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    • 1. 发明申请
    • Heat dissipating system
    • 散热系统
    • US20070064394A1
    • 2007-03-22
    • US11392329
    • 2006-03-28
    • Chien-Jung ChenTe-Tsung ChenChih-Tsung Hsu
    • Chien-Jung ChenTe-Tsung ChenChih-Tsung Hsu
    • H05K7/20
    • H01L23/473H01L2924/0002H01L2924/00
    • A heat dissipating system adapted for cooling an electronic device includes: a heat sink adapted to be connected to the electronic device; a driving mechanism; a cooling mechanism; a coolant circulating conduit adapted for receiving a coolant therein, and connected to the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit through the heat sink and the cooling mechanism; and a pressure sensing mechanism including a pressure sensing unit connected to the coolant circulating conduit for measuring the pressure inside the coolant circulating conduit, and an alarm coupled to the pressure sensing unit and activated by the pressure sensing unit when the pressure measured by the pressure sensing unit is below a predetermined value.
    • 适于冷却电子设备的散热系统包括:适于连接到电子设备的散热器; 驱动机制; 冷却机构; 冷却剂循环管道,其适于在其中容纳冷却剂,并且连接到冷却机构,散热器和驱动机构,使得驱动机构驱动冷却剂循环管道中的冷却剂通过散热器和冷却机构的循环; 压力检测机构包括连接到冷却剂循环管道的压力检测单元,用于测量冷却剂循环管道内部的压力,以及联合到压力检测单元并由压力感测单元激活的报警器,当压力检测 单位低于预定值。
    • 3. 发明申请
    • Heat dissipating system
    • 散热系统
    • US20070064393A1
    • 2007-03-22
    • US11392104
    • 2006-03-28
    • Chien-Jung ChenTe-Tsung ChenChih-Tsung Hsu
    • Chien-Jung ChenTe-Tsung ChenChih-Tsung Hsu
    • H05K7/20
    • H01L23/473H01L2924/0002H01L2924/00
    • A heat dissipating system for cooling an electronic device includes: a heat sink adapted to be connected to the electronic device for absorbing heat from the electronic device; a cooling fluid containing a coolant and a particulate material dispersed in the coolant; a driving mechanism; a cooling mechanism; and a coolant circulating conduit. The coolant circulating conduit receives the cooling fluid therein, and is connected to the heat sink and the driving mechanism. The driving mechanism drives circulation of the cooling fluid in the coolant circulating conduit through the heat sink. The coolant circulating conduit is further coupled to the cooling mechanism so as to transfer heat from the heat sink to the cooling mechanism through the cooling fluid.
    • 一种用于冷却电子设备的散热系统包括:适于连接到电子设备以从电子设备吸收热量的散热器; 包含分散在冷却剂中的冷却剂和颗粒材料的冷却流体; 驱动机制; 冷却机构; 和冷却剂循环管道。 冷却剂循环管道在其中接收冷却流体,并连接到散热器和驱动机构。 驱动机构驱动冷却剂循环管道中的冷却流体通过散热器的循环。 冷却剂循环管道还联接到冷却机构,以便通过冷却流体将热量从散热器传递到冷却机构。
    • 4. 发明申请
    • Heat dissipating system
    • 散热系统
    • US20070062675A1
    • 2007-03-22
    • US11392355
    • 2006-03-28
    • Chien-Jung ChenTe-Tsung ChenChih-Tsung Hsu
    • Chien-Jung ChenTe-Tsung ChenChih-Tsung Hsu
    • F28D15/00
    • H01L23/473H01L2924/0002H01L2924/00
    • A heat dissipating system includes: a heat sink adapted to be connected to an electronic device; a coolant reservoir adapted for storing a coolant therein; a driving mechanism; a cooling mechanism; a coolant circulating conduit connected to the coolant reservoir, the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit; and a pressure stabilizing mechanism including a bypass connected to the coolant reservoir and the coolant circulating conduit at a position downstream of the driving mechanism, and a valve. The valve is opened when the pressure inside the coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass.
    • 散热系统包括:适于连接到电子设备的散热器; 适于在其中存储冷却剂的冷却剂储存器; 驱动机制; 冷却机构; 连接到冷却剂储存器,冷却机构,散热器和驱动机构的冷却剂循环管道,使得驱动机构驱动冷却剂循环管道中的冷却剂的循环; 以及压力稳定机构,其包括在所述驱动机构的下游位置处连接到所述冷却剂储存器和所述冷却剂循环管道的旁路以及阀。 当冷却剂循环管道内的压力超过预定值时,阀门打开,从而允许冷却剂储存器和冷却剂循环管道之间通过旁路的流体连通。