专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070210444A1 Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards 有权
标题翻译：促进转移成型的ic包装和注塑塑料之间的粘附的方法，用于创建过模制的存储卡
公开(公告)号：US20070210444A1
公开(公告)日：2007-09-13
申请号：US11373941
申请日：2006-03-13
申请人： Che-Jung Chang , Chin-Tien Chiu , Cheemen Yu , Hem Takiar , Jack Chien , Ning Liu
发明人： Che-Jung Chang , Chin-Tien Chiu , Cheemen Yu , Hem Takiar , Jack Chien , Ning Liu
IPC分类号： H01L23/12
CPC分类号： G06K19/077 , B29C45/14311 , B29C45/14647 , B29C2045/14327 , G06K19/07724 , G06K19/07732 , H01L23/10 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.
摘要翻译：公开了一种闪存卡及其制造方法。卡包括制造成接收单面或双面盖的半导体封装。半导体封装的表面可以形成有孔，沟槽和/或戳记。在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

2. 发明授权

US07615861B2 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards 有权
标题翻译：促进转印成型IC封装和注射成型塑料之间粘合的方法，用于制造过模制记忆卡
公开(公告)号：US07615861B2
公开(公告)日：2009-11-10
申请号：US11373941
申请日：2006-03-13
申请人： Che-Jung Chang , Chin-Tien Chiu , Cheemen Yu , Hem Takiar , Jack Chang Chien , Ning Liu
发明人： Che-Jung Chang , Chin-Tien Chiu , Cheemen Yu , Hem Takiar , Jack Chang Chien , Ning Liu
IPC分类号： H01L23/12
CPC分类号： G06K19/077 , B29C45/14311 , B29C45/14647 , B29C2045/14327 , G06K19/07724 , G06K19/07732 , H01L23/10 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.
摘要翻译：公开了一种闪存卡及其制造方法。卡包括制造成接收单面或双面盖的半导体封装。半导体封装的表面可以形成有孔，沟槽和/或戳记。在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

3. 发明申请

US20100055847A1 METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES AND INJECTION MOLDED PLASTICS FOR CREATING OVER-MOLDED MEMORY CARDS 有权
公开(公告)号：US20100055847A1
公开(公告)日：2010-03-04
申请号：US12614960
申请日：2009-11-09
申请人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
发明人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
IPC分类号： H01L21/56
CPC分类号： G06K19/077 , B29C45/14311 , B29C45/14647 , B29C2045/14327 , G06K19/07724 , G06K19/07732 , H01L23/10 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

4. 发明申请

US20100052155A1 METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES AND INJECTION MOLDED PLASTICS FOR CREATING OVER-MOLDED MEMORY CARDS 有权
标题翻译：促进转移成型IC封装与注塑成型塑料之间粘合的方法，用于创建过模塑记忆卡
公开(公告)号：US20100052155A1
公开(公告)日：2010-03-04
申请号：US12614945
申请日：2009-11-09
申请人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
发明人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
IPC分类号： H01L23/04
CPC分类号： G06K19/077 , B29C45/14311 , B29C45/14647 , B29C2045/14327 , G06K19/07724 , G06K19/07732 , H01L23/10 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.
摘要翻译：公开了一种闪存卡及其制造方法。卡包括制造成接收单面或双面盖的半导体封装。半导体封装的表面可以形成有孔，沟槽和/或戳记。在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

5. 发明授权

US08232145B2 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards 有权
标题翻译：促进转印成型IC封装和注射成型塑料之间粘合的方法，用于制造过模制记忆卡
公开(公告)号：US08232145B2
公开(公告)日：2012-07-31
申请号：US12614960
申请日：2009-11-09
申请人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
发明人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
IPC分类号： H01L21/00
CPC分类号： G06K19/077 , B29C45/14311 , B29C45/14647 , B29C2045/14327 , G06K19/07724 , G06K19/07732 , H01L23/10 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.
摘要翻译：公开了一种闪存卡及其制造方法。卡包括制造成接收单面或双面盖的半导体封装。半导体封装的表面可以形成有孔，沟槽和/或戳记。在形成孔，沟和/或标记之后，可以在注射成型工艺中将盖子附接到包装表面。在注射成型过程中，熔融的塑料流入与半导体封装的表面互连的孔，沟槽和/或戳痕。因此，当熔融塑料硬化时，孔，沟槽和/或戳痕确保盖保持牢固地附接到半导体封装。

6. 发明授权

US08482139B2 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards 有权
公开(公告)号：US08482139B2
公开(公告)日：2013-07-09
申请号：US12614945
申请日：2009-11-09
申请人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
发明人： Che-Jung Chang , Chin-Tien Chiu , Cheeman Yu , Hem Takiar , Jack Chang Chien , Ning Liu
IPC分类号： H01L23/29
CPC分类号： G06K19/077 , B29C45/14311 , B29C45/14647 , B29C2045/14327 , G06K19/07724 , G06K19/07732 , H01L23/10 , H01L23/544 , H01L24/48 , H01L24/97 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

7. 发明申请

US20160140254A1 IDENTIFYING AND STRUCTURING RELATED DATA 审中-公开
标题翻译：识别和结构相关数据
公开(公告)号：US20160140254A1
公开(公告)日：2016-05-19
申请号：US14897824
申请日：2013-06-13
申请人： Jun YAN , Ning LIU , Lei JI , Zheng CHEN , MICROSOFT TECHNOLOGY LICENSING, LLC
发明人： Jun Yan , Ning Liu , Lei Ji , Zheng Chen
IPC分类号： G06F17/30 , G06F3/0484
CPC分类号： G06F17/30991 , G06F3/0484 , G06F17/3053 , G06F17/30864 , G06Q30/0629
摘要： Some examples include displaying a user interface that includes attributes and entities that are determined to be related to an input entity identified by a user. Further, some implementations include displaying a structured data table that identifies attribute values associated with the input entity and selected related entities.
摘要翻译：一些示例包括显示包括被确定为与由用户标识的输入实体相关的属性和实体的用户界面。此外，一些实现方式包括显示结构化数据表，其识别与输入实体和所选相关实体相关联的属性值。

