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    • 2. 发明授权
    • IC card with display panel but without batteries
    • IC卡带显示面板,但没有电池
    • US07156313B2
    • 2007-01-02
    • US10928164
    • 2004-08-30
    • Chi-Yuan OuLee-Chung Lin
    • Chi-Yuan OuLee-Chung Lin
    • G06K19/06
    • G06K19/07703G06K19/07G06K19/0701G06K19/0723
    • An IC card with a display panel but without batteries includes a contact/contactless communication interface, a microprocessor, an EEPROM, a rectifier/voltage regulator, a display driver, a charge-pump (26) disposed therein, and a display panel disposed thereon. The microprocessor receives the external data, and displays the data on the display panel so that users can look up the external data. The display panel exhibits a double steady-state function having the characteristic that once the data are displayed, no persistent power supply for the display panel is needed, and thus the displayed data will be preserved persistently until the next time the data are updated. In this way, users are not required to use batteries and can avoid being disturbed by the service life of the batteries.
    • 具有显示面板但不具有电池的IC卡包括接触/非接触通信接口,微处理器,EEPROM,整流器/电压调节器,显示驱动器,设置在其中的电荷泵(26)和布置在其上的显示面板 。 微处理器接收外部数据,并在显示面板上显示数据,以便用户可以查找外部数据。 显示面板具有双稳态功能,其特征在于,一旦显示数据,则不需要用于显示面板的持续电源,因此显示的数据将被持续保留,直到下次更新数据为止。 以这种方式,用户不需要使用电池,并且可以避免因电池的使用寿命而受到干扰。
    • 3. 发明申请
    • FABRICATING METHOD FOR ELECTRONIC CARD
    • 电子卡制作方法
    • US20130118681A1
    • 2013-05-16
    • US13297781
    • 2011-11-16
    • Lee-Chung LinChi-Yuan Ou
    • Lee-Chung LinChi-Yuan Ou
    • B32B38/10B32B37/14
    • B42D25/47B32B37/02B32B37/12B32B37/142B32B38/0004B32B2327/06B32B2367/00B32B2425/00B42D25/00B42D25/46B42D25/475B42D2033/46G06K19/07722
    • A fabricating method for electronic card is to interpose an electronic element between an adhesive first outer layer and a non-adhesive detachable pressing plate. The fabricating method comprises following steps. Deposit a first outer layer on a worktable. Embed an electronic element in the first outer layer. Enclose the electronic element by adhesive stuff layer(s). Press foregoing all components via a detachable pressing plate, a quasi-finished laminate is formed with thickness being in preset range. Remove the pressing plate off to form a semi-finished laminate after solidification of the adhesive stuff layer(s). Deposit a second outer layer with a sticky plane over the semi-finished laminate. Apply pressing process on the second outer layer and semi-finished laminate to form a finished laminate due to solidification of the sticky plane on the second outer layer. Finally cut the finished laminate into single electronic cards.
    • 电子卡的制造方法是将电子元件插入到粘合剂第一外层和不粘合的可拆卸的压板之间。 该制造方法包括以下步骤。 在工作台上放置第一个外层。 将电子元件嵌入第一外层。 用胶粘剂层封闭电子元件。 通过可拆卸的压板压制所有部件,形成厚度在预设范围内的准成品层压板。 在粘合剂填料层凝固后,取下压板以形成半成品层压板。 将第二个外层用粘性平面沉积在半成品层压板上。 在第二外层和半成品层压板上施加压制工艺以由于第二外层上的粘性平面固化而形成成品层压板。 最后将完成的层压板切割成单个电子卡。
    • 5. 发明申请
    • Manufacturing process by the use of warm lamination method to adhere to IC card having multi electronic components
    • 制造工艺通过采用暖层压法粘贴到具有多个电子部件的IC卡上
    • US20070068621A1
    • 2007-03-29
    • US11236583
    • 2005-09-28
    • Chi-Yuan OuBing-Je Lee
    • Chi-Yuan OuBing-Je Lee
    • B32B37/12B32B38/04
    • B32B37/185B32B37/12B32B38/04B32B2305/342B32B2425/00B32B2429/00Y10T156/1056Y10T156/1062
    • A manufacturing process of the invention by the use of warm lamination methodto adhere to an IC card having multi electronic componentsis disclosed. The invention mainly intends to prevent the built-in multi electronic components of the IC card from being damaged during the thermal pressing process. In the meantime, the invention can improve yield as well as complete the adhesion of the IC card under the condition having using only the IC card's pressing facility already have that can conform the conditions of the present manufacturing process without affecting the capacity of the production scale. The steps of the manufacturing process are as follows. (I). printing beforehand the upper layer and lower layer of the main body into the required panel in accordance with demands. (II). depending on the requirements, milling hole beforehand for the upper layer of the IC card's main body in accordance with the relative location of the multi electronic components of the built-in IC chip etc. of the central filling layer. (III). applying beforehand coating with glue on the adhesion surface portion between the upper and lower layers of the IC card's main body. (IV). pressing and heating the layers of the IC cards by the use of the plate of the layer pressing machine up to a temperature between 50-80° C. and a pressure between 2-8 mpa (mega pascal) to make the upper, lower, and central layers adhere together. (V). after finishing pressing and adhering, taking the IC card's main body out from the pressing machine, and performing punching and cutting into the required size of IC cards so as to complete the manufacturing of an IC card having multi electronic components.
    • 本发明公开了通过使用暖层压法将本发明的制造方法附着在具有多个电子部件的IC卡上。 本发明主要是为了防止IC卡的内置多电子元件在热压过程中受损。 同时,本发明可以在仅使用IC卡的压制设备的条件下提高产量并完成IC卡的粘附,该设备已经具有可以符合当前制造工艺的条件而不影响生产规模的能力 。 制造过程的步骤如下。 (一世)。 根据要求将主体的上层和下层预先打印到所需的面板中。 (II)。 根据要求,根据中心填充层内置IC芯片等的多个电子部件的相对位置,预先为IC卡主体的上层提供铣削孔。 (三)。 预先在胶片的上层和下层之间的粘合表面部分涂上胶水。 (四)。 通过使用层压机的板压到和加热IC卡的层,达到50-80℃之间的温度和2-8mpa(兆帕)之间的压力,以使上,下, 中心层粘在一起。 (V)。 在完成按压和粘附之后,将IC卡的主体从压制机中取出,并且对所需尺寸的IC卡进行冲压和切割,以便完成具有多个电子部件的IC卡的制造。