专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07626208B2 Bendable solid state planar light source structure 有权
标题翻译：可弯曲固态平面光源结构
公开(公告)号：US07626208B2
公开(公告)日：2009-12-01
申请号：US11309200
申请日：2006-07-13
申请人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
发明人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
IPC分类号： H01L33/00
CPC分类号： H05K1/0203 , F21K9/00 , F21V33/0008 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H05K1/189 , H05K2201/09318 , H05K2201/09481 , H05K2201/10106 , H05K2201/10553 , H05K2203/049 , H01L2924/00
摘要： A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.
摘要翻译：提供了一种可弯曲的LED平面光源结构，因此可挠性基板及其制造方法。柔性基板的两侧具有金属层，其一侧的金属层具有电路布局，另一侧的金属层具有具有反射和散射特性的图案结构或整体金属涂层。同时，在具有电路布局的金属层的相同侧或相对侧上设置接合焊盘，并且通过引线接合或倒装芯片接合将LED管芯阵列与接合焊盘接合，使得LED管芯与电流通过柔性基板上的电路布局，以形成平面光源。

2. 发明授权

US07871836B2 Method of manufacturing bendable solid state lighting 有权
标题翻译：制造可弯曲固态照明的方法
公开(公告)号：US07871836B2
公开(公告)日：2011-01-18
申请号：US12546715
申请日：2009-08-25
申请人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
发明人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
IPC分类号： H01L21/00
CPC分类号： H05K1/0203 , F21K9/00 , F21V33/0008 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H05K1/189 , H05K2201/09318 , H05K2201/09481 , H05K2201/10106 , H05K2201/10553 , H05K2203/049 , H01L2924/00
摘要： The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.
摘要翻译：本发明提供一种制造可弯曲固态照明（SSL）的方法。首先在柔性基板的两侧分别沉积具有预定电路布局图案和结构区域图案的第一金属层和第二金属层，其中在结构区域图案中的结构区域上形成多个接合焊盘，并且是用于电连接到第一金属层。多个LED管芯设置在阵列的结构区域上，并且LED管芯与对应的接合焊盘接合，使得LED管芯通过柔性基板上的第一金属层的电路布局传导，以形成平面光源。

3. 发明申请

US20090311810A1 METHOD OF MANUFACTURING BENDABLE SOLID STATE LIGHTING 有权
标题翻译：制造可弯曲固态照明的方法
公开(公告)号：US20090311810A1
公开(公告)日：2009-12-17
申请号：US12546715
申请日：2009-08-25
申请人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
发明人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
IPC分类号： H01L33/00 , H01L21/77
CPC分类号： H05K1/0203 , F21K9/00 , F21V33/0008 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H05K1/189 , H05K2201/09318 , H05K2201/09481 , H05K2201/10106 , H05K2201/10553 , H05K2203/049 , H01L2924/00
摘要： The invention provides a method of manufacturing a bendable solid state lighting (SSL). A first metal layer and a second metal layer with a predetermined circuit layout pattern and structure region pattern are first deposited on both sides of a flexible substrate respectively, where a plurality of bonding pads is formed on the structure regions in the structure region pattern and is used for being electrically connected to the first metal layer. A plurality of LED dies is arranged on the structure regions in an array, and the LED dies are bonded with the corresponding bonding pads, such that the LED dies are conducted with current via the circuit layout of the first metal layer on the flexible substrate, so as to form a planar light source.
摘要翻译：本发明提供一种制造可弯曲固态照明（SSL）的方法。首先在柔性基板的两侧分别沉积具有预定电路布局图案和结构区域图案的第一金属层和第二金属层，其中在结构区域图案中的结构区域上形成多个接合焊盘，并且是用于电连接到第一金属层。多个LED管芯设置在阵列的结构区域上，并且LED管芯与对应的接合焊盘接合，使得LED管芯通过柔性基板上的第一金属层的电路布局传导，以形成平面光源。

