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1. 发明授权

US08633048B2 Method for fabricating package structure having MEMS elements 有权
标题翻译：制造具有MEMS元件的封装结构的方法
公开(公告)号：US08633048B2
公开(公告)日：2014-01-21
申请号：US13314807
申请日：2011-12-08
申请人： Chen-Han Lin , Hong-Da Chang , Cheng-Hsiang Liu , Hsin-Yi Liao , Shih-Kuang Chiu
发明人： Chen-Han Lin , Hong-Da Chang , Cheng-Hsiang Liu , Hsin-Yi Liao , Shih-Kuang Chiu
IPC分类号： H01L21/00
CPC分类号： B81C1/00301 , B81C2203/0154 , H01L2224/48227 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/3025 , H01L2924/00
摘要： A fabrication method of a package structure having MEMS elements includes: disposing a plate on top of a wafer having MEMS elements and second alignment keys; cutting the plate to form therein a plurality of openings exposing the second alignment keys; performing a wire bonding process and disposing block bodies corresponding to the second alignment keys, respectively; forming an encapsulant and partially removing the encapsulant and the block bodies from the top of the encapsulant; and aligning through the second alignment keys so as to form on the encapsulant a plurality of metal traces. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce the fabrication costs. Further, since the plate only covers the MEMS elements and the encapsulant is partially removed, the overall thickness and size of the package structure are reduced.
摘要翻译：具有MEMS元件的封装结构的制造方法包括：将板放置在具有MEMS元件和第二对准键的晶片的顶部上; 切割板以在其中形成暴露第二对准键的多个开口; 执行引线接合处理并分别布置与第二对准键对应的块体; 形成密封剂并从密封剂的顶部部分地去除密封剂和块体; 并且通过第二对准键对齐，以在密封剂上形成多个金属迹线。本发明消除了如现有技术中在硅衬底中形成通孔的需要，从而降低制造成本。此外，由于板仅覆盖MEMS元件并且部分地去除了密封剂，因此减小了封装结构的整体厚度和尺寸。

2. 发明申请

US20120292722A1 PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF 有权
标题翻译：具有MEMS元件的包装结构及其制造方法
公开(公告)号：US20120292722A1
公开(公告)日：2012-11-22
申请号：US13242720
申请日：2011-09-23
申请人： Chen-Han Lin , Hong-Da Chang , Hsin-Yi Liao , Shih-Kuang Chiu
发明人： Chen-Han Lin , Hong-Da Chang , Hsin-Yi Liao , Shih-Kuang Chiu
IPC分类号： H01L29/84 , H01L31/0224 , H01L31/18 , H01L21/78 , H01L31/0203 , H01L21/56
CPC分类号： B81B7/007 , B81B2207/098 , B81C2203/054 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.
摘要翻译：具有MEMS元件的封装结构包括：具有MEMS元件，电触点和第二对准键的晶片; 设置在MEMS元件上并被气密封装的板; 通过粘合剂设置在第二对准键上方的透明体; 设置在晶片上以封装所述板，所述电触点和所述透明体的密封剂; 嵌入密封剂中的接合线，每个具有一端连接相应的一个电触点，另一端从该密封剂的顶表面露出; 以及设置在密封剂上并通过接合线电连接到电触头的金属迹线。本发明消除了如现有技术中在硅衬底中形成通孔的需要，以便降低制造成本。此外，本发明通过使用公共对准装置实现布线处理，从而降低设备成本。

