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    • 1. 发明授权
    • Ultrasonic sensor device
    • 超声波传感器装置
    • US08853919B2
    • 2014-10-07
    • US13555983
    • 2012-07-23
    • Chia-Yu LinTzu-Chin TsaiChiun-Hua ChangShih-Feng Lee
    • Chia-Yu LinTzu-Chin TsaiChiun-Hua ChangShih-Feng Lee
    • B06B1/06
    • B06B1/0644G10K11/004
    • An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.
    • 超声波传感器装置包括壳体,设置在壳体处的电路板和换能器。 换能器包括具有底壁和周围壁的导电外壳。 压电构件设置在底壁的顶部。 第一连接销组设置在壳体中,并且包括第一连接销,其一端连接到电路板,另一端连接到压电元件,第二连接销的一端连接到电路板,另一端 连接到周围的墙壁。 第二连接销组设置在壳体中,其一端连接到电路板,另一端延伸到壳体的连接部分。
    • 2. 发明申请
    • ULTRASONIC SENSOR DEVICE
    • 超声波传感器装置
    • US20130214642A1
    • 2013-08-22
    • US13555983
    • 2012-07-23
    • Chia-Yu LinTzu-Chin TsaiChiun-Hua ChangShih-Feng Lee
    • Chia-Yu LinTzu-Chin TsaiChiun-Hua ChangShih-Feng Lee
    • H01L41/053H01L41/113
    • B06B1/0644G10K11/004
    • An ultrasonic sensor device includes a housing, a circuit board disposed at the housing, and a transducer. The transducer includes an electrically conductive casing having a bottom wall and a surrounding wall. A piezoelectric member is disposed on top of the bottom wall. A first connecting pin set is disposed in the housing, and includes a first connecting pin having one end connected to the circuit board and another end connected to the piezoelectric member, and a second connecting pin having one end connected to the circuit board and another end connected to the surrounding wall. A second connecting pin set is disposed in the housing, has one end connected to the circuit board, and another end extended into a connecting portion of the housing.
    • 超声波传感器装置包括壳体,设置在壳体处的电路板和换能器。 换能器包括具有底壁和周围壁的导电外壳。 压电构件设置在底壁的顶部。 第一连接销组设置在壳体中,并且包括第一连接销,其一端连接到电路板,另一端连接到压电元件,第二连接销的一端连接到电路板,另一端 连接到周围的墙壁。 第二连接销组设置在壳体中,其一端连接到电路板,另一端延伸到壳体的连接部分。
    • 8. 发明申请
    • HEAT DISSIPATING DEVICE
    • 热灭火装置
    • US20130255927A1
    • 2013-10-03
    • US13472509
    • 2012-05-16
    • Chia-Yu LinYen Tsai
    • Chia-Yu LinYen Tsai
    • F28F7/00
    • F28D15/0275B22D19/0063F28F3/02F28F2255/143F28F2275/20H01L21/4871H01L21/4882H01L23/3672H01L2924/0002Y10T29/4935H01L2924/00
    • A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.
    • 散热装置包括基座,散热翅片和突出部件。 散热片包括散热部,固定在基座中的固定部以及第一防溢出结构。 第一防溢结构连接在散热部分和固定部分之间。 第一防溢出结构的宽度大于散热部的宽度。 第一孔形成在散热部和第一防溢结构上。 突出构件包括第二防溢结构和从第二防溢结构的上表面突出的第一突出部。 突出部件设置在第一孔中,第二防溢结构的下表面和第一防溢出结构的下表面共面。