4. 发明申请

US20070217200A1 BENDABLE SOLID STATE PLANAR LIGHT SOURCE STRUCTURE, FLEXIBLE SUBSTRATE THEREFOR, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：可弯曲的固态平面光源结构，其柔性基板及其制造方法
公开(公告)号：US20070217200A1
公开(公告)日：2007-09-20
申请号：US11309200
申请日：2006-07-13
申请人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
发明人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
IPC分类号： F21S8/00
CPC分类号： H05K1/0203 , F21K9/00 , F21V33/0008 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H05K1/189 , H05K2201/09318 , H05K2201/09481 , H05K2201/10106 , H05K2201/10553 , H05K2203/049 , H01L2924/00
摘要： A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.
摘要翻译：提供了一种可弯曲的LED平面光源结构，因此可挠性基板及其制造方法。柔性基板的两侧具有金属层，其一侧的金属层具有电路布局，另一侧的金属层具有具有反射和散射特性的图案结构或整体金属涂层。同时，在具有电路布局的金属层的相同侧或相对侧上设置接合焊盘，并且通过引线接合或倒装芯片接合将LED管芯阵列与接合焊盘接合，使得LED管芯与电流通过柔性基板上的电路布局，以形成平面光源。

5. 发明申请

US20060110108A1 Tunable light transceiver module 审中-公开
标题翻译：可调光收发模块
公开(公告)号：US20060110108A1
公开(公告)日：2006-05-25
申请号：US11227609
申请日：2005-09-16
申请人： Tsung-Fu Hsieh , Chien-Cheng Yang , Wen-Jiun Liu , Shau-Yi Chen , Jing-Yao Chang
发明人： Tsung-Fu Hsieh , Chien-Cheng Yang , Wen-Jiun Liu , Shau-Yi Chen , Jing-Yao Chang
IPC分类号： G02B6/36
CPC分类号： H02N1/008 , G02B6/422
摘要： A tunable light transceiver module for adjusting a photoelectric device is provided. The tunable structure includes a photoelectric device, a stage, and a set of two-dimensional actuators having a first direction actuator and a second direction actuator. The photoelectric device is installed on the stage. The first direction actuation device and the second direction actuation device are coupled to the stage for controlling the movement of the stage along the first direction and the second direction, which are parallel to the stage. The tunable module may comprise an additional vertical actuator for controlling the movement of the stage along the direction perpendicular to the stage, thus realizing the displacement adjustment in three dimensions.
摘要翻译：提供了一种用于调节光电装置的可调光收发模块。可调谐结构包括具有第一方向致动器和第二方向致动器的光电器件，载物台和一组二维致动器。光电装置安装在舞台上。第一方向致动装置和第二方向致动装置联接到载物台，用于控制载物台沿与平台平行的第一方向和第二方向的移动。可调谐模块可以包括附加的垂直致动器，用于控制工作台沿垂直于工作台的方向的移动，从而实现三维位移调节。

6. 发明授权

US07973330B2 Substrate-free light emitting diode 有权
标题翻译：无基板发光二极管
公开(公告)号：US07973330B2
公开(公告)日：2011-07-05
申请号：US12510255
申请日：2009-07-27
申请人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
发明人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
IPC分类号： H01L33/00
CPC分类号： H01L33/0079
摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.
摘要翻译：提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

7. 发明申请

US20090283750A1 SUBSTRATE-FREE LIGHT EMITTING DIODE 有权
标题翻译：无基板发光二极管
公开(公告)号：US20090283750A1
公开(公告)日：2009-11-19
申请号：US12510255
申请日：2009-07-27
申请人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
发明人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
IPC分类号： H01L33/00
CPC分类号： H01L33/0079
摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.
摘要翻译：提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

