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1. 发明授权

US06313541B1 Bone-pad with pad edge strengthening structure 失效
标题翻译：骨垫与垫边缘加强结构
公开(公告)号：US06313541B1
公开(公告)日：2001-11-06
申请号：US09327876
申请日：1999-06-08
申请人： Chin-Jong Chan , Shi-Tron Lin
发明人： Chin-Jong Chan , Shi-Tron Lin
IPC分类号： H01L2348
CPC分类号： H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05557 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/47 , H01L2224/48 , H01L2224/48455 , H01L2224/4847 , H01L2224/48599 , H01L2224/48699 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/351 , H05K1/111 , H05K3/328 , H01L2924/00
摘要： A bond pad structure for use in wire bonding applications during the packaging of semiconductor devices with reduced bond pad lift-off problem. The bond pad structure contains: (a) a metal bond pad formed in an open window area surrounded by an edge portion of a dielectric layer; and (b) at least one dendritic sub-structure formed in the edge portion of the dielectric layer. The at least one dendritic sub-structure is formed of a metal material and is in contact with the metal bond pad. The dendritic sub-structure is a generally cross-shaped structure containing a first segment which is generally perpendicular to an edge of the metal bond pad to which the dendritic sub-structure is connected, and a second segment with is generally parallel to the edge. The dendritic sub-structure serves two main purposes. First, it creates an augmented contact area, and thus enhanced adhesive force, for the bond pad due to the newly created vertically extending contact surface between the metal bond pad layer and the dielectric layer in the dendritic sub-structure. Second, the dendritic sub-structure creates a discontinuity in the edge portion of the dielectric layer which can effectively intercept and thus stop the growth of cracks after they are formed. Unlike augmented bond pads of prior art, the bond pad structure does not contain anchor structures underneach the bond pad where wire bonding is to be made.
摘要翻译：用于半导体器件封装期间的引线键合应用中的接合焊盘结构，其具有减小的焊盘剥离问题。接合焊盘结构包括：（a）形成在由电介质层的边缘部分包围的开放窗口区域中的金属接合焊盘; 和（b）形成在电介质层的边缘部分中的至少一个树枝状亚结构。所述至少一个树枝状亚结构由金属材料形成并与所述金属接合垫接触。树枝状亚结构是大致十字形的结构，其包含第一段，该第一段通常垂直于连接树枝状子结构的金属接合焊盘的边缘，以及大体上平行于边缘的第二段。树枝状亚结构有两个主要目的。首先，由于在树枝状亚结构中的金属接合焊盘层和电介质层之间新建的垂直延伸的接触表面，其产生了增强的接触面积，并且因此增强了接合焊盘的粘合力。第二，树突状亚结构在电介质层的边缘部分产生不连续性，其可以有效地截断并因此在其形成之后停止裂纹的生长。与现有技术的增强接合焊盘不同，接合焊盘结构不包含在焊接垫下面的锚结构，其中将进行引线接合。

2. 发明授权

US06181016B2 Bond-pad with a single anchoring structure 失效
标题翻译：具有单一锚固结构的粘合垫
公开(公告)号：US06181016B2
公开(公告)日：2001-01-30
申请号：US09327877
申请日：1999-06-08
申请人： Shi-Tron Lin , Chin-Jong Chan
发明人： Shi-Tron Lin , Chin-Jong Chan
IPC分类号： H01L2348
CPC分类号： H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05009 , H01L2224/05093 , H01L2224/05095 , H01L2224/05556 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： A bond pad structure for use in wire bonding applications during the packaging of semiconductor devices with reduced bond pad lift-off problem. It includes: (a) a laminated structure containing a metal bond pad layer, a dielectric layer, and an underlying layer formed on a wafer surface; and (b) a single anchoring structure formed in said dielectric layer connecting said metal bond pad layer and said underlying layer. The single anchoring structure contains a plurality of line segments that are interconnected so as to form said single anchoring structure. Unlike prior art anchoring structures, which always contain a plurality of anchors buried inside the dielectric, the bond pad structure contains only a single anchoring structure, which can have the geometry of an open or closed ring with whiskers, a coil, an open or closed square-waved ring, a tree structure, a grid-line structure, a meandering structure, a serpentine structure, a spiral structure, or a labyrinth. Furthermore, an array of dendritic sub-structures can be provided extending from an outer edge of the anchoring structure to further improve stability.
摘要翻译：用于半导体器件封装期间的引线键合应用中的接合焊盘结构，其具有减小的焊盘剥离问题。它包括：（a）包含形成在晶片表面上的金属焊盘层，电介质层和下层的叠层结构; 和（b）形成在连接所述金属接合焊盘层和所述下层的所述电介质层中的单个锚定结构。单个锚定结构包含互连以形成所述单个锚定结构的多个线段。不同于现有技术的锚固结构，其总是包含埋在电介质内部的多个锚固件，接合焊盘结构仅包含单个锚定结构，其可以具有带有晶须，线圈，开放或闭合的开放或闭合环的几何形状方波形环，树结构，网格结构，曲折结构，蛇形结构，螺旋结构或迷宫。此外，可以提供从锚定结构的外边缘延伸的树枝状亚结构的阵列，以进一步提高稳定性。

