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    • 1. 发明申请
    • LIQUID COOLING DEVICE
    • 液体冷却装置
    • US20090205810A1
    • 2009-08-20
    • US12033249
    • 2008-02-19
    • Cheng-Feng WANHao-Hui LINSu-Chen HU
    • Cheng-Feng WANHao-Hui LINSu-Chen HU
    • F28F7/02
    • H01L23/473G06F1/20G06F2200/201H01L2924/0002H01L2924/00
    • A liquid cooling device includes a liquid block, a heat-dissipating plate, a thermal-conductive pipe, a pump and a heat sink. The liquid block, the pump, and the heat sink are connected by ducts. The pump drives a coolant to circulate among them. The thermal-conductive pipe is mounted on the heat-dissipating plate. Both ends of the thermal-conductive pipe are connected to the liquid block for the coolant to flow through. The liquid block and the heat sink are respectively mounted on the corresponding electronic devices to absorb heat using the circulating coolant. The heat sink is used to dissipate heat from another heat-generating electronic device. Therefore, one less liquid block is required, and the production cost becomes lower.
    • 液体冷却装置包括液体块,散热板,导热管,泵和散热器。 液体块,泵和散热器通过管道连接。 泵驱动冷却液在它们之间循环。 导热管安装在散热板上。 导热管的两端连接到液体块以使冷却剂流过。 液体块和散热器分别安装在相应的电子设备上以使用循环冷却剂吸收热量。 散热器用于从另一个发热电子设备散发热量。 因此,需要少量的液体块,并且生产成本降低。