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    • 1. 发明授权
    • Different-voltage device manufactured by a CMOS compatible process and high-voltage device used in the different-voltage device
    • 由CMOS兼容工艺制造的不同电压器件和用于不同电压器件的高压器件
    • US07858466B2
    • 2010-12-28
    • US11682621
    • 2007-03-06
    • Chih-Feng HuangTa-yung YangJenn-yu G. LinTuo-Hsin Chien
    • Chih-Feng HuangTa-yung YangJenn-yu G. LinTuo-Hsin Chien
    • H01L21/8238
    • H01L21/823814H01L21/823857H01L21/823892
    • A method of manufacturing different-voltage devices mainly comprises forming at least one high-voltage well in high-voltage device regions, at least one N-well in low-voltage device regions, at least one P-well in low-voltage device regions, source/drain wells in high-voltage device regions, and isolation wells in isolation regions in a p-type substrate. The breakdown voltage is adjusted by modulating the ion doping profile. Furthermore, parameters of implanting conductive ions are adjusted for implanting conductive ions into both high-voltage device regions and low-voltage device regions. The isolation wells formed in isolation regions between devices are for separating device formed over high-voltage device regions and device formed over low-voltage device regions. The thickness of a HV gate oxide layer is thicker than the thickness of an LV gate oxide layer for modulating threshold voltages of high-voltage devices and low-voltage devices.
    • 一种制造不同电压装置的方法主要包括在高电压装置区域中形成至少一个高电压阱,在低电压装置区域中形成至少一个N阱,在低电压装置区域中形成至少一个P阱 ,高压器件区域中的源/漏极阱以及p型衬底中的隔离区中的隔离阱。 通过调制离子掺杂分布来调整击穿电压。 此外,调整注入导电离子的参数,以将导电离子注入到高电压器件区域和低电压器件区域中。 在器件之间的隔离区域中形成的隔离阱用于在高电压器件区域上形成的分离器件和在低电压器件区域上形成的器件。 HV栅极氧化物层的厚度比用于调制高电压器件和低电压器件的阈值电压的LV栅极氧化物层的厚度厚。
    • 4. 发明授权
    • Electrostatic discharge protection semiconductor structure
    • 静电放电保护半导体结构
    • US07615826B2
    • 2009-11-10
    • US11427773
    • 2006-06-29
    • Chih-Feng HuangTuo-Hsin ChienJenn-Yu G. LinTa-yung Yang
    • Chih-Feng HuangTuo-Hsin ChienJenn-Yu G. LinTa-yung Yang
    • H01L23/62
    • H01L27/0259
    • An electrostatic discharge (ESD) protection device with adjustable single-trigger or multi-trigger voltage is provided. The semiconductor structure has multi-stage protection semiconductor circuit function and adjustable discharge capacity. The single-trigger or multi-trigger semiconductor structure may be fabricated by using the conventional semiconductor process, and can be applied to IC semiconductor design and to effectively protect the important semiconductor devices and to prevent the semiconductor devices from ESD damage. In particular, the present invention can meet the requirements of high power semiconductor device and has better protection function compared to conventional ESD protection circuit. In the present invention, a plurality of N-wells or P-wells connected in parallel are used to adjust the discharge capacity of various wells in the P-substrate so as to improve the ESD protection capability and meet different power standards.
    • 提供具有可调单触发或多触发电压的静电放电(ESD)保护装置。 半导体结构具有多级保护半导体电路功能和可调放电容量。 单触发或多触发半导体结构可以通过使用传统的半导体工艺制造,并且可以应用于IC半导体设计并且有效地保护重要的半导体器件并且防止半导体器件受到ESD损坏。 特别地,本发明可以满足大功率半导体器件的要求,与传统的ESD保护电路相比具有更好的保护功能。 在本发明中,使用并联连接的多个N阱或P阱来调整P基板中的各个阱的放电容量,以提高ESD保护能力并满足不同的功率标准。
    • 5. 发明授权
    • CMOS compatible process with different-voltage devices
    • CMOS兼容过程与不同电压器件
    • US07205201B2
    • 2007-04-17
    • US10914943
    • 2004-08-09
    • Chih-Feng HuangTa-yung YangJenn-yu G. LinTuo-Hsin Chien
    • Chih-Feng HuangTa-yung YangJenn-yu G. LinTuo-Hsin Chien
    • H01L21/8234
    • H01L21/823814H01L21/823857H01L21/823892
    • A method of manufacturing different-voltage devices mainly comprises forming at least one high-voltage well in high-voltage device regions, at least one N-well in low-voltage device regions, at least one P-well in low-voltage device regions, source/drain wells in high-voltage device regions, and isolation wells in isolation regions in a p-type substrate. The breakdown voltage is adjusted by modulating the ion doping profile. Furthermore, parameters of implanting conductive ions are adjusted for implanting conductive ions into both high-voltage device regions and low-voltage device regions. The isolation wells formed in isolation regions between devices are for separating device formed over high-voltage device regions and device formed over low-voltage device regions. The thickness of a HV gate oxide layer is thicker than the thickness of an LV gate oxide layer for modulating threshold voltages of high-voltage devices and low-voltage devices.
    • 一种制造不同电压装置的方法主要包括在高电压装置区域中形成至少一个高电压阱,在低电压装置区域中形成至少一个N阱,在低电压装置区域中形成至少一个P阱 ,高压器件区域中的源/漏极阱以及p型衬底中的隔离区中的隔离阱。 通过调制离子掺杂分布来调整击穿电压。 此外,调整注入导电离子的参数,以将导电离子注入到高电压器件区域和低电压器件区域中。 在器件之间的隔离区域中形成的隔离阱用于在高电压器件区域上形成的分离器件和在低电压器件区域上形成的器件。 HV栅极氧化物层的厚度比用于调制高电压器件和低电压器件的阈值电压的LV栅极氧化物层的厚度厚。