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    • 1. 发明授权
    • Method for integrating image sensors with optical components
    • 图像传感器与光学元件集成的方法
    • US06679964B2
    • 2004-01-20
    • US09981774
    • 2001-10-16
    • Chih-Kung LeeLong-Sun HuangWen-Jong ChenChing-Heng TangChing-Hua Lee
    • Chih-Kung LeeLong-Sun HuangWen-Jong ChenChing-Heng TangChing-Hua Lee
    • H01L2146
    • H01L27/14685H01L27/14618H01L27/14621H01L27/14627H01L2224/48091Y10T156/1093H01L2924/00014
    • The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process. Alternatively, the composite substrate and the un-sliced wafer can be bonded together by cold compression or thermal compression. The resultant wafer is then sliced into separated image sensors for further packaging, such as CLCC, PLCC, QFP, QFN or QFJ. Alternatively, the resultant wafer can be packaged through a wafer-level chip scale packaging process.
    • 本发明是一种用于将包括图像传感器的未切片晶片和其上包括光学部件的晶片尺寸基板接合的晶片级积分方法。 在未切片的晶片和晶片尺寸的基板之间设置零级光反射基板。 图像传感器是CMOS或CCD图像传感器。 晶片尺寸的基板是透明板,并且其上的光学部件包括闪耀的光栅,二维微透镜阵列或其它光学功能元件。 晶片尺寸的基板通过合适的光学粘合剂粘合到第零级光反射基板上以形成复合基板。 在非切片晶片和复合基板的接合面上的对应位置分别设置有接合焊盘和凸块,使得复合基板和未切片的晶片可以通过回流工艺结合在一起。 或者,可以通过冷压缩或热压缩将复合衬底和未切片晶片结合在一起。 然后将得到的晶片切成分离的图像传感器以进一步包装,例如CLCC,PLCC,QFP,QFN或QFJ。 或者,所得到的晶片可以通过晶片级芯片级封装工艺进行封装。