专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090025427A1 Manufacturing Method for Micro Components 审中-公开
标题翻译：微型零件制造方法
公开(公告)号：US20090025427A1
公开(公告)日：2009-01-29
申请号：US11839690
申请日：2007-08-16
申请人： Ching-Cherng Sun , Shih-Hsin Ma , Tsung-Xian Lee
发明人： Ching-Cherng Sun , Shih-Hsin Ma , Tsung-Xian Lee
IPC分类号： C03B23/023
CPC分类号： B81C99/0085 , B81B2201/047
摘要： A manufacturing method for micro components includes the steps of manufacturing a large component by molding and shaping a thermally contractible material; heating and cooling the large component, such that the size of the large component can be reduced by the contraction of the material to form a reduced component; duplicating the reduced component to obtain a mold; and manufacturing a further reduced component by the molding and shaping process of the mold. The manufacturing method simply requires the processes of duplicating the component, contracting the material with an equal contraction ratio, and preparing the mold, and thus the manufacturing method is simple, easy and fast. The method can overcome the shortcomings of the prior art, of which the precision and the freedom for the external design of the micro components cannot be controlled easily.
摘要翻译：微型部件的制造方法包括以下步骤：通过模制和成形热收缩材料来制造大部件; 加热和冷却大部件，使得可以通过材料的收缩来减小大部件的尺寸以形成减少的部件; 复制还原组分以获得模具; 并通过模具的成型和成型工艺制造进一步减少的部件。制造方法简单地要求复制部件，以等收缩比收缩材料，制备模具的过程，因此制造方法简单，容易和快速。该方法可以克服现有技术的缺点，其中微组件的外部设计的精度和自由度不能容易地被控制。

2. 发明申请

US20090015157A1 PHOSPHOR PACKAGE OF LIGHT EMITTING DIODES 审中-公开
标题翻译：磷光体发光二极管封装
公开(公告)号：US20090015157A1
公开(公告)日：2009-01-15
申请号：US11839132
申请日：2007-08-15
申请人： Ching-Cherng Sun , Shih-Hsin Ma , Tsung-Xian Lee
发明人： Ching-Cherng Sun , Shih-Hsin Ma , Tsung-Xian Lee
IPC分类号： H01J63/04
CPC分类号： H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/8592 , H01L2924/00014
摘要： A phosphor package of light emitting diodes includes a lens made of a transparent optical material, and a side of the lens with at least one phosphor containing groove corresponding to a light emitting diode chip. The concentration of the phosphor is adjusted before a required quantity of phosphor is adhered into the phosphor containing groove. The phosphor is baked and solidified. A gel is filled into the gap between the wire-bonded light emitting chip and the phosphor for binding with each other to complete the manufacturing process of a phosphor package; and such manufacturing process can effectively and accurately control the phosphor to achieve high quality stability and color uniformity.
摘要翻译：发光二极管的荧光体封装包括由透明光学材料制成的透镜，以及具有与发光二极管芯片对应的至少一个含磷光体槽的透镜侧。在将所需量的荧光体粘附到含荧光体槽之前调节荧光体的浓度。将磷光体烘烤并固化。将凝胶填充到引线键合的发光芯片和荧光体之间的间隙中以便彼此结合以完成磷光体封装的制造过程; 并且这种制造工艺可以有效和准确地控制荧光粉以实现高质量的稳定性和颜色均匀性。

3. 发明申请

US20100055813A1 Method of Packaging Light Emitting Diode on Through-Hole Substrate 审中-公开
标题翻译：在通孔基板上封装发光二极管的方法
公开(公告)号：US20100055813A1
公开(公告)日：2010-03-04
申请号：US12206710
申请日：2008-09-08
申请人： Ching-cherng SUN , Tsung-Xian Lee
发明人： Ching-cherng SUN , Tsung-Xian Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , H01L33/56 , H01L33/58 , H01L2933/0041
摘要： In a method of packaging a light emitting diode on a through-hole substrate, through holes are created and a wire bonded light emitting diode (LED) chip is set on the substrate, and a lens is set on the through holes and the wire bonded LED chip. The through holes are provided for filling a phosphor into the lens and extracting air in the lens, so that the phosphor can be coated uniformly on the wire bonded LED chip. After the phosphor is solidified, the packaging of the LED is completed. The method can produce a desired shape of the phosphor while the cost is being taken into consideration, and thus the invention can help manufacturers to produce an accurate shape of the phosphor to provide an LED light source of a better quality without involving a complicated procedure.
摘要翻译：在通孔基板上封装发光二极管的方法中，形成通孔，在基板上设置引线键合发光二极管（LED）芯片，透镜设置在通孔上，引线键合 LED芯片设置通孔用于将荧光体填充到透镜中并且提取透镜中的空气，使得荧光体可以均匀地涂覆在引线键合的LED芯片上。荧光体固化后，LED的封装完成。该方法可以在考虑成本的同时产生期望的荧光体形状，因此本发明可以帮助制造商产生准确的磷光体形状，以提供更好质量的LED光源而不涉及复杂的过程。

