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    • 6. 发明授权
    • Printed circuit board
    • 印刷电路板
    • US08270180B2
    • 2012-09-18
    • US12646888
    • 2009-12-23
    • Chien-Hung LiuShou-Kuo HsuYu-Chang PaiPo-Chuan Hsieh
    • Chien-Hung LiuShou-Kuo HsuYu-Chang PaiPo-Chuan Hsieh
    • H05K1/11H05K7/00H05K1/14
    • H05K1/0251H05K1/0222H05K3/429H05K2201/09309H05K2201/09636
    • A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.
    • 印刷电路板包括多个信号层,多个接地层,第一传输线,第二传输线,第一通孔和第二通孔。 第一个传输位于多个信号层之一上。 第二传输线位于多个信号层的另一个上。 第一和第二通孔穿过印刷电路板。 第一通孔电耦合到第一和第二传输线,并且与接地层的数量隔离。 第二通孔电耦合到多个接地层中的一个或多个,并与多个接地层中的另一个隔离,以增加电感,从而补偿开路短路的电容特性并提高信号完整性。