8. 发明授权

US07381995B2 Lighting device with flipped side-structure of LEDs 失效
标题翻译：具有LED翻转侧面结构的照明装置
公开(公告)号：US07381995B2
公开(公告)日：2008-06-03
申请号：US11081319
申请日：2005-03-16
申请人： Ra-Min Tain , Shyi-Ching Liau , Chien-Cheng Yang
发明人： Ra-Min Tain , Shyi-Ching Liau , Chien-Cheng Yang
IPC分类号： H01L31/12
CPC分类号： F21K9/00 , F21Y2107/30 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a lighting device with flipped side-structure of LEDs, which allows emitted lights to travel in parallel with the mounting surface. Single or plural LED chips are mounted on a substrate with their side surfaces facing the substrate surface. The lighting device can be further combined with optical protrusions on the substrate to form a light module for reflecting and mixing lights emitted from the LED chips. It does not require a conventional wire bonding process. The packaging structure also resolves the heat dissipation problem of the LEDs. Electrostatic discharge protection circuits can be included in the light module if desired. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.
摘要翻译：公开了一种具有翻转的LED侧面结构的照明装置，其允许发射的光与安装表面平行地行进。单个或多个LED芯片安装在基板上，其侧表面面向基板表面。照明装置可以进一步与基板上的光学突起组合，以形成用于反射和混合从LED芯片发射的光的光模块。它不需要常规的引线接合工艺。封装结构也解决了LED散热问题。如果需要，静电放电保护电路可以包括在灯模块中。本发明实现了具有所需色度的组合光的均匀性和高强度。

9. 发明申请

US20110182457A1 IN-EAR EARPHONE WITH CAPACITIVE SENSING FUNCTION 审中-公开
标题翻译：具有电容感应功能的耳塞式耳机
公开(公告)号：US20110182457A1
公开(公告)日：2011-07-28
申请号：US12973036
申请日：2010-12-20
申请人： Chiu-Yun Tung , Hui-Yin Liang , Ju-Mei Tsai , Yu-Huan Yen , Chien-Cheng Yang , Ming-Hung Tsai , Shi-Pan Ho
发明人： Chiu-Yun Tung , Hui-Yin Liang , Ju-Mei Tsai , Yu-Huan Yen , Chien-Cheng Yang , Ming-Hung Tsai , Shi-Pan Ho
IPC分类号： H04R1/10
CPC分类号： H04R1/1041 , H04R1/1016
摘要： An in-ear earphone with a capacitive sensing function is provided. The earphone includes a case, a speaker, a circuit board, and a capacitive sensing unit. The case has an extension tube and an accommodating portion. An ear tip is sleeved on the extension tube. The accommodating portion accommodates the speaker, the circuit board, and the capacitive sensing unit. A sound emitting surface of the speaker faces the extension tube. The circuit board is electrically connected to the speaker, and a sensing chip is disposed on the circuit board. The capacitive sensing unit includes a sensor and a conducting element. The sensor is electrically connected to the sensing chip through the conducting element. When the extension tube is inserted into an ear canal of a user, the sensor returns a sensing signal to the sensing chip, and the sensing chip sends a control signal to control sound output of the speaker.
摘要翻译：提供具有电容感应功能的入耳式耳机。耳机包括外壳，扬声器，电路板和电容感测单元。壳体具有延伸管和容纳部分。耳尖套在延长管上。容纳部分容纳扬声器，电路板和电容感测单元。扬声器的发声表面面向延伸管。电路板电连接到扬声器，并且感测芯片设置在电路板上。电容感测单元包括传感器和导电元件。传感器通过导电元件与传感芯片电连接。当延长管插入用户的耳道时，传感器将感测信号返回到感测芯片，感测芯片发送控制信号以控制扬声器的声音输出。

10. 发明授权

US07682855B2 Fabrication method of substrate-free light emitting diode 失效
标题翻译：无基板发光二极管的制造方法
公开(公告)号：US07682855B2
公开(公告)日：2010-03-23
申请号：US11461436
申请日：2006-07-31
申请人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
发明人： Chien-Cheng Yang , Zhi-Cheng Hsiao , Gen-Wen Hsieh
IPC分类号： H01L21/00
CPC分类号： H01L33/0079
摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.
摘要翻译：提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式