会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Integrated electro-optical package
    • 集成电光封装
    • US5703394A
    • 1997-12-30
    • US660829
    • 1996-06-10
    • Chengping WeiSong Q. ShiHsing-Chung Lee
    • Chengping WeiSong Q. ShiHsing-Chung Lee
    • G09F9/33H01L25/16H01L27/32H01L33/00H01L51/50H01L31/0203H01L27/15H01L31/115H01L31/12
    • H01L27/3288H01L25/167H01L51/5243H01L51/5246H01L2224/16225
    • An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.
    • 一种集成的电光学封装,其包括使用印刷电路板直接互连到外部驱动器电路的多个有机发光器件(LED),其中形成有多个电镀通孔通孔和制造集成电光学 包。 有机LED制造在支撑基板上,并且包括垂直互连到安装在印刷电路板(PCB)的最上表面上的驱动器和控制电路。 使用形成在印刷电路板,导电引线和导电环氧树脂中的电镀通孔导电通孔形成垂直互连。 通过将形成在印刷电路板上的密封环定位成与衬底表面上的密封区域密封接触来形成气密密封,从而气密地密封有机发光器件。
    • 2. 发明授权
    • Method of manufacturing an integrated electro-optical package
    • 制造集成电光封装的方法
    • US5747363A
    • 1998-05-05
    • US889724
    • 1997-07-08
    • Chengping WeiSong Q. ShiHsing-Chung Lee
    • Chengping WeiSong Q. ShiHsing-Chung Lee
    • G09F9/33H01L25/16H01L27/32H01L33/00H01L51/50H01L21/20
    • H01L27/3288H01L25/167H01L51/5243H01L51/5246H01L2224/16225
    • An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.
    • 一种集成的电光学封装,其包括使用印刷电路板直接互连到外部驱动器电路的多个有机发光器件(LED),其中形成有多个电镀通孔通孔和制造集成电光学 包。 有机LED制造在支撑基板上,并且包括垂直互连到安装在印刷电路板(PCB)的最上表面上的驱动器和控制电路。 使用形成在印刷电路板,导电引线和导电环氧树脂中的电镀通孔导电通孔形成垂直互连。 通过将形成在印刷电路板上的密封环定位成与衬底表面上的密封区域密封接触来形成气密密封,从而气密地密封有机发光器件。