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1. 发明申请

US20080037224A1 Heat sink 审中-公开
标题翻译：散热器
公开(公告)号：US20080037224A1
公开(公告)日：2008-02-14
申请号：US11882851
申请日：2007-08-06
申请人： Chin-Ming Chen , Yu-Hung Huang , Alex Hsia , Tsung-Lin Chen
发明人： Chin-Ming Chen , Yu-Hung Huang , Alex Hsia , Tsung-Lin Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F3/02 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A heat sink has a heat-dissipating portion and a contact portion for contacting an electric device generating heat. The diameter of the contact portion is smaller than that of the heat-dissipating portion. The heat-dissipating portion has a plurality of fins. The contact portion is disposed on a bottom surface of the heat-dissipating and formed with the heat-dissipating portion as a single unitary member. The contact portion includes a first axial cross section and a second axial cross section. The first axial cross section is away from the heat-dissipating portion, and the second axial cross section is near the heat-dissipating portion. The diameter of the first axial cross section is larger than that of the second axial cross section.
摘要翻译：散热器具有散热部分和用于接触产生热量的电气装置的接触部分。接触部的直径小于散热部的直径。散热部具有多个翅片。接触部分设置在散热的底表面上并形成有散热部分作为单个整体部件。接触部分包括第一轴向横截面和第二轴向横截面。第一轴向截面远离散热部分，第二轴向横截面靠近散热部分。第一轴向截面的直径大于第二轴向截面的直径。

2. 外观设计

USD589466S1 Fan 有权
公开(公告)号：USD589466S1
公开(公告)日：2009-03-31
申请号：US29273600
申请日：2007-03-09
申请人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia
设计人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia

3. 发明申请

US20080030952A1 Heat dissipating module and its fan and housing 审中-公开
标题翻译：散热模块及其风扇和外壳
公开(公告)号：US20080030952A1
公开(公告)日：2008-02-07
申请号：US11606072
申请日：2006-11-30
申请人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia
发明人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating module has a fan and at least one heat sink contacting with a heat source. The fan has an impeller and a housing. The housing has a base for supporting the impeller, at least one rib extending from the edge of the base to the backward direction of the center of the base, at least one sidewall, an annular wall connecting with the rib and/or the sidewall, at least one protrusion axially protruding from the annular wall and/or the sidewall, at least one securing member disposed on the end of the protrusion, and at least one fastener disposed in the securing member. The base, the rib, the sidewall, the annular wall, the protrusion, and the securing member are integrally formed as a single piece. The protrusion has at least one block structure for fixing the heat sink to the housing.
摘要翻译：散热模块具有风扇和至少一个与热源接触的散热器。风扇有一个叶轮和一个外壳。壳体具有用于支撑叶轮的基座，至少一个从底座的边缘延伸到基部中心的后退方向的肋，至少一个侧壁，与肋和/或侧壁连接的环形壁，从所述环形壁和/或所述侧壁轴向突出的至少一个突起，设置在所述突起的端部上的至少一个固定构件和设置在所述固定构件中的至少一个紧固件。底座，肋，侧壁，环形壁，突起和固定构件整体形成为单件。突起具有用于将散热器固定到壳体的至少一个块结构。

4. 外观设计

USD561120S1 Heat dissipating module 有权
标题翻译：散热模块
公开(公告)号：USD561120S1
公开(公告)日：2008-02-05
申请号：US29266730
申请日：2006-09-28
申请人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia
设计人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia

5. 外观设计

USD581882S1 Fan housing 有权
公开(公告)号：USD581882S1
公开(公告)日：2008-12-02
申请号：US29273601
申请日：2007-03-09
申请人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia
设计人： Chin-Ming Chen , Yuhsien Lin , Tsung-Lin Chen , Alex Hsia