4. 发明申请

US20090275257A1 Process for Encapsulating LED Chip by Fluorescent Material 审中-公开
标题翻译：荧光材料封装LED芯片的工艺
公开(公告)号：US20090275257A1
公开(公告)日：2009-11-05
申请号：US12189138
申请日：2008-08-09
申请人： Ching-Cherng Sun , Tsung-Xian Lee , Chun-te Wu
发明人： Ching-Cherng Sun , Tsung-Xian Lee , Chun-te Wu
IPC分类号： H01J9/02 , H05B7/00
CPC分类号： H01L33/505 , B29C45/14655 , B29C45/1671 , H01L2933/0041
摘要： An LED chip encapsulation process includes the steps of (a) forming a fluorescent member by injection molding to encapsulate an LED chip; (b) hardening the fluorescent member; (c) forming a transparent dome to embed and encapsulate the LED chip and the fluorescent member; and (d) securing the dome and the substrate together to finish a packaging of the LED chip. Shape of the fluorescent member disposed on the LED chip can be controlled precisely, thereby increasing quality and color uniformity of the produced LED chip. Alternatively, the LED chip is a remote LED chip and step (a) is replaced by forming a plastic member to encapsulate the LED chip and forming a fluorescent member on the top of the plastic member by injection molding.
摘要翻译： LED芯片封装工艺包括以下步骤：（a）通过注塑成型荧光部件以封装LED芯片; （b）使荧光部件硬化; （c）形成透明圆顶以嵌入和封装LED芯片和荧光部件; 和（d）将圆顶和基板固定在一起以完成LED芯片的封装。可以精确地控制设置在LED芯片上的荧光体的形状，从而提高所制造的LED芯片的质量和颜色均匀性。或者，LED芯片是远程LED芯片，并且通过形成塑料构件来代替步骤（a），以封装LED芯片并通过注射成型在塑料构件的顶部上形成荧光构件。

5. 发明授权

US09000461B2 Optoelectronic element and manufacturing method thereof 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US09000461B2
公开(公告)日：2015-04-07
申请号：US13205987
申请日：2011-08-09
申请人： Cheng-Nan Han , Tsung-Xian Lee , Min-Hsun Hsieh , Hung-Hsuan Chen , Hsin-Mao Liu , Hsing-Chao Chen , Ching-San Tao , Chih-Peng Ni , Tzer-Perng Chen , Jen-Chau Wu
发明人： Cheng-Nan Han , Tsung-Xian Lee , Min-Hsun Hsieh , Hung-Hsuan Chen , Hsin-Mao Liu , Hsing-Chao Chen , Ching-San Tao , Chih-Peng Ni , Tzer-Perng Chen , Jen-Chau Wu
IPC分类号： H01L33/46 , H01L33/00 , H01L33/20 , H01L33/38 , H01L33/48 , H01L33/58
CPC分类号： H01L33/0079 , H01L33/20 , H01L33/38 , H01L33/46 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： An optoelectronic element includes an optoelectronic unit having a first top surface, a first bottom surface opposite to the first top surface, and a lateral surface between the first top surface and the first bottom surface; a first transparent structure covering the lateral surface and exposing the first top surface of the optoelectronic unit; a first insulating layer on the first top surface and the first transparent structure; a second insulating layer on the first insulating layer; a first opening through the first insulating layer and the second insulating layer; and a first conductive layer on the second insulating layer and electrically connecting to the optoelectronic unit via the first opening.
摘要翻译：光电子元件包括具有第一顶表面，与第一顶表面相对的第一底表面和第一顶表面与第一底表面之间的侧表面的光电单元; 覆盖所述侧表面并暴露所述光电单元的第一顶表面的第一透明结构; 第一顶表面上的第一绝缘层和第一透明结构; 第一绝缘层上的第二绝缘层; 穿过所述第一绝缘层和所述第二绝缘层的第一开口; 以及在所述第二绝缘层上的第一导电层，并且经由所述第一开口电连接到所述光电单元。

