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    • 3. 发明授权
    • Color filter substrate
    • 彩色滤光片基板
    • US07811725B2
    • 2010-10-12
    • US11707916
    • 2007-02-20
    • Chien-Chung ChenChin-Pei Hwang
    • Chien-Chung ChenChin-Pei Hwang
    • G02B5/20
    • G02B5/201G02B5/28
    • A color filter substrate includes a transparent substrate, a first and second reflective layers, a spacer layer, and an interference layer. The spacer layer is interposed between the two reflective layers and includes a plurality of first, second and third regions that are distinguished from one another according to their respective thicknesses, where the first, second and third regions overlap red, green and blue pixel portions, respectively. An interference layer is formed on the second reflective layer at positions overlapping the red pixel portions.
    • 滤色器基板包括透明基板,第一和第二反射层,间隔层和干涉层。 间隔层插入在两个反射层之间,并且包括根据其相应厚度彼此区分的多个第一,第二和第三区域,其中第一,第二和第三区域与红色,绿色和蓝色像素部分重叠, 分别。 在与红色像素部分重叠的位置处,在第二反射层上形成干涉层。
    • 4. 发明授权
    • Transflective pixel structure and fabricating method thereof
    • 半透射像素结构及其制造方法
    • US07551249B2
    • 2009-06-23
    • US11780697
    • 2007-07-20
    • Chien-Chung KuoChien-Chung ChenChin-Pei HwangChin-Chang Liu
    • Chien-Chung KuoChien-Chung ChenChin-Pei HwangChin-Chang Liu
    • G02F1/1343
    • G02F1/133555G02F1/133345
    • A transflective pixel structure suitable for being disposed on a substrate is provided. The transflective pixel structure includes a gate, a gate insulator, a channel layer, a transflective conductive layer, a passivation layer, and a second transflective film. The gate is disposed on the substrate and the gate insulator is disposed on the substrate to cover the gate. The channel layer is disposed on the gate insulator and located above the gate. The transflective conductive layer is disposed on part of the channel layer and part of the gate insulator. The passivation layer is disposed on the transflective conductive layer and part of the channel layer, and the second transflective film is disposed on part of the passivation layer. The transflective conductive layer includes a source, a drain, and a first transflective film connected to the drain. Besides, the second transflective film is located above the first transflective film.
    • 提供了适合于设置在基板上的透反射像素结构。 透反射像素结构包括栅极,栅极绝缘体,沟道层,透反射导电层,钝化层和第二透反射膜。 栅极设置在基板上,并且栅极绝缘体设置在基板上以覆盖栅极。 沟道层设置在栅极绝缘体上并位于栅极上方。 透反射导电层设置在沟道层的一部分和栅极绝缘体的一部分上。 钝化层设置在透反射导电层和沟道层的一部分上,第二透反射膜设置在钝化层的一部分上。 透反射导电层包括源极,漏极和连接到漏极的第一透反射膜。 此外,第二透反射膜位于第一透反射膜的上方。
    • 6. 发明申请
    • TRANSFLECTIVE PIXEL STRUCTURE AND FABRICATING METHOD THEREOF
    • 转移像素结构及其制作方法
    • US20090021676A1
    • 2009-01-22
    • US11780697
    • 2007-07-20
    • Chien-Chung KuoChien-Chung ChenChin-Pei HwangChin-Chang Liu
    • Chien-Chung KuoChien-Chung ChenChin-Pei HwangChin-Chang Liu
    • G02F1/1335
    • G02F1/133555G02F1/133345
    • A transflective pixel structure suitable for being disposed on a substrate is provided. The transflective pixel structure includes a gate, a gate insulator, a channel layer, a transflective conductive layer, a passivation layer, and a second transflective film. The gate is disposed on the substrate and the gate insulator is disposed on the substrate to cover the gate. The channel layer is disposed on the gate insulator and located above the gate. The transflective conductive layer is disposed on part of the channel layer and part of the gate insulator. The passivation layer is disposed on the transflective conductive layer and part of the channel layer, and the second transflective film is disposed on part of the passivation layer. The transflective conductive layer includes a source, a drain, and a first transflective film connected to the drain. Besides, the second transflective film is located above the first transflective film.