6. 发明申请

US20070047206A1 Composite heat dissipating apparatus 审中-公开
标题翻译：复合散热装置
公开(公告)号：US20070047206A1
公开(公告)日：2007-03-01
申请号：US11365879
申请日：2006-03-02
申请人： Cheng-Chih Lee , Tsung-Lin Chen , Wen-Tsao Lee , Chin-Ming Chen
发明人： Cheng-Chih Lee , Tsung-Lin Chen , Wen-Tsao Lee , Chin-Ming Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F2215/00 , F28F2215/10 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A composite heat dissipating apparatus includes a heat pipe and at least two heat sinks. The heat sinks are connected to each other. A space for accommodating the heat pipe therein is formed at a connection between the heat sinks. Each of the heat sinks is integrally formed as a single piece.
摘要翻译：复合散热装置包括热管和至少两个散热器。散热片相互连接。在散热片之间的连接处形成用于容纳热管的空间。每个散热器整体形成为单件。

7. 发明授权

US08581638B2 High-side driver circuit 有权
标题翻译：高端驱动电路
公开(公告)号：US08581638B2
公开(公告)日：2013-11-12
申请号：US13596113
申请日：2012-08-28
申请人： Tsung-Lin Chen , Edward Yi Chang , Wei-Hua Chieng , Stone Cheng , Shyr-Long Jeng , Che-Wei Chang
发明人： Tsung-Lin Chen , Edward Yi Chang , Wei-Hua Chieng , Stone Cheng , Shyr-Long Jeng , Che-Wei Chang
IPC分类号： H03B1/00
CPC分类号： H03K17/063 , H03K2217/0063 , H03K2217/0081
摘要： The present invention provides a high-side driver circuit including a power transistor, the first transistor, the second transistor, the second capacitor, the second diode, a start-up circuit. The start-up circuit is coupled between a resistor and the second capacitor to complete a gate driving circuit. And, the aforementioned resistor can either be the gate resistance of the power transistor or an external resistor. The design of start-up circuit enables the functionality of the bootstrap capacitor of being charged to a designate voltage level. Thus, the depletion-mode transistor can be controlled to turn on/off without a floating voltage source or a negative voltage source.
摘要翻译：本发明提供一种包括功率晶体管，第一晶体管，第二晶体管，第二电容器，第二二极管，启动电路的高侧驱动电路。启动电路耦合在电阻器和第二电容器之间以完成栅极驱动电路。而且，上述电阻可以是功率晶体管的栅极电阻或外部电阻。启动电路的设计使得自举电容器的功能被充电到指定的电压电平。因此，耗尽型晶体管可以被控制为在没有浮动电压源或负电压源的情况下导通/截止。

8. 发明授权

US08455996B1 Wafer level packaging method and a packaging structure using thereof 有权
标题翻译：晶圆级封装方法及其使用的封装结构
公开(公告)号：US08455996B1
公开(公告)日：2013-06-04
申请号：US13564749
申请日：2012-08-02
申请人： Tsung-Lin Chen , Jui-Chien Lien
发明人： Tsung-Lin Chen , Jui-Chien Lien
IPC分类号： H01L23/04
CPC分类号： B81C1/00269 , B81C2203/0109 , B81C2203/019
摘要： The present invention discloses a wafer level packaging method and a packaging structure for packaging a first wafer and a second wafer. The first wafer has a back side and an active side, and further, the active side of the first wafer has a MEMS element. The step of forming two through silicon vias is performed first. A first electrical interconnect and a first bonding ring are formed on the active side of the first wafer. The former connects with one of the through silicon vias, the later surrounds the MEMS element and connects with the other of the through silicon vias. The step of forming a second bonding ring and a second electrical interconnect is then performed. And then, a voltage will be applied to the through silicon vias through the back side of the first wafer.
摘要翻译：本发明公开了一种用于封装第一晶片和第二晶片的晶片级封装方法和封装结构。第一晶片具有背面和有源侧，此外，第一晶片的有源侧具有MEMS元件。首先进行形成两个通过硅通孔的步骤。第一电互连和第一接合环形成在第一晶片的有源侧上。前者与通孔硅通孔之一连接，后面围绕着MEMS元件，并与另一个穿通硅通孔连接。然后执行形成第二接合环和第二电互连的步骤。然后，将通过第一晶片的背面对通孔硅通孔施加电压。