3. 发明授权

US06551916B2 Bond-pad with pad edge strengthening structure 失效
标题翻译：焊垫与焊垫边缘加强结构
公开(公告)号：US06551916B2
公开(公告)日：2003-04-22
申请号：US09327875
申请日：1999-06-08
申请人： Shi-Tron Lin , Chin-Jong Chan
发明人： Shi-Tron Lin , Chin-Jong Chan
IPC分类号： H01L2144
CPC分类号： H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05009 , H01L2224/05093 , H01L2224/05552 , H01L2224/05554 , H01L2224/05556 , H01L2224/05558 , H01L2224/05567 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48463 , H01L2224/4847 , H01L2224/48599 , H01L2224/48699 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00
摘要： A bond pad structure for use in wire bonding application during the packaging operation of semiconductor devices which contains a bond frame structure for holding the bond pad in place to prevent bond pad peel-off problem. The bond pad structure is a laminated structure containing a metal bond pad layer, a middle dielectric layer, and an underlying layer formed above a wafer surface. A guard band structure is formed in a spaced apart relationship from the metal bond pad layer which is connected to the underlying layer by a hole-fill. The underlying layer can be a metal layer, a semiconductor layer such as a polysilicon layer, or any material layer which has good adhesion with the hole fill material. The guard band structure exerts a downward force against the middle dielectric layer to help keeping the middle dielectric layer in place. The guard band structure also creates a localized discontinuity in the middle dielectric layer to intercept cracks that may be formed in the middle layer around the edge of the metal bond pad which is believed a main cause of bond pad peel-off problem.
摘要翻译：一种用于在半导体器件的封装操作期间的引线接合应用中的接合焊盘结构，其包含用于将接合焊盘保持在适当位置以防止接合焊盘剥离问题的接合框架结构。接合焊盘结构是包含形成在晶片表面上方的金属焊盘层，中间介电层和下层的层压结构。保护带结构形成为与通过孔填充连接到下层的金属接合焊盘层间隔开的关系。下层可以是金属层，诸如多晶硅层的半导体层，或与填充孔材料具有良好粘附性的任何材料层。保护带结构向中间介电层施加向下的力，以帮助将中间介质层保持在适当位置。保护带结构还在中间介电层中产生局部不连续性，以拦截可能形成在金属接合焊盘边缘周围的中间层中的裂纹，这被认为是焊盘剥离问题的主要原因。

4. 发明授权

US07012307B2 Output buffer with good ESD protection 失效
标题翻译：输出缓冲器具有良好的ESD保护
公开(公告)号：US07012307B2
公开(公告)日：2006-03-14
申请号：US09779096
申请日：2001-02-08
申请人： Shi-Tron Lin , Wei-Fan Chen
发明人： Shi-Tron Lin , Wei-Fan Chen
IPC分类号： H01L23/62
CPC分类号： H01L27/0251
摘要： An output buffer with a pull down circuit. The pull down circuit is coupled between a second power line and a pad, and has a resistor, a diode and an electrostatic discharge protection component. The resistor deposited on the substrate of a first conductivity type includes a well region of a second conductivity type. The resistor and the electrostatic discharge protection component are connected in series between the pad and the second power line. The diode is formed in the well region, construct by the PN junction formed between a first doped region of the first conductivity type and the well region. The first doped region is electrically floated in the well regions. During an electrostatic discharge event, the pad is instantaneously connected to the first doped region which will help to boost the turn-on of the electrostatic discharge circuit, and further enhance the electrostatic protection effect.
摘要翻译：具有下拉电路的输出缓冲器。下拉电路耦合在第二电源线和焊盘之间，并且具有电阻器，二极管和静电放电保护部件。沉积在第一导电类型的衬底上的电阻器包括第二导电类型的阱区域。电阻器和静电放电保护元件串联在焊盘和第二电源线之间。二极管形成在阱区中，由在第一导电类型的第一掺杂区和阱区之间形成的PN结构成。第一掺杂区域电浮在阱区中。在静电放电事件期间，焊盘瞬时连接到第一掺杂区域，这有助于提高静电放电电路的接通，并进一步增强静电保护效果。