8. 发明授权

US08868598B2 Smart user-centric information aggregation 有权
标题翻译：智能用户为中心的信息聚合
公开(公告)号：US08868598B2
公开(公告)日：2014-10-21
申请号：US13586711
申请日：2012-08-15
申请人： Jianwen Zhang , Zhimin Zhang , Jian-Tao Sun , Jun Yan , Ning Liu , Lei Ji , Weizhu Chen , Zheng Chen
发明人： Jianwen Zhang , Zhimin Zhang , Jian-Tao Sun , Jun Yan , Ning Liu , Lei Ji , Weizhu Chen , Zheng Chen
IPC分类号： G06F7/00 , G06F17/30
CPC分类号： G06F17/30032 , G06F17/30905
摘要： A smart user-centric information aggregation system allows a user to define a region of content displayed in a display of a device and performs information aggregation on behalf of the user. The smart user-centric information aggregation system searches, aggregates and groups information related to content included in the region of content for the user while the user can continue to perform his/her original course of actions without interruption. After finding information related to the desired content, the smart user-centric information aggregation system may notify the user and present the found information to the user upon receiving confirmation from the user. The smart user-centric information aggregation system may continue to find new related information and update the presentation with the newly found information periodically, in some instances without user intervention or input.
摘要翻译：以智能用户为中心的信息聚合系统允许用户定义显示在设备显示器中的内容区域，并代表用户执行信息聚合。智能用户为中心的信息聚合系统在用户可以继续执行他/她的原始行为过程而不间断地搜索，聚合和分组与用户内容区域中包含的内容相关的信息。在找到与期望内容相关的信息之后，智能用户为中心的信息聚合系统可以在接收到来自用户的确认时通知用户并向用户呈现找到的信息。以智能用户为中心的信息聚合系统可以继续寻找新的相关信息，并且在某些情况下，不需要用户干预或输入，定期更新新发现的信息。

9. 发明申请

US20130138655A1 Web Knowledge Extraction for Search Task Simplification 有权
标题翻译： Web知识提取搜索任务简化
公开(公告)号：US20130138655A1
公开(公告)日：2013-05-30
申请号：US13307836
申请日：2011-11-30
申请人： Jun Yan , Lei Ji , Ning Liu , Zheng Chen
发明人： Jun Yan , Lei Ji , Ning Liu , Zheng Chen
IPC分类号： G06F17/30
CPC分类号： G06F17/30702 , G06F17/30867
摘要： Techniques are described for generating structured information from semi-structured web pages, and retrieving the structured knowledge in response to a user query that indicates a query intent. The structured information is automatically extracted offline from semi-structured web pages, through the use of an auto wrapper solution that is noise tolerant, scalable, and automatic. The structured information is stored in a knowledge base, and provided in response to a user search query that indicates a query intent. Extraction of structured information may also include clustering of pages based on their measured similarities. The clusters may be determined based on similar elements in the tag path text data of the pages. A minimum size threshold may be applied to the clusters.
摘要翻译：描述了用于从半结构化网页生成结构化信息的技术，以及响应于指示查询意图的用户查询来检索结构化知识。结构化信息通过使用具有噪声容限，可扩展和自动的自动包装解决方案，从半结构化网页离线自动提取。结构化信息存储在知识库中，并响应于指示查询意图的用户搜索查询而提供。结构化信息的提取还可以包括基于其测量的相似性来聚合页面。可以基于页面的标签路径文本数据中的类似元素来确定簇。可以将最小大小阈值应用于群集。

10. 发明申请

US20130034352A1 COHERENT RECEIVER APPARATUS AND CHROMATIC DISPERSION COMPENSATION METHOD 有权
标题翻译：相关接收装置和色彩补偿补偿方法
公开(公告)号：US20130034352A1
公开(公告)日：2013-02-07
申请号：US13565458
申请日：2012-08-02
申请人： Ning Liu
发明人： Ning Liu
IPC分类号： H04B10/18
CPC分类号： H04B10/25133 , H04B10/6161 , H04B2210/252
摘要： The present disclosure relates to the field of communications, and in particular, to a coherent receiver apparatus and a chromatic dispersion compensation method. The apparatus includes a polarization beam splitter and a chromatic dispersion compensation module. An optical splitter is disposed in front of the polarization beam splitter, and a chromatic dispersion monitoring module is connected between the optical splitter and the chromatic dispersion compensation module. The optical splitter is configured to split a modulated optical signal received by the coherent receiver apparatus and then transmit the split modulated optical signal to the chromatic dispersion monitoring module and the polarization beam splitter. The chromatic dispersion monitoring module is configured to perform chromatic dispersion monitoring on the modulated optical signal to determine a chromatic dispersion range of the modulated optical signal, and enable the chromatic dispersion compensation module to perform chromatic dispersion compensation in the chromatic dispersion range.
摘要翻译：本公开涉及通信领域，特别涉及一种相干接收机装置和色散补偿方法。该装置包括偏振分束器和色散补偿模块。光分路器设置在偏振分束器的前面，并且色散监视模块连接在光分路器和色散补偿模块之间。光分路器被配置为分离由相干接收机设备接收的调制光信号，然后将分离的调制光信号发送到色散监视模块和偏振分束器。色散监视模块被配置为对调制的光信号进行色散监视，以确定调制的光信号的色散范围，并使色散补偿模块能够在色散范围内进行色散补偿。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式