6. 发明授权

US09194541B2 Illumination apparatus 有权
标题翻译：照明装置
公开(公告)号：US09194541B2
公开(公告)日：2015-11-24
申请号：US13293427
申请日：2011-11-10
申请人： Yao Chiu Lin , Been-Yu Liaw , Chih-Ming Wang , Ming-Chi Hsu , Yi-Jui Huang , Tsung-Xian Lee , Kuang-Ping Chao , Jhih-Sian Wang
发明人： Yao Chiu Lin , Been-Yu Liaw , Chih-Ming Wang , Ming-Chi Hsu , Yi-Jui Huang , Tsung-Xian Lee , Kuang-Ping Chao , Jhih-Sian Wang
IPC分类号： F21V3/00 , F21K99/00 , F21V5/00 , F21V3/02 , F21V3/04 , F21V13/02 , F21V7/00 , F21V7/22 , F21Y101/02 , F21V29/70
CPC分类号： F21V3/049 , F21K9/23 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V3/02 , F21V3/06 , F21V3/061 , F21V3/062 , F21V3/10 , F21V5/008 , F21V7/0016 , F21V7/22 , F21V13/02 , F21V29/70 , F21Y2115/10
摘要： This disclosure discloses an illumination apparatus. The illumination apparatus comprises a cover comprising a second portion and a first portion, and a light source disposed within the cover. An average thickness of the first portion is greater than that of the second portion.
摘要翻译：本公开公开了一种照明装置。该照明装置包括一个包括第二部分和第一部分的盖子以及设置在盖子内的光源。第一部分的平均厚度大于第二部分的平均厚度。

7. 发明申请

US20120132944A1 LIGHT-EMITTING DEVICE, LIGHT MIXING DEVICE AND MANUFACTURING METHODS THEREOF 有权
标题翻译：发光装置，轻混合装置及其制造方法
公开(公告)号：US20120132944A1
公开(公告)日：2012-05-31
申请号：US13306487
申请日：2011-11-29
申请人： Min-Hsun Hsieh , Chien-Yuan Wang , Tsung-Xian Lee , Chih-Ming Wang , Ming-Chi Hsu , Han-Min Wu
发明人： Min-Hsun Hsieh , Chien-Yuan Wang , Tsung-Xian Lee , Chih-Ming Wang , Ming-Chi Hsu , Han-Min Wu
IPC分类号： H01L33/50
CPC分类号： H01L33/58 , H01L33/46 , H01L33/507 , H01L33/56 , H01L2933/0091
摘要： Disclosed is a light-emitting device comprising: a carrier; a light-emitting element disposed on the carrier; a first light guide layer covering the light-emitting element, and disposed on the carrier; a wavelength conversion and light guide layer covering the first light guide layer and the light-emitting element, and disposed on the carrier; and a low refractive index layer disposed between the first light guide layer and the wavelength conversion and light guide layer; wherein the first light guide layer comprises a gradient refractive index, the wavelength conversion and light guide layer comprises a dome shape structure and is used to convert a wavelength of light emitted from the light-emitting element and transmit light, and the low refractive index layer is used to reflect light from the wavelength conversion and light guide layer.
摘要翻译：公开了一种发光装置，包括：载体; 设置在所述载体上的发光元件; 覆盖所述发光元件的第一导光层，并设置在所述载体上; 覆盖第一导光层和发光元件的波长转换和导光层，并设置在载体上; 以及设置在所述第一导光层与所述波长转换和导光层之间的低折射率层; 其中所述第一导光层包括梯度折射率，所述波长转换和导光层包括圆顶形结构，并用于转换从所述发光元件发射的光的波长并透射光，并且所述低折射率层用于反射来自波长转换和光导层的光。

