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    • 1. 发明申请
    • STRUCTURE OF MULTILAYER CERAMIC DEVICE
    • 多层陶瓷器件的结构
    • US20120208040A1
    • 2012-08-16
    • US13024470
    • 2011-02-10
    • Ching-Hohn LIENHong-Zong Xu
    • Ching-Hohn LIENHong-Zong Xu
    • B32B15/02
    • H01G4/005H01G4/30Y10T428/12056
    • A multilayer ceramic device comprises a laminated ceramic body having opposite end surfaces, a pair of conductive electrodes each respectively attached to one end surface of the laminated ceramic body and a plurality of alternately staggered internal electrodes within the laminated ceramic body configured in an alternating manner and each electrically connected to the corresponding conductive electrodes respectively; each conductive electrodes of the multilayer ceramic device is further covered with a solder paste layer so that the multilayer ceramic device is thus made without any plating step and no need of treating waste liquid nickel or waste liquid tin as well as no problem of environmental pollution caused by plating solution, thereby lowering manufacturing costs and reducing processing time.
    • 多层陶瓷器件包括具有相对端面的层叠陶瓷体,分别安装在层叠陶瓷体的一个端面上的一对导电电极和层叠陶瓷体内的多个交错交错的内部电极,其以交替的方式配置和 各自电连接到相应的导电电极; 多层陶瓷器件的每个导电电极进一步用焊膏层覆盖,使得多层陶瓷器件因此不经任何电镀步骤而制成,并且不需要处理废液镍或废液锡,并且没有引起环境污染的问题 通过电镀液,降低制造成本,缩短加工时间。
    • 3. 发明申请
    • PROCESS FOR PRODUCING MULTILAYER CHIP ZINC OXIDE VARISTOR CONTAINING PURE SILVER INTERNAL ELECTRODES AND FIRING AT ULTRALOW TEMPERATURE
    • 生产含有纯银内电极的多层芯片氧化锌磁体的方法和超导温度
    • US20120135563A1
    • 2012-05-31
    • US13298458
    • 2011-11-17
    • Ching-Hohn LIENJie-An ZHU
    • Ching-Hohn LIENJie-An ZHU
    • H01L21/02
    • H01C7/112H01C7/18
    • A low-temperature firing process is available for cost saving to produce a multilayer chip ZnO varistor containing pure silver (Ag) formed as internal electrodes and calcined at ultralow firing temperature of 850-900° C., which process comprises: a) individually preparing ZnO grains in advance doped with doping ions for promotion of semi-conductivity of ZnO grains if calcined; b) individually preparing a desired high-impedance sintering material to be fired as grain boundaries to encapsulate ZnO grains; c) mixing the doped ZnO grains of Step a) with the high-impedance sintering material of Step b) in a predetermined ratio to form a mixture and proceeding with an initial sintering to have the mixture sintered and ground as composite ZnO ceramic powders, and d) processing the sintered mixture of Step c) to make multilayer chip ZnO varistors containing pure silver (Ag) internal electrodes but sintered at ultralow firing temperature of 850-900° C.
    • 低成本焙烧工艺可以节约成本,生产出一种含有形成内部电极的纯银(Ag)的多层芯片ZnO压敏电阻,并在850-900℃的超低烧结温度下煅烧,该方法包括:a)单独制备 预先掺杂掺杂离子的ZnO晶粒,如果煅烧,则促进ZnO晶粒的半导电性; b)单独制备待烧结的期望的高阻抗烧结材料作为晶界以包封ZnO颗粒; c)将步骤a)的掺杂ZnO晶粒与步骤b)的高阻抗烧结材料以预定比例混合,形成混合物,并进行初始烧结,将混合物烧结并研磨为复合ZnO陶瓷粉末; d)加工步骤c)的烧结混合物以制备含有纯银(Ag)内部电极但在850-900℃的超低烧结温度下烧结的多层片状ZnO压敏电阻
    • 5. 发明申请
    • ZINC-OXIDE SURGE ARRESTER FOR HIGH-TEMPERATURE OPERATION
    • 用于高温操作的氧化锌冲击回收器
    • US20120057265A1
    • 2012-03-08
    • US13023624
    • 2011-02-09
    • Ching-Hohn LIENJie-An ZhuZhi-Xian XuXing-Xiang HuangTing-Yi Fang
    • Ching-Hohn LIENJie-An ZhuZhi-Xian XuXing-Xiang HuangTing-Yi Fang
    • H02H1/00
    • H01C7/112H01C7/10H01C7/12
    • A ZnO surge arrester for high-temperature operation is characterized in that a grain boundary layer between ZnO grains thereof contains a BaTiO3-based positive temperature coefficient thermistor material, which takes 10-85 mol % in the overall grain boundary layer, and when operating temperature raises, the positive temperature coefficient thermistor material in the grain boundary layer has its resistance sharply increasing with the raising temperature, so as to compensate or partially compensate decrease in resistance of components in the grain boundary layer caused by the raising temperature, thereby making the resistance of the grain boundary layer in the ZnO surge arrester more independent of temperature. The ZnO surge arrester thus is suitable for operation where a maximum operating temperature is higher than 125° C., or even higher than 150° C.
    • 用于高温操作的ZnO避雷器的特征在于,其ZnO晶粒之间的晶界层包含基于BaTiO 3的正温度系数热敏电阻材料,其在整个晶界层中占据10-85mol%,并且当工作温度 升温时,晶界层中的正温度系数热敏电阻材料的电阻随着升温而急剧上升,从而补偿或部分补偿由升温引起的晶界层中的组分的电阻降低,从而使电阻 的ZnO避雷器中的晶界层更加独立于温度。 因此,ZnO避雷器适用于最高工作温度高于125℃或甚至高于150℃的操作。