5. 发明授权

US07009252B2 ESD protection devices and methods for reducing trigger voltage 失效
公开(公告)号：US07009252B2
公开(公告)日：2006-03-07
申请号：US10353372
申请日：2003-01-28
申请人： Shi-Tron Lin , Wei-Fan Chen , Chenhsin Lien
发明人： Shi-Tron Lin , Wei-Fan Chen , Chenhsin Lien
IPC分类号： H01L26/62
CPC分类号： H01L27/027 , H01L27/0203
摘要： ESD protection devices and methods to form them are provided in this invention. By employing the thin gate oxide fabricated by a dual gate oxide process, ESD protection devices with a lower trigger voltage are provided. The NMOS for ESD protection according to the present invention has islands with thin gate oxides and a control gate with a thick gate oxide. These islands overlap the drain region of the NMOS to reduce the breakdown voltage of the PN junction in the drain region, thereby reducing the ESD trigger voltage and improving the ESD protection level of the NMOS. Furthermore, the invention is applicable to general integrated-circuit processes as well as various ESD protection devices.

6. 发明授权

US06919602B2 Gate-coupled MOSFET ESD protection circuit 失效
标题翻译：栅极耦合MOSFET ESD保护电路
公开(公告)号：US06919602B2
公开(公告)日：2005-07-19
申请号：US10320201
申请日：2002-12-16
申请人： Shi-Tron Lin , Wei-Fan Chen
发明人： Shi-Tron Lin , Wei-Fan Chen
IPC分类号： H01L23/62 , H01L27/02 , H01L29/74 , H02H9/00
CPC分类号： H01L27/0266 , H01L2924/0002 , H01L2924/00
摘要： A gate-coupled MOSFET ESD protection circuit. The circuit has a gate-node potential controlled by an inverter and a timing control circuit. Unlike current-shunting ESD clamping devices that turn the MOSFET fully on during an ESD event, a pull-down element is included to form a voltage divider like circuit, such that the gate-node potential is limited to around 1 to 2 volts during a positive ESD transient event. Unlike GCNMOS (Gate-Coupled NMOS), the invention has better control of the transient gate potential for more effective triggering of the NMOS into snapback during an ESD event.
摘要翻译：门极耦合MOSFET ESD保护电路。电路具有由逆变器和定时控制电路控制的栅极节点电位。不同于在ESD事件期间使MOSFET完全导通的电流调节ESD钳位装置，包括下拉元件以形成分压器电路，使得栅极节点电位在一正静电瞬态事件。与GCNMOS（栅极耦合NMOS）不同，本发明可以更好地控制瞬态栅极电位，从而在ESD事件期间更有效地触发NMOS进入快速恢复。

7. 发明授权

US06849902B1 Input/output cell with robust electrostatic discharge protection 有权
标题翻译：具有强大静电放电保护功能的输入/输出单元
公开(公告)号：US06849902B1
公开(公告)日：2005-02-01
申请号：US10796966
申请日：2004-03-11
申请人： Shi-Tron Lin
发明人： Shi-Tron Lin
IPC分类号： H01L23/60 , H01L23/62 , H01L27/02
CPC分类号： H01L27/0266 , H01L2924/0002 , H01L2924/00
摘要： An electrostatic discharge (ESD) protection device with enhanced ESD robustness. The ESD protection device comprises a pad, a finger-type MOS, a well stripe and a doped segment. The pad is on a semiconductor substrate of a first-conductive type. The finger-type MOS is on the semiconductor substrate and comprises drain regions, source regions and channel regions. Each drain region is of a second-conductive type and is coupled to the pad. Each source region is of the second-conductive type and coupled to a power rail. Channel regions are formed on the semiconductor, substantially parallel to each other. Each channel region is located between one source region and one drain region. The well stripe is of the second-conductive type and formed on the semiconductor, in an angle to the channel regions. The doped segment is of the first-conductive type and in the well stripe. Furthermore, the doped segment is coupled to the pad.
摘要翻译：具有增强ESD稳健性的静电放电（ESD）保护装置。 ESD保护器件包括焊盘，指状MOS，阱条和掺杂段。焊盘位于第一导电类型的半导体衬底上。指状MOS位于半导体衬底上并且包括漏区，源极区和沟道区。每个漏极区域是第二导电类型并且耦合到该焊盘。每个源极区域是第二导电类型并且耦合到电力轨道。通道区域形成在半导体上，基本上彼此平行。每个沟道区域位于一个源极区域和一个漏极区域之间。阱条是第二导电类型并且形成在半导体上，与沟道区成一定角度。掺杂区段是第一导电类型并且在阱条中。此外，掺杂段耦合到焊盘。