3. 发明授权

US08399940B2 Package structure having MEMS elements and fabrication method thereof 有权
标题翻译：具有MEMS元件的封装结构及其制造方法
公开(公告)号：US08399940B2
公开(公告)日：2013-03-19
申请号：US13242720
申请日：2011-09-23
申请人： Chen-Han Lin , Hong-Da Chang , Hsin-Yi Liao , Shih-Kuang Chiu
发明人： Chen-Han Lin , Hong-Da Chang , Hsin-Yi Liao , Shih-Kuang Chiu
IPC分类号： H01L29/84
CPC分类号： B81B7/007 , B81B2207/098 , B81C2203/054 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs.
摘要翻译：具有MEMS元件的封装结构包括：具有MEMS元件，电触点和第二对准键的晶片; 设置在MEMS元件上并被气密封装的板; 通过粘合剂设置在第二对准键上方的透明体; 设置在晶片上以封装所述板，所述电触点和所述透明体的密封剂; 嵌入密封剂中的接合线，每个具有一端连接相应的一个电触点，另一端从该密封剂的顶表面露出; 以及设置在密封剂上并通过接合线电连接到电触头的金属迹线。本发明消除了如现有技术中在硅衬底中形成通孔的需要，以便降低制造成本。此外，本发明通过使用公共对准装置实现布线处理，从而降低设备成本。

4. 发明申请

US20100206143A1 Machine with Improved Feeding and Clamping Devices 失效
标题翻译：具有改进的进给和夹紧装置的机器
公开(公告)号：US20100206143A1
公开(公告)日：2010-08-19
申请号：US12372784
申请日：2009-02-18
申请人： Chen-Han Lin , Yong-Sheng Chen
发明人： Chen-Han Lin , Yong-Sheng Chen
IPC分类号： B23B13/00
CPC分类号： B23D55/046 , B23D55/04 , Y10T82/2514 , Y10T82/2521
摘要： A feeding device is installed on a machine and is utilized to convey a workpiece to be machined. The feeding device includes first and second feeding apparatus and in conveying the workpiece the workpiece has two lateral sides engaged by the first and second feeding apparatuses respectively. A clamping device is installed on the machine and is utilized to hold the moving workpiece. The clamping device includes first clamping mechanism including first and second clamping apparatuses and a second clamping mechanism including a third clamping apparatus, with the first and second clamping device holding the lateral sides of the workpiece and with the third clamping apparatus holding the top side of the workpiece.
摘要翻译：进料装置安装在机器上，用于输送待加工的工件。进给装置包括第一和第二进给装置，并且在输送工件时，工件具有分别由第一和第二进给装置接合的两个侧面。夹紧装置安装在机器上，用于夹持移动的工件。夹紧装置包括第一夹紧装置和第二夹紧装置，第一夹持装置包括第一夹紧装置和第二夹紧装置，第二夹紧装置包括第三夹紧装置，第一和第二夹紧装置保持工件的侧面，工件。

5. 发明授权

US07882770B2 Machine with improved feeding and clamping devices 失效
标题翻译：机器具有改进的进给和夹紧装置
公开(公告)号：US07882770B2
公开(公告)日：2011-02-08
申请号：US12372784
申请日：2009-02-18
申请人： Chen-Han Lin , Yong-Sheng Chen
发明人： Chen-Han Lin , Yong-Sheng Chen
IPC分类号： B23B13/00 , B23B3/00
CPC分类号： B23D55/046 , B23D55/04 , Y10T82/2514 , Y10T82/2521
摘要： A feeding device is installed on a machine and is utilized to convey a workpiece to be machined. The feeding device includes first and second feeding apparatus and in conveying the workpiece the workpiece has two lateral sides engaged by the first and second feeding apparatuses respectively. A clamping device is installed on the machine and is utilized to hold the moving workpiece. The clamping device includes first clamping mechanism including first and second clamping apparatuses and a second clamping mechanism including a third clamping apparatus, with the first and second clamping device holding the lateral sides of the workpiece and with the third clamping apparatus holding the top side of the workpiece.
摘要翻译：进料装置安装在机器上，用于输送待加工的工件。进给装置包括第一和第二进给装置，并且在输送工件时，工件具有分别由第一和第二进给装置接合的两个侧面。夹紧装置安装在机器上，用于夹持移动的工件。夹紧装置包括第一夹紧装置和第二夹紧装置，第一夹持装置包括第一夹紧装置和第二夹紧装置，第二夹紧装置包括第三夹紧装置，第一和第二夹紧装置保持工件的侧面，工件。

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