    • 提供了适合于设置在基板上的透反射像素结构。 透反射像素结构包括栅极,栅极绝缘体,沟道层,透反射导电层,钝化层和第二透反射膜。 栅极设置在基板上,并且栅极绝缘体设置在基板上以覆盖栅极。 沟道层设置在栅极绝缘体上并位于栅极上方。 透反射导电层设置在沟道层的一部分和栅极绝缘体的一部分上。 钝化层设置在透反射导电层和沟道层的一部分上,第二透反射膜设置在钝化层的一部分上。 透反射导电层包括源极,漏极和连接到漏极的第一透反射膜。 此外,第二透反射膜位于第一透反射膜的上方。
    • 9. 发明申请
    • Novel Condition Before TMAH Improved Device Performance
    • TMAH改进设备性能之前的新条件
    • US20130207218A1
    • 2013-08-15
    • US13396870
    • 2012-02-15
    • En-Ting LeeKun-El ChenYu-Sheng WangChien-Chung ChenHuai-Tei Yang
    • En-Ting LeeKun-El ChenYu-Sheng WangChien-Chung ChenHuai-Tei Yang
    • H01L31/02
    • H01L31/0352H01L21/26513H01L27/1446H01L27/1464H01L27/14643H01L27/14687
    • The present disclosure relates to a method of forming a back-side illuminated CMOS image sensor (BSI CIS). In some embodiments, the method comprises forming a plurality of photodetectors within a front-side of a semiconductor substrate. An implant is performed on the back-side of the semiconductor substrate to form an implantation region having a doping concentration that is greater in the center than at the edges of the semiconductor substrate. The back-side of the workpiece is then exposed to an etchant, having an etch rate that is inversely proportional to the doping concentration, which thins the semiconductor substrate to a thickness that allows for light to pass through the back-side of the substrate to the plurality of photodetectors. By implanting the substrate prior to etching, the etching rate is made uniform over the back- side of the substrate improving total thickness variation between the photodetectors and the back-side of the substrate.
    • 本公开涉及形成背面照明CMOS图像传感器(BSI CIS)的方法。 在一些实施例中,该方法包括在半导体衬底的正面内形成多个光电探测器。 在半导体衬底的背面进行注入,以形成掺杂浓度在中心比在半导体衬底的边缘处大的掺杂浓度。 然后将工件的背面暴露于蚀刻剂,其蚀刻速率与掺杂浓度成反比,该掺杂浓度将半导体衬底沉积到允许光通过衬底的背面的厚度到 多个光检测器。 通过在蚀刻之前植入基板,使蚀刻速率在基板的背面上均匀,从而提高光电检测器与基板的背面之间的总厚度变化。
    • 10. 发明授权
    • Sub-micron adjustable mount for supporting a component and method
    • 用于支撑元件和方法的亚微米可调支架
    • US08243375B2
    • 2012-08-14
    • US12689188
    • 2010-01-18
    • Nathan G. WoodardEric C. JohnsonJon F. NielsenJoseph R. DemersChien-Chung Chen
    • Nathan G. WoodardEric C. JohnsonJon F. NielsenJoseph R. DemersChien-Chung Chen
    • G02B7/02
    • G02B7/00
    • An optical assembly includes a light path and at least one optic to be positioned in the path. A support arrangement supports the optic having a foot arrangement including at least one foot that receives a direct manipulation with the foot slidingly engaged against a support surface to move the optic relative to the light path. Movement of the foot may move the optic along a predetermined path. The foot defines a footprint for engaging the support surface and receives the direct manipulation in a way which changes the footprint on the support surface to move the optic responsive to changes in the footprint. A movement arrangement may selectively bias the foot against the support surface during a movement mode, intended to permit movement of the foot against the support surface, and in a locked mode, intended to lock the foot against the support surface.
    • 光学组件包括光路和要定位在路径中的至少一个光学元件。 支撑装置支撑光学元件,其具有足部布置,其包括至少一个脚,其接收直接操纵,脚与滑​​动地抵靠支撑表面接合以相对于光路移动光学元件。 脚的运动可以沿着预定的路径移动光学元件。 脚定义了用于接合支撑表面的足迹,并且以一种方式接收直接操纵,其改变了支撑表面上的占地面积,以响应于占地面积的变化来移动光学器件。 移动装置可以在移动模式期间选择性地将脚抵靠支撑表面偏置,以允许脚抵靠支撑表面移动,并且处于锁定模式,以将脚锁定在支撑表面上。