专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100027260A1 LIGHT EMITTING DIODE LAMP 审中-公开
标题翻译：发光二极管灯
公开(公告)号：US20100027260A1
公开(公告)日：2010-02-04
申请号：US12182137
申请日：2008-07-30
申请人： Chia-Chi Liu
发明人： Chia-Chi Liu
IPC分类号： F21V29/00 , F21V21/00
CPC分类号： F21V29/81 , F21K9/00 , F21V29/717 , F21V29/80 , F21V29/89 , F21Y2103/10 , F21Y2115/10
摘要： A light emitting diode lamp including a housing having at least one hole, a light bar, a heat dissipation device, and a shade is provided. The light bar is disposed inside the housing, and has a circuit substrate and a plurality of LEDs disposed thereon. The heat dissipation device includes a heat conducting pipe and a heat sink, where the heat conducting pipe is connected to the circuit substrate, and extends to the outside of the housing through the hole. The heat sink is disposed on the portion of the heat conducting pipe exposed outside the housing. The shade is disposed on the housing, and shades the heat dissipation device.
摘要翻译：提供一种发光二极管灯，其包括具有至少一个孔的壳体，光条，散热装置和阴影。灯条设置在壳体内部，并且具有电路基板和设置在其上的多个LED。散热装置包括导热管和散热器，其中导热管连接到电路基板，并且通过孔延伸到壳体的外部。散热器布置在暴露在壳体外部的导热管的部分上。遮光罩设置在外壳上，遮蔽散热装置。

2. 发明申请

US20090008671A1 LED packaging structure with aluminum board and an LED lamp with said LED packaging structure 审中-公开
标题翻译： LED封装结构采用铝板和LED灯具，具有LED封装结构
公开(公告)号：US20090008671A1
公开(公告)日：2009-01-08
申请号：US11892768
申请日：2007-08-27
申请人： Chia-Chi Liu , Wen-Kuei Tsai
发明人： Chia-Chi Liu , Wen-Kuei Tsai
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/62 , H01L33/641 , H01L2924/0002 , H01L2924/00
摘要： An LED lamp is provided. The LED lamp has an aluminum board, a buffer substrate, at least a LED chip, a metal layer structure, and heat sink. The aluminum board has a cup structure thereon. The buffer substrate is assembled on a bottom surface of the cup structure. The LED chips are assembled on the buffer substrate. The metal layer structure is formed on a bottom surface of the aluminum board. The metal layer structure is composed of solderable materials. The heat sink is connected to the metal layer structure through solder joint.
摘要翻译：提供LED灯。 LED灯具有铝板，缓冲基板，至少LED芯片，金属层结构和散热器。铝板上有杯结构。缓冲基板组装在杯结构的底面上。 LED芯片组装在缓冲基板上。金属层结构形成在铝板的底面上。金属层结构由可焊接材料构成。散热器通过焊点连接到金属层结构。

3. 发明授权

US07264381B2 Light emitting diode assembly using alternating current as the power source 失效
标题翻译：发光二极管组件采用交流电作为电源
公开(公告)号：US07264381B2
公开(公告)日：2007-09-04
申请号：US11271786
申请日：2005-11-14
申请人： Chia-Chi Liu , Chih-Sheng Chan
发明人： Chia-Chi Liu , Chih-Sheng Chan
IPC分类号： F21V17/00 , H01L27/15
CPC分类号： H01L25/0753 , H01L2224/48091 , H01L2224/49107 , H01L2224/8592 , H01L2924/0002 , H05B33/0821 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： An LED assembly includes a first LED unit and a second LED unit, the latter is coupled electrically to the first LED unit in such a manner that each of the first and second LED units defines a current-flow direction in reverse order so that once Alternating Current is applied, the first and second LED units are illuminated alternately by virtue of the positive and negative voltages of the Alternating Current.
摘要翻译： LED组件包括第一LED单元和第二LED单元，后者以这样的方式电耦合到第一LED单元，使得第一和第二LED单元中的每一个以相反的顺序限定电流流动方向，使得一旦交替通过施加电流，第一和第二LED单元由于交流电的正负电压交替照明。

