module also includes a symmetric transmission input associated with the multilayer substrate, an RF element on the multilayer substrate to provide RF functionality, and a balun integrated in the substrate behind the symmetric transmission input.
摘要翻译：射频（RF）模块包括具有电介质层和包括一个或多个电路元件的金属化层的多层衬底。金属化层位于电介质层之间。 RF模块还包括与多层基板相关联的对称传输输入，多层基板上的RF元件以提供RF功能，以及在对称传输输入后面集成在基板中的平衡 - 不平衡变压器。

10. 发明授权

US08058965B2 Electrical multilayer component with reduced parasitic capacitance 有权
标题翻译：降低寄生电容的电气多层组件
公开(公告)号：US08058965B2
公开(公告)日：2011-11-15
申请号：US11993273
申请日：2006-06-19
申请人： Christian Block , Holger Flühr , Alois Kleewein , Günter Pudmich , Heinz Ragossnig
发明人： Christian Block , Holger Flühr , Alois Kleewein , Günter Pudmich , Heinz Ragossnig
IPC分类号： H01C7/10
CPC分类号： H01G4/30 , H01C1/148 , H01C7/1006 , H01C7/18 , H01G4/12 , H01G4/232
摘要： An electrical multi-layer component includes a body having a stack of ceramic layers, with a top and a bottom. First and second connection surfaces are on the bottom of the body. Electrode surfaces are in metallization layers among the ceramic layers. Via contacts are between metallization layers. At least one of the via contacts is connected electrically to an electrode surface or to a connection surface. An electrode surface connected to one of the connection surfaces, through a corresponding via contact, is a first electrode structure or a second electrode structure. At least one of the first or second electrode structures includes a via contact that has a blind end. A shortest distance between the first and second electrode structures is a vertical distance from the blind end to: (i) a metallization layer above or below the blind end, or (ii) a blind end of another electrode structure.
摘要翻译：电气多层部件包括具有顶部和底部的具有陶瓷层的堆叠的主体。第一和第二连接表面位于主体的底部。电极表面位于陶瓷层之间的金属化层中。通过触点位于金属化层之间。通孔触点中的至少一个电连接到电极表面或连接表面。通过相应的通孔接点连接到一个连接表面的电极表面是第一电极结构或第二电极结构。第一或第二电极结构中的至少一个包括具有盲端的通孔接触。第一和第二电极结构之间的最短距离是从盲端到（i）在盲端上方或下方的金属化层的垂直距离，或（ii）另一电极结构的盲端。

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