9. 发明授权

US08381589B2 Single-axis-control-input gyroscope system having imperfection compensation 有权
标题翻译：具有不完美补偿的单轴控制输入陀螺仪系统
公开(公告)号：US08381589B2
公开(公告)日：2013-02-26
申请号：US12801728
申请日：2010-06-23
申请人： Tsung-Lin Chen , Chien-Yu Chi , Chia-Wei Lee
发明人： Tsung-Lin Chen , Chien-Yu Chi , Chia-Wei Lee
IPC分类号： G01C19/56
CPC分类号： G01C19/5726
摘要： The present invention proposes a single-axis-control-input gyroscope system having imperfection compensation, which comprises a gyroscope and a state observer. The gyroscope includes a mechanical structure, and the dynamic behavior of the mechanical structure is described with a plurality of system parameters and a plurality of dynamic equations. The system parameters include a mass of the gyroscope, two main-axis spring constants, a cross-axis spring constant, two main-axis damping coefficients, a cross-axis damping coefficient and an angular velocity. The mechanical imperfections cause the system parameters to deviate from the designed values and become unknown values. The gyroscope receives a single-axis control signal and outputs a plurality of gyroscopic system dynamics. The single-axis control signal includes at least two frequency signals. The state observer is coupled to the gyroscope to receive the gyroscopic system dynamics as the inputs thereof to feed back compensations to the state observer. Thereby is estimated an angular velocity.
摘要翻译：本发明提出了具有不完美补偿的单轴控制输入陀螺仪系统，其包括陀螺仪和状态观察器。陀螺仪包括机械结构，并用多个系统参数和多个动力学方程来描述机械结构的动态特性。系统参数包括陀螺仪的质量，两个主轴弹簧常数，横轴弹簧常数，两个主轴阻尼系数，横轴阻尼系数和角速度。机械缺陷导致系统参数偏离设计值，成为未知值。陀螺仪接收单轴控制信号并输出多个陀螺系统动力学。单轴控制信号包括至少两个频率信号。状态观测器耦合到陀螺仪以接收作为其输入的陀螺仪系统动力学以将补偿反馈给状态观测器。从而估计角速度。

10. 发明授权

US08371165B2 MEMS gyroscope 有权
标题翻译： MEMS陀螺仪
公开(公告)号：US08371165B2
公开(公告)日：2013-02-12
申请号：US12845370
申请日：2010-07-28
申请人： Tsung-Lin Chen , Chien-Yu Chi , Chia-Wei Lee
发明人： Tsung-Lin Chen , Chien-Yu Chi , Chia-Wei Lee
IPC分类号： C01C19/56
CPC分类号： G01C19/5726
摘要： An MEMS gyroscope is disclosed, capable of computing the rotating angle of a DUT being attached thereto without the need to execute an off-line calibration process, of precluding the execution of an integration process, and of executing an on-line compensation process for the error introduced by the sensing circuit defect and by the mechanical structure defect of its gyroscope module. The disclosed MEMS gyroscope comprises: a gyroscope module, a sensing module coupled with the gyroscope module, and a control module couple with the gyroscope module and the sensing module, respectively. The control module receives the system dynamic of the gyroscope module sensed by the sensing module, and applies a gyroscope control method for controlling the gyroscope module and computing the rotating angle of the DUT. Moreover, the control module outputs a control signal including two extra frequency signals, to the gyroscope module, for driving the gyroscope module into operation.
摘要翻译：公开了一种MEMS陀螺仪，其能够计算附接到其上的DUT的旋转角度，而不需要执行离线校准过程，排除执行积分过程，并且执行在线补偿处理感测电路缺陷引起的误差及其陀螺仪模块的机械结构缺陷。所公开的MEMS陀螺仪包括：陀螺仪模块，与陀螺仪模块耦合的感测模块，以及分别与陀螺仪模块和感测模块耦合的控制模块。控制模块接收由感测模块感测到的陀螺仪模块的系统动态，并应用陀螺仪控制方法控制陀螺仪模块并计算DUT的旋转角度。此外，控制模块将包括两个额外频率信号的控制信号输出到陀螺仪模块，用于驱动陀螺仪模块操作。

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