4. 发明授权

US08633639B2 Multichip package structure and light bulb of using the same 失效
标题翻译： Multichip封装结构和灯泡使用相同
公开(公告)号：US08633639B2
公开(公告)日：2014-01-21
申请号：US13344503
申请日：2012-01-05
申请人： Ding-Bo Lin , Chin-Wei Hsieh , Yen-Fen Chen , Shih-Min Wu , Chia-Chi Liu
发明人： Ding-Bo Lin , Chin-Wei Hsieh , Yen-Fen Chen , Shih-Min Wu , Chia-Chi Liu
IPC分类号： H01J1/02
CPC分类号： F21K9/232 , F21V3/00 , F21V29/74 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/00 , H01L2924/00014
摘要： A light bulb includes a base unit, an electrical connecting unit, a light-emitting unit, and a lamp cover unit. The base unit includes a base body connected with the electrical connecting unit. The light-emitting unit includes a substrate body disposed on the base body, a plurality of blue and red light emitting groups disposed on the substrate body and electrically connected with the substrate body, and a phosphor resin body formed on the substrate body to cover the blue and red light emitting groups. Each blue light emitting group includes a plurality of blue light emitting elements electrically connected with each other in series, and each red light emitting group includes a plurality of red light emitting elements electrically connected with each other in series. The lamp cover unit includes a light-permitting cover disposed on the top side of the base body to cover the light-emitting unit.
摘要翻译：灯泡包括基座单元，电连接单元，发光单元和灯罩单元。基座单元包括与电连接单元连接的基体。所述发光单元包括设置在所述基体上的基板主体，设置在所述基板主体上并与所述基板主体电连接的多个蓝色和红色发光组，以及形成在所述基板主体上以覆盖所述基板主体的荧光体树脂体蓝色和红色发光组。每个蓝色发光组包括彼此串联电连接的多个蓝色发光元件，并且每个红色发光组包括串联电连接的多个红色发光元件。灯罩单元包括设置在基体的顶侧以覆盖发光单元的允许光的盖。

5. 发明申请

US20090046473A1 LIGHT-EMITTING DIODE LAMP 有权
标题翻译：发光二极管灯
公开(公告)号：US20090046473A1
公开(公告)日：2009-02-19
申请号：US11876778
申请日：2007-10-23
申请人： Wen-Kuei Tsai , Chia-Chi Liu , Chun-Chien Wang , Ching-Hua Wu
发明人： Wen-Kuei Tsai , Chia-Chi Liu , Chun-Chien Wang , Ching-Hua Wu
IPC分类号： F21V29/02
CPC分类号： F21V29/004 , F21K9/232 , F21V29/67 , F21V29/677 , F21V29/773 , F21V29/83 , F21W2111/00 , F21Y2115/10 , H04M1/22 , Y10S362/80
摘要： An LED lamp including a lamp housing, an LED light source, a heat sink and a control circuit. The lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, wherein the accommodating space joins an environment through the air inlets and the air outlets. The LED light source and the heat sink are disposed in the accommodating space and the heat sink is connected with the LED light source. The heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. An air convection channel is located between any two adjacent heat dissipation fins. Air from the environment flows into the accommodating space, passes through the air convection channel, and leaves the accommodating space via the air outlets sequentially. The control circuit is disposed in the accommodating space and connected to the LED light source.
摘要翻译：一种LED灯，包括灯壳，LED光源，散热器和控制电路。灯壳具有容纳空间，多个空气入口和多个空气出口，其中容纳空间通过空气入口和空气出口连接环境。 LED光源和散热器设置在容纳空间中，散热器与LED光源连接。散热器包括基座和连接到基座的多个散热片。空气对流通道位于任何两个相邻散热片之间。来自环境的空气流入容纳空间，通过空气对流通道，经由空气出口依次离开容纳空间。控制电路设置在容纳空间中并连接到LED光源。

