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    • 2. 发明申请
    • HEAT SPREADING STRUCTURE
    • 散热结构
    • US20110141698A1
    • 2011-06-16
    • US12730082
    • 2010-03-23
    • Kuo-Chan ChiouChing-Ting HuangChen-Lung Lin
    • Kuo-Chan ChiouChing-Ting HuangChen-Lung Lin
    • H05K7/20
    • H01L23/3737H01L2924/0002H01L2924/00
    • The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtained by reacting epoxy resin, diisocyanate, and amino curing agent. Tuning the ratio of the diisocyanate and the epoxy resin may modify the hardness and the viscosity of the thermal interface material. After repeated tested at high temperature for long period, the described thermal interface layer still remained viscose, soft, and thermally resistant. The filling effect of the thermal interface material in the voids between the electronic device and the sink is largely improved. The thermoplastic thermal interface material may fill the void or cavity on the surface of the electronic apparatus, thereby improving the heat spreading efficiency of the whole structure.
    • 所公开的是设置在发热装置和散热部件之间的热界面层。 热界面层由树脂基体和高导热性粉末的混合物组成,其中树脂基体通过环氧树脂,二异氰酸酯和氨基固化剂反应获得。 调整二异氰酸酯和环氧树脂的比例可以改变热界面材料的硬度和粘度。 经过长时间的高温反复测试后,所述的热界面层仍保持粘胶,柔软和耐热。 热界面材料在电子设备和水槽之间的空隙中的填充效果大大提高。 热塑性热界面材料可以填充电子设备表面上的空隙或空腔,从而提高整个结构的散热效率。