8. 发明授权

US06730967B2 Electrostatic discharge protection devices and methods for the formation thereof 失效
标题翻译：静电放电保护装置及其形成方法
公开(公告)号：US06730967B2
公开(公告)日：2004-05-04
申请号：US09863977
申请日：2001-05-24
申请人： Shi-Tron Lin
发明人： Shi-Tron Lin
IPC分类号： H01L2362
CPC分类号： H01L29/0847 , H01L27/0266
摘要： The present invention provides an ESD protection device with isolated islands and an n well. At least one of the isolated islands has an end apart from the boundary of a drain diffusion region of the ESD protection device, to form a gap between. The n well overlaps with the isolated islands and is kept at least a designated distance away from a channel region of the ESD protection device. An interlocked structure of isolated islands is also provided in this invention to direct ESD current flowing forward and backward to the channel region of the ESD protection device, thereby increasing the distributed resistance of the drain diffusion region. Several benefits, such as lower drain capacitance, lower standby power consumption and a wider range of adjustable resistance, are achieved.
摘要翻译：本发明提供一种具有隔离岛和n阱的ESD保护装置。隔离岛中的至少一个具有远离ESD保护装置的漏极扩散区域的边界的一端，以在其间形成间隙。 n阱与隔离的岛重叠，并且保持至少距离ESD保护装置的沟道区的指定距离。本发明还提供隔离岛的互锁结构，以将ESD电流引导到ESD保护器件的沟道区域的前后方向，从而增加漏极扩散区域的分布电阻。实现了诸如漏极电容降低，待机功耗降低和可调电阻范围更广的好处。

9. 发明授权

US06573568B2 ESD protection devices and methods for reducing trigger voltage 失效
公开(公告)号：US06573568B2
公开(公告)日：2003-06-03
申请号：US09871999
申请日：2001-06-01
申请人： Shi-Tron Lin , Wei-Fan Chen , Chenhsin Lien
发明人： Shi-Tron Lin , Wei-Fan Chen , Chenhsin Lien
IPC分类号： H01L2976
CPC分类号： H01L27/027 , H01L27/0203
摘要： ESD protection devices and methods to form them are provided in this invention. By employing the thin gate oxide fabricated by a dual gate oxide process, ESD protection devices with a lower trigger voltage are provided. The NMOS for ESD protection according to the present invention has islands with thin gate oxides and a control gate with a thick gate oxide. These islands overlap the drain region of the NMOS to reduce the breakdown voltage of the PN junction in the drain region, thereby reducing the ESD trigger voltage and improving the ESD protection level of the NMOS. Furthermore, the invention is applicable to general integrated-circuit processes as well as various ESD protection devices.

10. 发明授权

US06473282B1 Latch-up protection circuit for integrated circuits biased with multiple power supplies and its method 失效
标题翻译：用于多电源偏置的集成电路的锁存保护电路及其方法
公开(公告)号：US06473282B1
公开(公告)日：2002-10-29
申请号：US09547186
申请日：2000-04-11
申请人： Shi-Tron Lin , Ta-Lee Yu , Yung-Chow Peng
发明人： Shi-Tron Lin , Ta-Lee Yu , Yung-Chow Peng
IPC分类号： H02H320
CPC分类号： H01L27/0251
摘要： A latch-up protection circuit for an integrated circuit powered through a first power rail and a second power rail is disclosed, the integrated circuit having at least one semiconductor bulk of a conductivity type. The latch-up protection circuit comprises a control circuit and a switch circuit. The control circuit is connected to the first power rail and the second power rail for detecting a relative voltage therebetween and generating a first control signal and a second control signal. The switch circuit connected to the first power rail and the control circuit. When the relative voltage is greater than a first predetermined value, the switch circuit in response to the first control signal electrically connects the first power rail with the at least one semiconductor bulk. When the relative voltage is smaller than the first predetermined value, the switch in response to the first control signal electrically disconnects the first power rail from the at least one semiconductor bulk.
摘要翻译：公开了一种用于通过第一电力轨道和第二电力轨道供电的集成电路的闩锁保护电路，该集成电路具有至少一个导电类型的半导体本体。闩锁保护电路包括控制电路和开关电路。控制电路连接到第一电源轨和第二电源轨，用于检测它们之间的相对电压，并产生第一控制信号和第二控制信号。开关电路连接到第一电源轨和控制电路。当相对电压大于第一预定值时，响应于第一控制信号的开关电路将第一电源轨与至少一个半导体块电连接。当相对电压小于第一预定值时，响应于第一控制信号的开关将第一电力轨与至少一个半导体块电气断开。

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