6. 发明申请

US20090032826A1 MULTI-CHIP LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：多芯片发光二极管封装
公开(公告)号：US20090032826A1
公开(公告)日：2009-02-05
申请号：US12183952
申请日：2008-07-31
申请人： Jerry Hu , Pao-Chi Chi , Albert Lin , Chia-Chi Liu
发明人： Jerry Hu , Pao-Chi Chi , Albert Lin , Chia-Chi Liu
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L33/62 , H01L2224/48091 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： A multi-chip light emitting diode (LED) package having a plurality of LED chips, a substrate, and a plurality of conductive paste layers is provided. The substrate has at least two hollow areas with conductive patterns formed on a bottom surface thereon. The conductive paste layers are pasted on the bottom surfaces of the hollow areas respectively for fixing the LED chips and having the LED chips electrically connected to the conductive patterns. The LED chips in the different hollow areas are electrically connected in serial.
摘要翻译：提供了具有多个LED芯片，基板和多个导电浆料层的多芯片发光二极管（LED）封装。衬底具有形成在其上的底表面上的导电图案的至少两个中空区域。导电浆料层分别粘贴在中空区域的底表面上，用于固定LED芯片并将LED芯片电连接到导电图案。不同中空区域的LED芯片串联电连接。

7. 发明授权

US08169255B2 Offset cancellation current mirror and operating method thereof 有权
标题翻译：偏移消除电流镜及其操作方法
公开(公告)号：US08169255B2
公开(公告)日：2012-05-01
申请号：US12873291
申请日：2010-08-31
申请人： Meng-Fan Chang , Shin-Jang Shen , Chia-Chi Liu
发明人： Meng-Fan Chang , Shin-Jang Shen , Chia-Chi Liu
IPC分类号： G05F1/10
CPC分类号： G05F3/262
摘要： The present invention discloses an offset cancellation current mirror and method thereof. The offset cancellation current minor comprises a first current mirror, a second current minor, switches and resistors. The first current minor comprises two transistors and a capacitance, the capacitance is used to store an electrical potential difference when the switches are turned on in ways of connecting the first current mirror with the resistor. When the switches is turned off in ways of disconnecting the first current mirror with the resistor and connecting the first current mirror with the second current minor, the electrical potential difference stored in the capacitance is used to correct the difference of the two transistors due to manufacture process.
摘要翻译：本发明公开了一种偏移消除电流镜及其方法。偏移消除电流次要包括第一电流镜，第二电流次级，开关和电阻。第一个当前次要器件包括两个晶体管和一个电容，当开关接通时，电容被用于存储电位差，以将第一电流镜与电阻器连接起来。当开关以与电阻器断开第一电流镜并且将第一电流镜与第二电流次级连接的方式断开时，存储在电容中的电位差用于校正由于制造而导致的两个晶体管的差异处理。

8. 发明申请

US20120049921A1 Offset Cancellation Current Mirror and Operating Method Thereof 有权
标题翻译：偏移消除电流镜及其操作方法
公开(公告)号：US20120049921A1
公开(公告)日：2012-03-01
申请号：US12873291
申请日：2010-08-31
申请人： Meng-Fan Chang , Shin-Jang Shen , Chia-Chi Liu
发明人： Meng-Fan Chang , Shin-Jang Shen , Chia-Chi Liu
IPC分类号： H03L5/00
CPC分类号： G05F3/262
摘要： The present invention discloses an offset cancellation current mirror and method thereof. The offset cancellation current minor comprises a first current mirror, a second current minor, switches and resistors. The first current minor comprises two transistors and a capacitance, the capacitance is used to store an electrical potential difference when the switches are turned on in ways of connecting the first current mirror with the resistor. When the switches is turned off in ways of disconnecting the first current mirror with the resistor and connecting the first current mirror with the second current minor, the electrical potential difference stored in the capacitance is used to correct the difference of the two transistors due to manufacture process.
摘要翻译：本发明公开了一种偏移消除电流镜及其方法。偏移消除电流次要包括第一电流镜，第二电流次级，开关和电阻。第一个当前次要器件包括两个晶体管和一个电容，当开关接通时，电容被用于存储电位差，以将第一电流镜与电阻器连接起来。当开关以与电阻器断开第一电流镜并且将第一电流镜与第二电流次级连接的方式断开时，存储在电容中的电位差用于校正由于制造而导致的两个晶体管的差异处理。