8. 发明授权

US08692108B2 Solar power collecting device 有权
标题翻译：太阳能集热装置
公开(公告)号：US08692108B2
公开(公告)日：2014-04-08
申请号：US12982332
申请日：2010-12-30
申请人： Tsung-Xian Lee
发明人： Tsung-Xian Lee
IPC分类号： H01L31/052 , G02B6/42
CPC分类号： H01L31/0525 , F24S23/12 , F24S23/71 , F24S25/10 , F24S2025/012 , G02B6/42 , H01L31/0547 , H02S40/38 , Y02E10/52
摘要： A solar power collecting device including a parabolic concentrating unit, a light-guide pillar positioned on the parabolic concentrating unit, a solar cell positioned on the light-guide pillar and a transmissive protection cap for covering the light-guide pillar and the solar cell is disclosed.
摘要翻译：一种太阳能收集装置，包括抛物面聚光单元，位于抛物面聚光单元上的导光柱，位于导光柱上的太阳能电池和用于覆盖导光柱和太阳能电池的透射保护盖，披露

9. 发明授权

US08999736B2 Optoelectronic system 有权
标题翻译：光电系统
公开(公告)号：US08999736B2
公开(公告)日：2015-04-07
申请号：US12840848
申请日：2010-07-21
申请人： Min-Hsun Hsieh , Cheng-Nan Han , Steve Meng-Yuan Hong , Hsin-Mao Liu , Tsung-Xian Lee
发明人： Min-Hsun Hsieh , Cheng-Nan Han , Steve Meng-Yuan Hong , Hsin-Mao Liu , Tsung-Xian Lee
IPC分类号： H01L21/00 , H01L33/50 , H01L21/683 , H01L23/00 , H01L25/075 , H01L33/00 , H01L33/40
CPC分类号： H01L33/504 , H01L21/6835 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/96 , H01L25/0753 , H01L25/0756 , H01L33/0079 , H01L33/385 , H01L33/405 , H01L33/486 , H01L33/507 , H01L33/508 , H01L33/56 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4918 , H01L2224/82 , H01L2224/92 , H01L2224/96 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/10349 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method of making an optoelectronic system in accordance with the present disclosure is disclosed. The method includes providing a temporary substrate; providing un-packaged optoelectronic elements having sidewalls, top surfaces, and bottom surfaces, at least one of the unpackaged optoelectronic elements having an electrode provided on a side of the bottom surfaces; attaching the bottom surfaces to the temporary substrate such that a trench is formed between two of the un-packaged optoelectronic elements; providing an adhesive material to fully fill the trench and cover the un-packaged optoelectronic elements such that the sidewalls and top surfaces of the un-packaged optoelectronic elements are fully enclosed by the adhesive material; providing a transparent substrate on the adhesive material; and removing the temporary substrate without removing all the adhesive material covering the optoelectronic elements.
摘要翻译：公开了制造根据本公开的光电系统的方法。该方法包括提供临时衬底; 提供具有侧壁，顶表面和底表面的未封装的光电子元件，所述未封装的光电元件中的至少一个具有设置在所述底表面的一侧上的电极; 将底表面附接到临时衬底，使得在两个未封装的光电元件之间形成沟槽; 提供粘合剂材料以完全填充沟槽并覆盖未封装的光电子元件，使得未封装的光电元件的侧壁和顶表面被粘合剂材料完全封闭; 在粘合剂材料上提供透明基材; 并且除去临时衬底，而不去除覆盖光电子元件的所有粘合剂材料。

10. 发明授权

US08816508B2 Integrated lighting apparatus having a control device and method of manufacturing the same 有权
标题翻译：具有控制装置的集成照明装置及其制造方法
公开(公告)号：US08816508B2
公开(公告)日：2014-08-26
申请号：US13186812
申请日：2011-07-20
申请人： Hsin-Mao Liu , Min-Hsun Hsieh , Tzer-Perng Chen , Meng-Yuan Hong , Cheng Nan Han , Tsung-Xian Lee , Ta-Cheng Hsu , Chih-Chiang Lu
发明人： Hsin-Mao Liu , Min-Hsun Hsieh , Tzer-Perng Chen , Meng-Yuan Hong , Cheng Nan Han , Tsung-Xian Lee , Ta-Cheng Hsu , Chih-Chiang Lu
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L33/62 , H01L25/167 , H01L27/153 , H01L2924/0002 , H01L2924/00
摘要： An integrated lighting apparatus includes at least a lighting device, a control device comprising an integrated circuit, and a connector that is used to electrically connect the lighting device and the control device. With the combination, the integrated circuit drives the lighting device in accordance with its various designed functionality, thus expands applications of the integrated lighting apparatus.
摘要翻译：集成照明装置至少包括照明装置，包括集成电路的控制装置和用于电连接照明装置和控制装置的连接器。通过组合，集成电路根据其各种设计的功能驱动照明装置，从而扩大了集成照明装置的应用。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式