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    • 1. 发明授权
    • Non-volatile memory and manufacturing method thereof
    • 非易失性存储器及其制造方法
    • US08471328B2
    • 2013-06-25
    • US12843093
    • 2010-07-26
    • Chien-Hung ChenTzu-Ping ChenYu-Jen Chang
    • Chien-Hung ChenTzu-Ping ChenYu-Jen Chang
    • H01L29/82
    • H01L29/792H01L21/28282H01L27/11573H01L29/4234H01L29/66833
    • A manufacturing method of a non-volatile memory is disclosed. A gate structure is formed on a substrate and includes a gate dielectric layer and a gate conductive layer. The gate dielectric layer is partly removed, thereby a symmetrical opening is formed among the gate conductive layer, the substrate and the gate dielectric layer, and a cavity is formed on end sides of the gate dielectric layer. A first oxide layer is formed on a sidewall and bottom of the gate conductive layer, and a second oxide layer is formed on a surface of the substrate. A nitride material layer is formed covering the gate structure, the first and second oxide layer and the substrate and filling the opening. An etching process is performed to partly remove the nitride material layer, thereby a nitride layer is formed on a sidewall of the gate conductive layer and extending into the opening.
    • 公开了一种非易失性存储器的制造方法。 栅极结构形成在衬底上,并且包括栅极介电层和栅极导电层。 部分地去除栅介质层,从而在栅极导电层,基板和栅极电介质层之间形成对称的开口,并且在栅极电介质层的端侧形成空腔。 在栅极导电层的侧壁和底部上形成第一氧化物层,并且在衬底的表面上形成第二氧化物层。 形成覆盖栅极结构,第一和第二氧化物层和衬底并填充开口的氮化物材料层。 执行蚀刻处理以部分地去除氮化物材料层,由此在栅极导电层的侧壁上形成并延伸到开口中的氮化物层。
    • 2. 发明申请
    • NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF
    • 非易失性存储器及其制造方法
    • US20120018795A1
    • 2012-01-26
    • US12843093
    • 2010-07-26
    • Chien-Hung CHENTzu-Ping ChenYu-Jen Chang
    • Chien-Hung CHENTzu-Ping ChenYu-Jen Chang
    • H01L29/792H01L21/336
    • H01L29/792H01L21/28282H01L27/11573H01L29/4234H01L29/66833
    • A manufacturing method of a non-volatile memory is disclosed. A gate structure is formed on a substrate and includes a gate dielectric layer and a gate conductive layer. The gate dielectric layer is partly removed, thereby a symmetrical opening is formed among the gate conductive layer, the substrate and the gate dielectric layer, and a cavity is formed on end sides of the gate dielectric layer. A first oxide layer is formed on a sidewall and bottom of the gate conductive layer, and a second oxide layer is formed on a surface of the substrate. A nitride material layer is formed covering the gate structure, the first and second oxide layer and the substrate and filling the opening. An etching process is performed to partly remove the nitride material layer, thereby a nitride layer is formed on a sidewall of the gate conductive layer and extending into the opening.
    • 公开了一种非易失性存储器的制造方法。 栅极结构形成在衬底上,并且包括栅极介电层和栅极导电层。 部分地去除栅介质层,从而在栅极导电层,基板和栅极电介质层之间形成对称的开口,并且在栅极电介质层的端侧形成空腔。 在栅极导电层的侧壁和底部上形成第一氧化物层,并且在衬底的表面上形成第二氧化物层。 形成覆盖栅极结构,第一和第二氧化物层和衬底并填充开口的氮化物材料层。 执行蚀刻处理以部分地去除氮化物材料层,由此在栅极导电层的侧壁上形成并延伸到开口中的氮化物层。