9. 发明授权

US07874710B2 Light-emitting diode lamp 有权
标题翻译：发光二极管灯
公开(公告)号：US07874710B2
公开(公告)日：2011-01-25
申请号：US11876778
申请日：2007-10-23
申请人： Wen-Kuei Tsai , Chia-Chi Liu , Chun-Chien Wang , Ching-Hua Wu
发明人： Wen-Kuei Tsai , Chia-Chi Liu , Chun-Chien Wang , Ching-Hua Wu
IPC分类号： F21V29/02
CPC分类号： F21V29/004 , F21K9/232 , F21V29/67 , F21V29/677 , F21V29/773 , F21V29/83 , F21W2111/00 , F21Y2115/10 , H04M1/22 , Y10S362/80
摘要： An LED lamp including a lamp housing, an LED light source, a heat sink and a control circuit. The lamp housing has an accommodating space, a plurality of air inlets and a plurality of air outlets, wherein the accommodating space joins an environment through the air inlets and the air outlets. The LED light source and the heat sink are disposed in the accommodating space and the heat sink is connected with the LED light source. The heat sink includes a pedestal and a plurality of heat dissipation fins connected to the pedestal. An air convection channel is located between any two adjacent heat dissipation fins. Air from the environment flows into the accommodating space, passes through the air convection channel, and leaves the accommodating space via the air outlets sequentially. The control circuit is disposed in the accommodating space and connected to the LED light source.
摘要翻译：一种LED灯，包括灯壳，LED光源，散热器和控制电路。灯壳具有容纳空间，多个空气入口和多个空气出口，其中容纳空间通过空气入口和空气出口连接环境。 LED光源和散热器设置在容纳空间中，散热器与LED光源连接。散热器包括基座和连接到基座的多个散热片。空气对流通道位于任何两个相邻散热片之间。来自环境的空气流入容纳空间，通过空气对流通道，经由空气出口依次离开容纳空间。控制电路设置在容纳空间中并连接到LED光源。

10. 发明申请

US20100025699A1 LIGHT EMITTING DIODE CHIP PACKAGE 审中-公开
标题翻译：发光二极管芯片包装
公开(公告)号：US20100025699A1
公开(公告)日：2010-02-04
申请号：US12182151
申请日：2008-07-30
申请人： Chia-Chi Liu , Chih-Chieh Hu , Yu-Tsung Tsai , Pao-Chi Chi , Chi-Ju Shen
发明人： Chia-Chi Liu , Chih-Chieh Hu , Yu-Tsung Tsai , Pao-Chi Chi , Chi-Ju Shen
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode (LED) chip package is provided. The LED chip package comprises a carrier, a first LED chip, a second LED chip and an encapsulant. The first LED chip is disposed on and electrically connected to the carrier, wherein the first LED chip is adapted for emitting a first light. The second LED chip is disposed on and electrically connected to the carrier, wherein the second LED chip is adapted for emitting a second light. The encapsulant has a doped phosphor, and encapsulates the first LED chip and the second LED chip, wherein the first light is adapted for exciting the doped phosphor to emit a third light.
摘要翻译：提供了一种发光二极管（LED）芯片封装。 LED芯片封装包括载体，第一LED芯片，第二LED芯片和密封剂。第一LED芯片设置在载体上并与其电连接，其中第一LED芯片适于发射第一光。第二LED芯片设置在载体上并与其电连接，其中第二LED芯片适于发射第二个光。密封剂具有掺杂的磷光体，并且封装第一LED芯片和第二LED芯片，其中第一光适于激发掺杂的磷光体以发射第三光。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式